Ut Thi Tran

US Patent:

6445536, Sep 3, 2002

Filed:

Aug 27, 1998

Appl. No.:

09/140903

Inventors:

Steven C. Rudy - San Jose CA
Hugh C. Hiner - Fremont CA
Lien-Chang Wang - Fremont CA
Yong Shen - New Territory, HK
Ut Tran - San Jose CA
Yunju Ra - Irvine CA
Durga Ravipati - Saratoga CA

Assignee:

Read-Rite Corporation - Fremont CA

International Classification:

G11B 533

US Classification:

360126

Abstract:

A thin film head apparatus and method for forming such a thin film head. In one approach, the present invention recites forming a cavity in a dielectric layer. Next, a layer of high magnetic field saturation (HBsat) material is sputter-deposited over the dielectric layer such that the HBsat material is deposited into the cavity formed in the dielectric layer. The cavity in the dielectric layer functions as a mold or âstencilâ for the HBsat material. The HBsat material deposited into the cavity is used to form the first core of a thin film head. After the formation of the first core of the thin film head, a gap layer of material is deposited above the dielectric layer and above the first core. Next, a layer of HBsat material is sputter-deposited above the gap layer of material and above the first core of the thin film head. The layer of HBsat material disposed above the gap layer of material and above the first core is used to form the second core of the thin film head.

US Patent:

6959134, Oct 25, 2005

Filed:

Jun 30, 2003

Appl. No.:

10/609804

Inventors:

Ut Tran - San Jose CA, US
Hamid Eslampour - San Jose CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G02B006/42

US Classification:

385 52, 385 50, 359811

Abstract:

Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

US Patent:

7027677, Apr 11, 2006

Filed:

May 19, 2004

Appl. No.:

10/848924

Inventors:

Ruolin Li - Santa Clara CA, US
Ut Tran - San Jose CA, US
Xuejun Ying - San Jose CA, US
Jun Liu - San Ramon CA, US
Yi Ding - Milpitas CA, US
Hiroaki Fukuto - Los Altos CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G02B 6/12

US Classification:

385 14, 385130

Abstract:

Optical components may be integrated into planar light circuits. For example, thin film filters may be integrated through trenches in planar light circuits to achieve demultiplexing of at least two multiplexed optical wavelengths. An optical waveguide may be interfaced with a laser or a light detector through a mode converter formed as a trench in the planar light circuit. The mode converter may have a curved surface to achieve mode conversion.

US Patent:

7050682, May 23, 2006

Filed:

Jul 5, 2005

Appl. No.:

11/174940

Inventors:

Ut Tran - San Jose CA, US
Hamid Eslampour - San Jose CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G02B 6/42

US Classification:

385 52, 385 50, 359811

Abstract:

Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.

US Patent:

7071492, Jul 4, 2006

Filed:

Jun 30, 2003

Appl. No.:

10/609839

Inventors:

Ruolin Li - Santa Clara CA, US
Ut Tran - San Jose CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01L 27/15

US Classification:

257 84, 257 13, 257 22, 257 94, 257103, 257184, 257432

Abstract:

A polymer well may be formed over a thermal oxide formed over a semiconductor substrate in one embodiment. The well may include a waveguide and a pair of heaters adjacent the waveguide. Each heater may be mounted on a platform of insulating material to reduce heat loss through the substrate and the thermal oxide, in one embodiment.

US Patent:

7099360, Aug 29, 2006

Filed:

Feb 3, 2003

Appl. No.:

10/357630

Inventors:

Achintya K. Bhowmik - San Jose CA, US
Nagesh K. Vodrahalli - Los Altos CA, US
Gennady Farber - Los Altos CA, US
Hai-Feng Liu - Cupertino CA, US
Hamid Eslampour - San Jose CA, US
Ut Tran - San Jose CA, US
William B. Wong - Saratoga CA, US
Ruolin Li - Santa Clara CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

H01S 3/13
H01S 5/00

US Classification:

372 29021, 372 32, 372 5011, 372 5012, 372 5021

Abstract:

An optical transmitter includes an external cavity laser array formed in a PLC, a trench-based detector array and an AWG. The external cavity laser is formed using an array of substantially similar laser gain blocks and an array of gratings formed in waveguides connected to the gain blocks. Each grating defines the output wavelength for its corresponding external cavity laser. Each detector of the detector array includes a coupler to cause a portion of a corresponding laser output signal of the laser array to propagate through a first sidewall of a trench and reflect off a second sidewall of the trench to a photodetector. In one embodiment, the photodetector outputs a signal indicative of the power level of the reflected signal, which a controller uses to control the laser array to equalize the power of the laser output signals.

US Patent:

7146086, Dec 5, 2006

Filed:

Jun 30, 2003

Appl. No.:

10/609803

Inventors:

Ut Tran - San Jose CA, US
David A. G. Deacon - Los Altos CA, US
Shing Man Lee - Fremont CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G02B 6/10
G02B 6/00

US Classification:

385131, 385129, 385130

Abstract:

A well may be formed for access to an optical waveguide core by a process that results in an L-shaped well. The L-shaped well may then be filled with a polymer. By controlling the size of each portion of well, the occurrence of bubbles within the well and cuts to the core may be reduced.

US Patent:

7260296, Aug 21, 2007

Filed:

Mar 29, 2006

Appl. No.:

11/392018

Inventors:

Ut Tran - San Jose CA, US
Hamid R. Eslampour - San Jose CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G02B 6/26
G02B 6/12

US Classification:

385 52, 385 14

Abstract:

Optical components may be precisely positioned in three dimensions with respect to one another. A bonder which has the ability to precisely position the components in two dimensions can be utilized. The components may be equipped with contacts at different heights so that as the components come together in a third dimension, their relative positions can be sensed. This information may be fed back to the bonder to control the precise alignment in the third dimension.