Vincent Khai Lim

US Patent:

20130240009, Sep 19, 2013

Filed:

Mar 18, 2012

Appl. No.:

13/423231

Inventors:

Xiaobo Zhang - Arcadia CA, US
Vincent A. Lim - Los Angeles CA, US
Hoon H. Lee - Valencia CA, US
John P. Serra - Camarillo CA, US
Uming T. Jeng - Rosemead CA, US
Steven M. Bunyan - Porter Ranch CA, US
Julie J. Hoskin - Santa Monica CA, US
Kent E. Barbour - Simi Valley CA, US
Dimitri D. Krut - Encino CA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

H01L 31/05
H01L 31/0224

US Classification:

136244, 136256

Abstract:

A solar cell assembly including a semiconductor wafer having a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and an electrical contact material positioned on the solar cell portion, wherein the wing portion is substantially free of the electrical contact material.

US Patent:

20190148572, May 16, 2019

Filed:

Jan 16, 2019

Appl. No.:

16/249015

Inventors:

- Chicago IL, US
Vincent A. Lim - Los Angeles CA, US
Hoon H. Lee - Valencia CA, US
John P. Serra - Camarillo CA, US
Uming T. Jeng - Rosemead CA, US
Steven M. Bunyan - Northridge CA, US
Julie J. Hoskin - Santa Monica CA, US
Kent E. Barbour - Simi Valley CA, US
Dimitri D. Krut - Encino CA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

H01L 31/0224
H01L 31/068
H01L 31/05
H01L 31/0475
H01L 31/18

Abstract:

A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.

US Patent:

20170222070, Aug 3, 2017

Filed:

Apr 17, 2017

Appl. No.:

15/488618

Inventors:

- Chicago IL, US
Vincent A. Lim - Los Angeles CA, US
Hoon H. Lee - Valencia CA, US
John P. Serra - Camarillo CA, US
Uming T. Jeng - Rosemead CA, US
Steven M. Bunyan - Northridge CA, US
Julie J. Hoskin - Santa Monica CA, US
Kent E. Barbour - Simi Valley CA, US
Dimitri D. Krut - Encino CA, US

Assignee:

The Boeing Company - Chicago IL

International Classification:

H01L 31/0224
H01L 31/05
H01L 31/18
H01L 31/068
H01L 31/0475

Abstract:

A method for forming a solar cell including steps of (1) providing a semiconductor wafer having an upper surface; (2) applying an electrical contact material to the upper surface, the electrical contact material forming an electrically conductive grid that includes grid lines extending from a bus bar; (3) forming an isolation channel in the semiconductor wafer to define a solar cell portion and a wing portion, wherein the wing portion is electrically isolated from the solar cell portion, and wherein the wing portion is substantially free of the electrical contact material; (4) submerging the semiconductor wafer in a solvent, wherein formation of metal dendrites on the grid lines of the electrically conductive grid is inhibited; and (5) separating the solar cell portion from the wing portion.