Wenpin D Ho

US Patent:

20040187731, Sep 30, 2004

Filed:

Apr 14, 2004

Appl. No.:

10/823982

Inventors:

Qing Wang - North Plainfield NJ, US
Weiji Huang - Bound Brook NJ, US
Miu Lau - Edison NJ, US
Carol Liu - Union NJ, US
Ce Ma - Apex NC, US
Edward Chang - Gillette NJ, US
Wenpin Ho - North Arlington NJ, US
Richard Paciej - Gladstone NJ, US

International Classification:

C25D005/02

US Classification:

106/001130, 205/291000

Abstract:

Improved acid copper electroplating bath compositions are disclosed. The improved bath solutions contain at least one of a carrier; a water-soluble, mercapto-containing organic brightener; and a leveler which comprises an organic compound containing single or multiply charged centers in acidic bath solution. These electroplating bath compositions are used to copper plate advanced interconnects on semiconductor devices.