Vladimir Living Stoica

US Patent:

6454878, Sep 24, 2002

Filed:

Nov 1, 2000

Appl. No.:

09/703553

Inventors:

Achyuta Achari - Canton MI
Brenda Joyce Nation - Troy MI
Jay D Baker - Dearborn MI
Lakhi Nandlal Goenka - Ann Arbor MI
Mohan R. Paruchuri - Canton MI
Vladimir Stoica - Farmington Hills MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

C23C 806

US Classification:

148284, 216 13, 216 20, 29830

Abstract:

A method for forming sets of tri-metal material involving the use of cladding mills. When multiple sets of tri-metal material are formed, the outside surfaces of each set is prepared by oxidation to prevent each set from adhering to the set above or below. An alternative to oxidation is to provide a removable layer on the outside surface of the tri-metal material. Alternatively bonding materials may be used on the intermediate surfaces; such bonding materials can be selected from a group consisting of tin, nickel, titanium, chromium, silver and zinc.

US Patent:

6495053, Dec 17, 2002

Filed:

Aug 30, 2000

Appl. No.:

09/651765

Inventors:

Lawrence Leroy Kneisel - Novi MI
Mohan R. Paruchuri - Canton MI
Vladimir Stoica - Farmington Hills MI

Assignee:

Visteon Global Tech, Inc. - Dearborn MI

International Classification:

H01B 124

US Classification:

216 13, 216 17, 216 19, 216 20, 216 34, 216 35, 216 36, 438720, 438742, 438754, 427 96, 427 97

Abstract:

A multi-layer electronic circuit board design having selectively formed apertures or cavities , and which includes grooves or troughs which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures.

US Patent:

6778389, Aug 17, 2004

Filed:

Jul 3, 2003

Appl. No.:

10/613447

Inventors:

Andrew Z. Glovatsky - Plymouth MI
Vladimir Stoica - Farmington Hills MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H05K 720

US Classification:

361690, 361704, 361719, 361720, 361721, 165 801, 174 161

Abstract:

A microelectronic package comprises a tubular housing and a microelectronic assembly affixed to a support that is received in the housing. The support may be a cage-like structure that comprises axial ribs to which the microelectronic assembly is attached. Alternately, the support may comprise a solid surface for affixing a flexible substrate. The microelectronic assembly is arranged with a major surface facing and spaced apart from the inner wall of the housing. Thus, the microelectronic assembly is proximate to the wall to provide an optimum volume for packaging other components. Movement, the spacing between the microelectronic assembly and the tubular housing facilitates coolant gas flow during use to enhance thermal dissipation.

US Patent:

6838623, Jan 4, 2005

Filed:

Nov 20, 2002

Appl. No.:

10/300049

Inventors:

Lawrence Kneisel - Novi MI, US
Mohan Paruchuri - Canton MI, US
Vladimir Stoica - Farmington Hills MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

H05K 103

US Classification:

174255, 174259, 174262, 174263, 361792

Abstract:

A multi-layer electronic circuit board design having selectively formed apertures or cavities , and which includes grooves or troughs which are effective to selectively entrap liquefied adhesive material, thereby substantially preventing the adhesive material from entering the apertures.

US Patent:

7180736, Feb 20, 2007

Filed:

Jul 10, 2003

Appl. No.:

10/616528

Inventors:

Andrew Z. Glovatsky - Plymouth MI, US
Vladimir Stoica - Farmington Hills MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

H05K 7/20

US Classification:

361688

Abstract:

A microelectronic package comprises microelectronic assemblies and a housing having a cylindrical outer wall. The microelectronic assemblies include electronic components mounted on a substrate and are affixed to support surfaces of the inner wall of the housing. The housing is preferably formed of semi-cylindrical sections that are joined along axial edges. The housing includes one or more axial channels interposed between the outer wall and the inner wall for conveying coolant gas. In this manner, the housing provides more uniform thermal dissipati9on of heat generated by the microelectronic assemblies during operation, despite variations in the thickness between the cylindrical outer wall and the support surfaces, which are preferably planar.

US Patent:

7215557, May 8, 2007

Filed:

Aug 27, 2003

Appl. No.:

10/648910

Inventors:

Andrew Z. Glovatsky - Plymouth MI, US
Vladimir Stoica - Farmington Hills MI, US

Assignee:

Visteon Global Technologies, Inc. - Van Buren Township MI

International Classification:

H05K 1/11

US Classification:

361804, 361792, 361790, 361748, 361760

Abstract:

An assembly that includes two or more microelectronic modules in a self-sustaining structure that is adapted to be installed in a housing. The microelectronic modules are affixed to supports that are attached to ribs and arranged in parallel-spaced relationship. When the assembly is received in a housing, the ribs engage the inner wall of the housing to securely position the assembly. Also, the ribs space the microelectronic modules apart from the housing to facilitate coolant gas flow through the housing and thereby improve thermal dissipation during operation.

US Patent:

8264693, Sep 11, 2012

Filed:

Dec 8, 2008

Appl. No.:

12/315906

Inventors:

Vladimir A. Stoica - Ann Arbor MI, US
Roy Clarke - Ann Arbor MI, US

Assignee:

The Regents of The University of Michigan - Ann Arbor MI

International Classification:

G01B 11/02

US Classification:

356502

Abstract:

A method of measuring at least one property including a magnetic property of target material is provided. A pump pulse train having one or more pump pulses is generated. The target material is irradiated with at least a portion of the one or more pump pulses so as to cause transient perturbation in the target material. At least one probe pulse train is generated having one or more probe pulses. The target material is irradiated with at least a portion of the one or more probe pulses to obtain one or more reflected probe pulses which are modulated based on the transient perturbation. A time interval between a time at which the target material is irradiated by each of the pump pulses and a time at which the target material is irradiated by each of its corresponding probe pulses is controlled. Each modulated probe pulse is detected.

US Patent:

6391211, May 21, 2002

Filed:

Sep 6, 2000

Appl. No.:

09/655559

Inventors:

Andrew Z. Glovatsky - Plymouth MI
Robert Joseph Gordon - Livonia MI
Vivek Amir Jairazbhoy - Farmington Hills MI
Vladimir Stoica - Farmington Hills MI

Assignee:

Visteon Global Technologies, Inc. - Dearborn MI

International Classification:

H01B 1300

US Classification:

216 20, 216 13, 216 33, 216 34

Abstract:

A method for making multi-layer electronic circuit board including a pre-circuit assembly and a ground layer which are automatically aligned and bonded together by use of solder material or deposits.