Varinder K Kalra

age ~82

from Fort Myers, FL

Also known as:
  • Varinder Kumar Kalra
  • Varinder A Kalra
  • Aruna K Kalra
  • Varinda Kalra
  • Kalra V Kumar
  • K Kalra
  • K Karla
  • Karla K
Phone and address:
9221 Triana Ter APT 3, Fort Myers, FL 33912

Varinder Kalra Phones & Addresses

  • 9221 Triana Ter APT 3, Fort Myers, FL 33912
  • Hematite, MO
  • Chesterfield, MO
  • Saint Louis, MO

Resumes

Varinder Kalra Photo 1

Consultant - Eaton

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Location:
Fort Myers, FL
Industry:
Electrical/Electronic Manufacturing
Work:
Eaton Feb 1974 - Jun 2010
Consultant

Bussmann Feb 1974 - Jun 2010
Consultant - Eaton
Varinder Kalra Photo 2

Varinder K Kalra

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Us Patents

  • Surface Mount Standoff For Printed Circuit Board Assembly

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  • US Patent:
    6587351, Jul 1, 2003
  • Filed:
    Apr 2, 2002
  • Appl. No.:
    10/114830
  • Inventors:
    Jeffrey Lynn Hollinsworth - Ballwin MO
    Randy John Bicknese - St. Peters MO
    Varinder Kumar Kalra - Chesterfield MO
    Keith Allen Spalding - Fenton MO
  • Assignee:
    Cooper Technologies - Houston TX
  • International Classification:
    H05K 114
  • US Classification:
    361758, 361742, 361770, 361804
  • Abstract:
    A standoff for a printed circuit board assembly is described. The standoff comprises at least one surface configured for surface mounting to a printed circuit board.
  • Fuse Element Positioning Body

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  • US Patent:
    6774760, Aug 10, 2004
  • Filed:
    Jun 5, 2001
  • Appl. No.:
    09/874453
  • Inventors:
    Varinder K. Kalra - Chesterfield MO
    Keith A. Spalding - Fenton MO
    Conrad M. Reeder - Wildwood MO
  • Assignee:
    Cooper Technologies Company - Houston TX
  • International Classification:
    H01H 85175
  • US Classification:
    337263, 337262, 337246, 29623
  • Abstract:
    In an exemplary embodiment, a fuse body includes a first end, a second end and a bore extending therethrough for receiving a fuse element assembly. The bore includes a clearing portion having a first cross sectional area and a positioning portion having a second cross sectional area. The first cross sectional area is larger than the second cross sectional area. The positioning portion provides a receptacle for receiving the fuse element assembly and ensuring that the fuse element is substantially centered within the clearance portion.
  • Low Resistance Polymer Matrix Fuse Apparatus And Method

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  • US Patent:
    7385475, Jun 10, 2008
  • Filed:
    Feb 24, 2005
  • Appl. No.:
    11/065419
  • Inventors:
    Joan Leslie Bender - Chesterfield MO, US
    Hundi Panduranga Kamath - Los Altos CA, US
    Varinder Kumar Kalra - Chesterfield MO, US
    Daniel Minas Manoukian - San Ramon CA, US
    Peter York So - Berkeley CA, US
  • Assignee:
    Cooper Technologies Company - Houston TX
  • International Classification:
    H01H 85/044
    H01H 85/046
  • US Classification:
    337297, 337227, 337228, 337232
  • Abstract:
    A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.
  • Low Resistance Polymer Matrix Fuse Apparatus And Method

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  • US Patent:
    20080218305, Sep 11, 2008
  • Filed:
    May 19, 2008
  • Appl. No.:
    12/123220
  • Inventors:
    Joan Leslie Bender - Chesterfield MO, US
    Hundi Panduranga Kamath - Los Altos CA, US
    Varinder Kumar Kalra - Chesterfield MO, US
    Daniel Minas Manoukian - San Ramon CA, US
    Peter York So - Berkeley CA, US
  • Assignee:
    COOPER TECHNOLOGIES COMPANY - HOUSTON TX
  • International Classification:
    H01H 85/04
    H01H 69/02
  • US Classification:
    337297, 29623
  • Abstract:
    A low resistance fuse apparatus and methods of manufacture includes a first intermediate insulation layer, a second intermediate insulation layer, and a free standing fuse element layer independently formed and fabricated from each of the first and second intermediate insulation layers, The fuse element layer includes first and second contact pads and a fusible link extending therebetween. The first and second intermediate insulation layers extend on opposite sides of the free standing fuse element layer and are laminated together with the fuse element layer therebetween.
  • Fuse Assembly

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  • US Patent:
    52353060, Aug 10, 1993
  • Filed:
    Jul 15, 1992
  • Appl. No.:
    7/915158
  • Inventors:
    Varinder K. Kalra - Chesterfield MO
    Vernon R. Spaunhorst - Washington MO
    Keith A. Spalding - Fenton MO
  • Assignee:
    Cooper Industries, Inc. - Houston TX
  • International Classification:
    H01H 8504
  • US Classification:
    337165
  • Abstract:
    The improved fuse assembly includes a trigger assembly having an electrically nonconductive barrel for receiving a spring loaded trigger therein and a heater strip disposed along the outer circumferential surface of the barrel with a pair of end flaps. One end flap has a hole therethrough which fits over the end of the trigger adjacent the short circuit element. A second flap fits over the end of the barrel adjacent the end ferrule. The short circuit element, which is electrically and mechanically linked to a ferrule on the opposite end of the tube from the trigger assembly, engages the trigger and heater element in a solder fusing alloy.
  • Method Of Making Wire Element Ceramic Chip Fuses

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  • US Patent:
    54408024, Aug 15, 1995
  • Filed:
    Sep 12, 1994
  • Appl. No.:
    8/302999
  • Inventors:
    Stephen Whitney - Manchester MO
    Vernon Spaunhorst - Washington MO
    Joan Winnett - St. Louis MO
    Varinder Kalra - Chesterfield MO
  • Assignee:
    Cooper Industries - Houston TX
  • International Classification:
    H01H 6902
  • US Classification:
    29623
  • Abstract:
    A method of manufacturing a chip fuse includes the steps of depositing a plurality of columns of electrically conductive metal film on a green, unfired ceramic substrate, and disposing a plurality of wire elements on the substrate over the film columns and perpendicular to the film columns. A cover of green, unfired ceramic is bonded to the substrate over the wire elements and film columns to form a laminate. The laminate is then die cut into individual fuses, which are then fired to cure the ceramic and form an intermetallic bond between the wire elements and the metal film. End termination coatings are then applied to the fuses to facilitate connecting the fuses in an electrical circuit. The invention relates to a chip fuse manufactured according to the method.
  • Subminiature Fuse And Method For Making A Subminiature Fuse

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  • US Patent:
    61475858, Nov 14, 2000
  • Filed:
    Jun 21, 1999
  • Appl. No.:
    9/336735
  • Inventors:
    Varinder K. Kalra - Chesterfield MO
    Keith A. Spalding - Fenton MO
  • Assignee:
    Cooper Technologies Company - Houston TX
  • International Classification:
    H01H 6902
    H01H 85143
    H01H 85157
  • US Classification:
    337248
  • Abstract:
    A method for manufacturing a subminiature fuse includes the steps of applying metallized coatings to surfaces at axially opposite ends of a hollow fuse body, placing a fuse element in an internal cavity in the fuse body, the fuse element extending from the first end to the second end of the cavity, placing a one of a solder and brazing preform and end termination at each of the first and second ends of the cavity, and heating the assembled fuse body, fuse element, solder preforms and end terminations to a temperature sufficient to cause the solder preforms to bond the fuse element to the end terminations and for the end terminations to bond with the metallized end portions of the fuse body, wherein the end terminations close the ends of the cavity. A subminiature fuse according to the invention includes a fuse body with a fuse element disposed in the body. The fuse body includes metallized end portions to which the end terminations are bonded.
  • Subminiature Fuse And Method For Making A Subminiature Fuse

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  • US Patent:
    58120467, Sep 22, 1998
  • Filed:
    Jan 30, 1997
  • Appl. No.:
    8/792177
  • Inventors:
    Russell Brown - Leicestershire, GB
    Farid Ghaderi - Chesterfield MO
    Varinder K. Kalra - Chesterfield MO
    Keith A. Spalding - Fenton MO
    Joan L. Winnett - Chesterfield MO
    Stephen J. Whitney - Manchester MO
  • Assignee:
    Cooper Technologies, Inc. - Houston TX
  • International Classification:
    H01H 85044
    H01H 85157
    H01H 6902
  • US Classification:
    337290
  • Abstract:
    A method for manufacturing a subminiature fuse includes the steps of applying metallized coatings to surfaces at axially opposite ends of a hollow fuse body, placing a fuse element in an internal cavity in the fuse body, the fuse element extending from the first end to the second end of the cavity, placing a one of a solder and brazing preform and end termination at each of the first and second ends of the cavity, and heating the assembled fuse body, fuse element, solder preforms and end terminations to a temperature sufficient to cause the solder preforms to bond the fuse element to the end terminations and for the end terminations to bond with the metallized end portions of the fuse body, wherein the end terminations form hermetic seals closing the ends of the cavity. A subminiature fuse according to the invention includes a fuse body with a fuse element diagonally disposed in the body. The fuse body includes metallized end portions to which the end terminations are bonded.

Googleplus

Varinder Kalra Photo 3

Varinder Kalra

Work:
Cooper Industries - Design Engineer (1974)
Education:
All India Institute of engineering patiala

Youtube

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