Walter S Robbins

US Patent:

6586533, Jul 1, 2003

Filed:

May 4, 1994

Appl. No.:

08/238178

Inventors:

Vincent R. Landi - Danielson CT
J. Mark Mersereau - Brooklyn CT
Walter A. Robbins - Dayville CT
Michael E. St. Lawrence - Thompson CT

Assignee:

World Properties, Inc. - Lincolnwood IL

International Classification:

C08C 1928

US Classification:

525315, 525 70, 525 87, 525 88, 525 89, 525 99, 525236, 525237, 525281, 525304, 525305, 525314, 525316, 524403, 524413, 524424, 524430, 524433, 524434, 524456, 524571, 524575, 427123, 26433113

Abstract:

Articles are formed from a thermosetting composition based on polybutadiene or polyisoprene resins which are subjected to a high temperature cure step of greater than 250Â C. The thermosetting compositions may include fillers such as particulate ceramic fillers and may also include woven webs for improved dimensional stability and decreased brittleness. The formation process of this invention is particularly well suited for making electrical circuit substrates for microwave and digital circuits, typically in the form of the thermosetting composition being laminated on one or both opposed surfaces to metal conductive foil (e. g. , copper).

US Patent:

52235688, Jun 29, 1993

Filed:

May 9, 1989

Appl. No.:

7/349595

Inventors:

Vincent R. Landi - Danielson CT
J. Mark Mersereau - Brooklyn CT
Walter A. Robbins - Dayville CT

Assignee:

Rogers Corporation - Rogers CT

International Classification:

C08C 1100
C08D 902

US Classification:

524571

Abstract:

A forming process for producing a hard shaped molded article that includes subjecting a moldable thermosetting composition to a high temperature cure condition at a temperature greater than about 250. degree. C. and less than the decomposition temperature of the composition to form a crosslinked polymeric network. In particular, the invention features a forming process for producing a hard shaped molded article that includes the steps of (a) providing a moldable thermosetting composition that includes 1) a polybutadiene or polyisoprene resin which is a liquid at room temperature and which has a molecular weight less than 5,000 and a large number of pendent vinyl groups and 2) a solid butadiene- or isoprene-containing polymer (e. g, a thermoplastic elastomer); (b) forming the composition into a shape; and (c) curing the composition to produce the article including subjecting the composition to a high temperature cure condition at a temperature greater than about 250. degree. C. and less than the decomposition temperature of the composition.