Wadie F Mikhail

from Poughkeepsie, NY

Wadie Mikhail Phones & Addresses

  • Poughkeepsie, NY

Us Patents

  • High Density Semiconductor Circuit Layout

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  • US Patent:
    40807207, Mar 28, 1978
  • Filed:
    Dec 27, 1976
  • Appl. No.:
    5/754704
  • Inventors:
    John Balyoz - Hopewell Junction NY
    Algirdas Joseph Gruodis - Wappingers Falls NY
    Teh-Sen Jen - Fishkill NY
    Wadie Faltas Mikhail - Poughkeepsie NY
  • Assignee:
    International Business Machines Corporation - Armonk NY
  • International Classification:
    H01L 2972
  • US Classification:
    29577C
  • Abstract:
    An integrated logic circuit having a novel layout in a semiconductor substrate. The area required for the circuits within the substrate is substantially less than that of prior layouts. Each circuit includes a first device including an elongated impurity region and a set of other impurity regions either in, or in contiguous relationship with, the elongated region; to form a set of diode junctions. The elongated region is capable of containing a predetermined maximum number of the other impurity regions. A second device is located adjacent the narrow side of said first device. A first set of first level conductors extends over the elongated region orthogonally with respect to the elongated direction and are interconnected to selected ones of the other impurity regions. Another conductor is a second level atop the substrate is connected to an impurity region of the second device and extends substantially parallel to the elongated direction. For the most part, this conductor connects the second device with one of the conductors in the first set.
  • High Density Semiconductor Integrated Circuit Layout

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  • US Patent:
    40329623, Jun 28, 1977
  • Filed:
    Dec 29, 1975
  • Appl. No.:
    5/644775
  • Inventors:
    John Balyoz - Hopewell Junction NY
    Algirdas Joseph Gruodis - Wappingers Falls NY
    Teh-Sen Jen - Fishkill NY
    Wadie Faltas Mikhail - Poughkeepsie NY
  • Assignee:
    IBM Corporation - Armonk NY
  • International Classification:
    H01L 2348
    H01L 2944
    H01L 2952
    H01L 2960
  • US Classification:
    357 68
  • Abstract:
    An integrated logic circuit having a novel layout in a semiconductor substrate. The area required for the circuits within the substrate is substantially less than that of prior layouts. Each circuit includes a first device including an elongated impurity region and a set of other impurity regions either in, or in contiguous relationship with, the elongated region to form a set of diode junctions. The elongated region is capable of containing a predetermined maximum number of the other impurity regions. A second device is located adjacent the narrow side of said first device. A first set of first level conductors extends over the elongated region orthogonally with respect to the elongated direction and are interconnected to selected ones of the other impurity regions. Another conductor in a second level atop the substrate is connected to an impurity region of the second device and extends substantially parallel to the elongated direction. For the most part, this conductor connects the second device with one of the conductors in the first set.

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