Travis J Taylor

US Patent:

6666755, Dec 23, 2003

Filed:

Jun 26, 2002

Appl. No.:

10/184163

Inventors:

Travis R. Taylor - Fremont CA
Christian DiPietro - Sunnyvale CA
Stephen Jew - Santa Clara CA
Philip Ngoon - San Jose CA
Tony Luong - San Jose CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 100

US Classification:

451 56, 451288, 451285, 451296, 451533

Abstract:

A belt wiper that can be used in a linear belt-type chemical mechanical planarization (CMP) system to maintain a belt pad is provided. The belt wiper mitigates disturbances within a detection region important to a belt pad steering system. Also, the belt wiper mitigates the obscuring of optical components important to operation of an endpoint detection system. Thus, the belt wiper, by wiping the underside of the belt pad will preserve the functionality of both the belt pad steering system and the endpoint detection system.

US Patent:

6712679, Mar 30, 2004

Filed:

Aug 8, 2001

Appl. No.:

09/925254

Inventors:

Travis R. Taylor - Fremont CA
Kevin T. Crofton - San Jose CA
Eugene Yuexing Zhao - San Jose CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 100

US Classification:

451303, 451307, 451285, 451288

Abstract:

An apparatus for improving performance of a wafer polishing apparatus is described. The apparatus includes a platen in a support assembly having a plurality of fluid channels and at least one region of altered topography positioned on a portion of the platen surface.

US Patent:

6752898, Jun 22, 2004

Filed:

Dec 20, 2002

Appl. No.:

10/327565

Inventors:

Robert Charatan - Portland OR
Travis Robert Taylor - Fremont CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 2100

US Classification:

15634512, 451 8, 451 81, 451 66

Abstract:

An invention is provided for a CMP apparatus that enhances removal rate uniformity. The CMP apparatus includes a polishing belt disposed below a carrier head that is capable of applying a wafer to the polishing belt. Also included is a platen disposed below the polishing belt. The platen includes a circular shim section disposed on the top surface of the platen. The circular shim section is higher than the top surface of the platen. When using this configuration, increasing pressure to the backside of the polishing belt decreases the edge removal rate of the wafer. Conversely, decreasing pressure to the backside of the polishing belt increases the edge removal rate of the wafer.

US Patent:

6769970, Aug 3, 2004

Filed:

Jun 28, 2002

Appl. No.:

10/186909

Inventors:

Travis Robert Taylor - Fremont CA
Alan Jensen - White Salmon WA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 100

US Classification:

451 59, 451 41, 451288

Abstract:

A platen is provided for use in a chemical mechanical planarization (CMP) system. The platen includes at least one fluid output zone having a plurality of fluid outlets, the at least one fluid output zone being disposed below a polishing pad and being capable of providing fluid pressure to the polishing pad. The platen also includes at least one fluid input zone having a plurality of fluid inlets, the at least one fluid input zone being disposed below the polishing pad and being capable of removing the fluid pressure. The platen is capable of managing fluid pressure applied to the polishing pad to achieve a particular polishing profile during a CMP operation.

US Patent:

6790128, Sep 14, 2004

Filed:

Mar 29, 2002

Appl. No.:

10/112424

Inventors:

Travis Robert Taylor - Fremont CA

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 100

US Classification:

451 41, 451 54, 451307

Abstract:

A platen is disclosed. The platen includes a support surface for supporting a portion of a linear polishing belt during a chemical mechanical polishing (CMP) operation. The platen also includes a plurality of fluid outlets oriented throughout the support surface. The orientation defines an asymmetric pattern where each of the plurality of fluid outlets is capable of outputting a controlled fluid toward an underside of the linear polishing belt.

US Patent:

6887338, May 3, 2005

Filed:

Jun 28, 2002

Appl. No.:

10/186930

Inventors:

Travis Robert Taylor - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

C23F001/00
H05H001/00

US Classification:

15634512, 1563452

Abstract:

An invention is provided for a chemical mechanical planarization apparatus for processing 300 millimeter wafers. The CMP apparatus includes a polishing belt having a belt tension in a range of about 3000 lbs to 4000 lbs. In addition, a platen is disposed below the polishing belt at a positive platen height. The platen includes at least three air pressure zones, with each air pressure zone being capable of providing air pressure to a backside of the polishing belt. The platen can include, for example, eight air pressure zones. In this aspect, a second air pressure zone adjacent to a first outermost air pressure zone provides an air pressure in a range of about 30 psi to 50 psi, such as about 34 psi. In addition, a third air pressure zone a fourth pressure zone can each provide an air pressure in a range of about 4 psi to 13 psi, such as about 7 psi. In this aspect, the remaining air pressure zones can be set to 0 psi, which conserves fluid consumption.

US Patent:

6991512, Jan 31, 2006

Filed:

Dec 21, 2001

Appl. No.:

10/029958

Inventors:

Travis Robert Taylor - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 7/22

US Classification:

451 5, 451307

Abstract:

An invention is provided for a platen for use in a CMP system. The platen includes an inner set of pressure sub regions capable of providing pressure to a polishing pad disposed above the platen. Each of the inner pressure sub regions is disposed below a wafer and within a circumference of the wafer. In addition, the platen includes an outer set of pressure sub regions capable of providing pressure to a polishing pad. Each of the outer set of pressure sub regions is disposed below the wafer and outside the circumference of the wafer. In this manner, the outer set of pressure sub regions is capable of shaping the polishing pad to achieve a particular removal rate.

US Patent:

7004825, Feb 28, 2006

Filed:

Sep 29, 2003

Appl. No.:

10/674941

Inventors:

Travis R. Taylor - Fremont CA, US
Robert Charatan - Portland OR, US
Robert Anderson - Fremont CA, US

Assignee:

Lam Research Corporation - Fremont CA

International Classification:

B24B 53/00

US Classification:

451 72, 451443

Abstract:

A conditioning apparatus for use in a CMP system is provided along with an associated method of operation. The conditioning apparatus includes rotation mechanics and oscillation mechanics. The rotation mechanics are capable of rotating a shaft which causes a holder and a conditioning substrate to be rotated. The oscillation mechanics are capable of moving a position of the shaft within a region defined by a peripheral boundary that is less than and within an outer periphery of the conditioning substrate. A conditioning substrate backing is also included in the conditioning apparatus. The conditioning substrate backing defines a differential pressure distribution that is capable of being applied to the conditioning substrate.