Victor V Luu

US Patent:

7987150, Jul 26, 2011

Filed:

Sep 4, 2007

Appl. No.:

11/849869

Inventors:

Victor V. Luu - Morgan Hill CA, US
John Poreda - Moraga CA, US
Thieu Nguyen Trinh - HoChiMinh, VN
Phong Van Nguyen - HoChiMinh, VN
Luan Thien Dinh - HoChiMinh, VN
Khoa Pham Dang Truong - HoChiMinh, VN

Assignee:

SIGLaz - Santa Clara CA

International Classification:

G06F 17/00
G06N 5/02

US Classification:

706 47

Abstract:

Automated defect sourcing systems identify root-causes of yield excursions due to contamination, process faults, equipment failure and/or handling. They perform this function in timely manner and provide accurate and timely feedback to address and contain the sources of yield excursion. A signature repository stores known wafer surface manufacturing defect types as set of rules. The signature of a manufacturing defect pattern is associated with the equipment or process that causes the defects, and is used to source the manufacturing defects and to provide process control for changing and/or stopping yield excursion during fabrication. A defect signature rule-based engine matches wafer defects against the signature repository during wafer fabrication. Once the defect signature is detected during fabrication, handling and/or disposing the root-cause of the corresponding defect is facilitated using messages according to an event handling database. Optionally, a real-time process control for wafer fabrication is provided.

US Patent:

20030115211, Jun 19, 2003

Filed:

Dec 14, 2001

Appl. No.:

10/017701

Inventors:

Li-Wen Chen - Cupertino CA, US
Victor Luu - Morgan Hill CA, US

Assignee:

MetaEdge Corporation - Sunnyvale CA

International Classification:

G06F007/00

US Classification:

707/102000, 707/104100

Abstract:

The present invention provides techniques for analyzing and managing information having a spatial component. Techniques such as virtual schemas can be used to create meta models for analyzing spatial information, in conjunction with information about other centric entities, including business entities, technical entities, and governmental entities. Specific embodiments provide systems, methods, computer programs and apparatus for populating databases in accordance with the defined meta models and analyzing information having spatial components in a variety of business, technical and governmental applications.

US Patent:

20040234106, Nov 25, 2004

Filed:

Aug 10, 2003

Appl. No.:

10/638693

Inventors:

Victor Luu - Morgan Hill CA, US
Don Tran - Morgan Hill CA, US

International Classification:

G06K009/00
G21K007/00

US Classification:

382/106000, 250/311000

Abstract:

Systems and methods are disclosed to determine dimensions of an imaged object: determining a scale factor for each pixel of the imaged object; receiving a dimensional specification between two or more points on the object; determining a pixel count between the two or more points; and determining the actual dimension of the object using the pixel count and scale factor.

US Patent:

20050031186, Feb 10, 2005

Filed:

Aug 10, 2003

Appl. No.:

10/638630

Inventors:

Victor Luu - Morgan Hill CA, US
Don Tran - Morgan Hill CA, US

International Classification:

G06K009/00

US Classification:

382141000, 382154000

Abstract:

Systems and methods are disclosed to characterize a sample by capturing a plurality of perspective images of the sample; dividing the perspective images into one or more sub-lines; and three-dimensionally characterizing the sample based on the sub-line analysis.

US Patent:

20050031188, Feb 10, 2005

Filed:

Aug 10, 2003

Appl. No.:

10/638674

Inventors:

Victor Luu - Morgan Hill CA, US
Don Tran - Morgan Hill CA, US

International Classification:

G06K009/00

US Classification:

382145000

Abstract:

Systems and methods are disclosed to characterize a sample by capturing an image of the sample; selecting a region for analysis; dividing each region into one or more sub-lines; and characterizing the sample based on the sub-line analysis.

US Patent:

7229845, Jun 12, 2007

Filed:

Jan 26, 2004

Appl. No.:

10/765505

Inventors:

Victor V. Luu - Morgan Hill CA, US
John Poreda - Moraga CA, US

Assignee:

Si Glaz - Santa Clara CA

International Classification:

H01L 21/66

US Classification:

438 16, 257E21525

Abstract:

Automated defect sourcing system identifies root-causes of yield excursion due to contamination, process faults, equipment failure and/or handling in timely manner and provides accurate timely feedback to address and contain the sources of yield excursion. A signature bank stores known wafer surface manufacturing defects as defect signatures. The signature of a manufacturing defect pattern is associated with a type of equipment or process, and used to source the manufacturing defects and to provide process control for changing and/or stopping yield excursion during fabrication. A defect signature recognition engine matches wafer defects against the signature bank during wafer fabrication. Once the defect signature is detected during fabrication, handling and/or disposing the root-cause of the corresponding defect is facilitated using messages according to an event handling database. Optionally, a real-time process control for wafer fabrication is provided.