Vivek R Shah

US Patent:

8492335, Jul 23, 2013

Filed:

Feb 22, 2011

Appl. No.:

13/032489

Inventors:

Hans K. Kestler - Brentwood TN, US
Vivek Shah - Franklin TN, US
Dean James Rager-Aguiar - Spring Hill TN, US

Assignee:

BioMimetic Therapeutics, LLC - Franklin TN

International Classification:

A61K 38/18

US Classification:

514 82

Abstract:

Provided herein are compositions and methods for the treatment of tendinopathies, such as tenosynovitis, tendinosis or tendinitis, including Achilles tendinopathy, patellar tendinopathy, lateral epicondylitis or “tennis elbow,” medial epicondylitis or “golfer's elbow,” plantar fasciitis, and rotator cuff tendinopathy, and in particular to methods for the treatment of tendinopathies by administering compositions comprising platelet-derived growth factor (PDGF).

US Patent:

20090248178, Oct 1, 2009

Filed:

Mar 27, 2008

Appl. No.:

12/057267

Inventors:

Janell Paulson - Carlsbad CA, US
Isabel Ge Mahe - Los Altos CA, US
Craig C. Hamilton - Sunnyvale CA, US
Sachin S. Kansal - Sunnyvale CA, US
Gurunath Ramaswamy - San Diego CA, US
Dante Russo - Mountain View CA, US
Cherif Jazra - Sunnyvale CA, US
Vivek Shah - Mountain View CA, US

International Classification:

G05B 19/00
G01C 21/00
G05B 15/00

US Classification:

700 66, 701213, 700 1

Abstract:

A mobile computing device comprises a memory, a processor and a transceiver. The memory is configured to store at least one type of position assist data. The processor is configured to provide a position fix based on the position assist data. The transceiver is configured for wireless communication. The memory is configured to store updated position assist data for the type of position assist data. The processor is operable in a first operating mode in which the type of position assist data is not updated and operable in a second operating mode in which the type of position assist data is updated in response to at least one triggering event.

US Patent:

20140005110, Jan 2, 2014

Filed:

Jun 21, 2013

Appl. No.:

13/923967

Inventors:

Vivek Shah - Franklin TN, US
Dean James Rager-Aguiar - Spring Hill TN, US

Assignee:

BioMimetic Therapeutics, LLC - Franklin TN

International Classification:

A61K 38/18

US Classification:

514 82

Abstract:

Provided herein are compositions and methods for the treatment of tendinopathies, such as tenosynovitis, tendinosis or tendinitis, including Achilles tendinopathy, patellar tendinopathy, lateral epicondylitis or “tennis elbow,” medial epicondylitis or “golfer's elbow,” plantar fasciitis, and rotator cuff tendinopathy, and in particular to methods for the treatment of tendinopathies by administering compositions comprising platelet-derived growth factor (PDGF).

US Patent:

20210408729, Dec 30, 2021

Filed:

Dec 3, 2019

Appl. No.:

17/288956

Inventors:

- Lisle IL, US
Vivek SHAH - Buffalo Grove IL, US
Andrew KOLAK - Villa Park IL, US
Dan WENZEL - Hoffman Estates IL, US
Matt COX - Bolingbrook IL, US
Ayman ISAAC - Glendale AZ, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6581
H01R 13/6598
H01R 13/6471
H01R 13/627

Abstract:

Input/output (I/O) connectors () for conducting data at high data rates, (e.g. 112 gigabits per second or more) are provided with protective shields () to provide increased mechanical strength and signal integrity.

US Patent:

20210281016, Sep 9, 2021

Filed:

May 24, 2021

Appl. No.:

17/327817

Inventors:

- Lisle IL, US
Chien-Lin WANG - Naperville IL, US
Vivek SHAH - Buffalo Grove IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6461
H01R 13/6587
H01R 12/72
H01R 12/73
H01R 13/518

Abstract:

A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.

US Patent:

20200266583, Aug 20, 2020

Filed:

May 4, 2020

Appl. No.:

16/866158

Inventors:

- Lisle IL, US
Chien-Lin WANG - Naperville IL, US
Vivek SHAH - Buffalo Grove IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6461
H01R 13/518
H01R 12/73
H01R 12/72
H01R 13/6587

Abstract:

A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. The wafers omit a ground terminal between adjacent terminal pairs. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.

US Patent:

20200222504, Jul 16, 2020

Filed:

Oct 15, 2019

Appl. No.:

16/653733

Inventors:

- Franklin TN, US
Vivek Shah - Franklin TN, US
Dean James Rager-Aguiar - Spring Hill TN, US

International Classification:

A61K 38/18

Abstract:

Provided herein are compositions and methods for the treatment of tendinopathies, such as tenosynovitis, tendinosis or tendinitis, including Achilles tendinopathy, patellar tendinopathy, lateral epicondylitis or “tennis elbow,” medial epicondylitis or “golfer's elbow,” plantar fasciitis, and rotator cuff tendinopathy, and in particular to methods for the treatment of tendinopathies by administering compositions comprising platelet-derived growth factor (PDGF).

US Patent:

20200119498, Apr 16, 2020

Filed:

Jun 16, 2017

Appl. No.:

16/081541

Inventors:

- Lisle IL, US
Chien-Lin WANG - Naperville IL, US
Vivek SHAH - Buffalo Grove IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6587
H01R 13/6591

Abstract:

A connector system includes a wafer that has a shield that replaces standard ground terminals and an additional isolation shield to provide enhanced electrical isolation. To further improve electrical performance, transmit and receive channels can be provided in separate wafers on one side of connector system with a space or wafer between the transmit and signal wafers. On the other side of the connector system the wafer will have one or two spaces that are either black or filled with terminals that operate at lower frequencies. A conductive insert can provide further isolation intra-wafer.