Vivek C Shah

US Patent:

20210408729, Dec 30, 2021

Filed:

Dec 3, 2019

Appl. No.:

17/288956

Inventors:

- Lisle IL, US
Vivek SHAH - Buffalo Grove IL, US
Andrew KOLAK - Villa Park IL, US
Dan WENZEL - Hoffman Estates IL, US
Matt COX - Bolingbrook IL, US
Ayman ISAAC - Glendale AZ, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6581
H01R 13/6598
H01R 13/6471
H01R 13/627

Abstract:

Input/output (I/O) connectors () for conducting data at high data rates, (e.g. 112 gigabits per second or more) are provided with protective shields () to provide increased mechanical strength and signal integrity.

US Patent:

20210281016, Sep 9, 2021

Filed:

May 24, 2021

Appl. No.:

17/327817

Inventors:

- Lisle IL, US
Chien-Lin WANG - Naperville IL, US
Vivek SHAH - Buffalo Grove IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6461
H01R 13/6587
H01R 12/72
H01R 12/73
H01R 13/518

Abstract:

A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.

US Patent:

20200266583, Aug 20, 2020

Filed:

May 4, 2020

Appl. No.:

16/866158

Inventors:

- Lisle IL, US
Chien-Lin WANG - Naperville IL, US
Vivek SHAH - Buffalo Grove IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6461
H01R 13/518
H01R 12/73
H01R 12/72
H01R 13/6587

Abstract:

A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. The wafers omit a ground terminal between adjacent terminal pairs. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.

US Patent:

20200119498, Apr 16, 2020

Filed:

Jun 16, 2017

Appl. No.:

16/081541

Inventors:

- Lisle IL, US
Chien-Lin WANG - Naperville IL, US
Vivek SHAH - Buffalo Grove IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6587
H01R 13/6591

Abstract:

A connector system includes a wafer that has a shield that replaces standard ground terminals and an additional isolation shield to provide enhanced electrical isolation. To further improve electrical performance, transmit and receive channels can be provided in separate wafers on one side of connector system with a space or wafer between the transmit and signal wafers. On the other side of the connector system the wafer will have one or two spaces that are either black or filled with terminals that operate at lower frequencies. A conductive insert can provide further isolation intra-wafer.

US Patent:

20180358751, Dec 13, 2018

Filed:

Dec 14, 2016

Appl. No.:

15/778176

Inventors:

- Lisle IL, US
Chien-Lin WANG - Naperville IL, US
Vivek SHAH - Buffalo Grove IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6461
H01R 12/72
H01R 12/73
H01R 13/6587
H01R 13/518

Abstract:

A backplane connector includes a shielded design that has wafers with signal terminals supported as edge-coupled terminal pairs for differential signaling. A ground shield is mounted on each wafer and provides a U-channel that partially shields each terminal pair. The wafers omit a ground terminal between adjacent terminal pairs. An insert can be provided to help connect the ground shield to a U-shield to provide U-shaped shielding structure substantially the entire way from a tail to a contact.

US Patent:

20180083389, Mar 22, 2018

Filed:

Nov 27, 2017

Appl. No.:

15/822699

Inventors:

- Lisle IL, US
Vivek M. Shah - Buffalo Grove IL, US
Chien-Lin Wang - Naperville IL, US
Peerouz Amleshi - Lisle IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6471
H01R 12/58

Abstract:

A connector system includes a connector mounted on a circuit board. The circuit board has deeper backdrilled vias and the connector has modified signal terminal that can mate with the backdrilled vias so as to provide a surprising increase in the performance of signal traces provided in the top layers of the circuit board.

US Patent:

20180053400, Feb 22, 2018

Filed:

Aug 22, 2016

Appl. No.:

15/243208

Inventors:

- Schenectady NY, US
Xiaohui Hu - Foxboro MA, US
Devang Gandhi - Atlanta GA, US
Vivek Shah - Lisle IL, US
Christopher Schreiner - Lisle IL, US

International Classification:

G08B 29/04

Abstract:

Streaming data at a sensor is sensed and received. The streaming data includes a plurality of observations. For a current observation in the plurality of observations, a health of the current observation is determined. Based upon the health of the current observation, a penalty is determined. A Sensor Health Index (SHI) for the current observation is obtained by aggregating the penalty with at least one SHI of one or more previous observations from the plurality of observations. An alarm is selectively generated based upon the SHI of the current observation.

US Patent:

20170264053, Sep 14, 2017

Filed:

May 26, 2017

Appl. No.:

15/606446

Inventors:

- Lisle IL, US
Peerouz Amleshi - Lisle IL, US
Vivek M. Shah - Buffalo Grove IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H01R 13/6585
H01R 12/72
H01R 13/6581
H01R 12/71
H01R 13/652
H01R 13/6587

Abstract:

A connector system is disclosed that can include a first and second connector. The first connector supports a channel terminal that is U-shaped and includes a mating edge. The second connector includes one or more wafers that support signal terminals arranged in an edge-coupled manner. Ground terminals in the one or more wafers are positioned on two sides of a pair of signal terminals and are configured to engage the mating edge of the channel terminal. Each wafer can include a shield mounted on a side of the wafer. The shield can include arms that electrically engage ground terminals.