Will Michael Miller

US Patent:

7084659, Aug 1, 2006

Filed:

Dec 28, 2004

Appl. No.:

11/024536

Inventors:

Anthony Delucco - Beaverton OR, US
William Devey - Beaverton OR, US
Will A. Miller - Camas WA, US

Assignee:

Credence Systems Corporation - Milpitas CA

International Classification:

G01R 31/26

US Classification:

324765, 324754, 324761

Abstract:

A test head for a semiconductor integrated circuit tester, the test head includes a power supply board mounted to a power distribution board and positioned between the power distribution board and a device interface board. The power supply board includes a power supply circuit having power supply input terminals for receiving electrical power at a voltage Vand force and return terminals for supplying regulated electrical power at a voltage V. The power supply board further includes a power connector for connecting the force and return terminals of the power supply circuit to power supply contact elements of the device interface board.

US Patent:

7161347, Jan 9, 2007

Filed:

Jul 8, 2005

Appl. No.:

11/178092

Inventors:

Will A. Miller - Camas WA, US
Wesley G. Stanley - Milwaukie OR, US
David R. Trine - Portland OR, US

Assignee:

Credence Systems Corporation - Milpitas CA

International Classification:

G01R 31/28

US Classification:

3241581

Abstract:

A test head for a semiconductor integrated circuit tester includes a main support structure defining a device interface board location, and a contact support frame that is displaceable relative to the main support structure for engaging a device interface board at the device interface board location. The contact support frame is composed of a first frame member having a first surface region that is directed towards the device interface board location and also having an opposite second surface region, a second frame member having a first surface region in spaced confronting relationship with the second surface region of the first frame member and also having an opposite second surface region, and a resilient mechanism effective between the first and second frame members for permitting the first frame member to move relative to the second frame member when force is applied to the second frame member at the second surface region thereof for displacing the contact support frame towards the device interface board location.

US Patent:

7292059, Nov 6, 2007

Filed:

Mar 31, 2005

Appl. No.:

11/096337

Inventors:

William Devey - Beaverton OR, US
Will A. Miller - Camas WA, US
Anthony Delucco - Beaverton OR, US

Assignee:

Credence Systems Corporation - Milpitas CA

International Classification:

G01R 31/36

US Classification:

324771

Abstract:

A power supply assembly includes a dielectric substrate and a power supply circuit supported by the dielectric substrate. A conductive connection block is attached to the dielectric substrate at a main surface thereof and is connected to a power supply terminal of the power supply circuit. A spring probe pin is fitted in a bore formed in the connection block and includes a conductive sleeve and a conductive plunger fitted in the sleeve. The conductive sleeve is in electrically conductive contact with the connection block.

US Patent:

20050208828, Sep 22, 2005

Filed:

Mar 16, 2004

Appl. No.:

10/802993

Inventors:

Will Miller - Vancouver WA, US
David Trine - Portland OR, US

International Classification:

H01R009/05

US Classification:

439581000

Abstract:

An interconnection structure includes a positioning block and a dielectric substrate. A coaxial cable has an end segment that is fitted in a passage in the positioning block and the positioning block is so positioned relative to the dielectric substrate that an end face of the inner conductor of the coaxial cable is presented towards a conductive element on a main face of the substrate. A discrete resilient contact element is interposed between the end face of the inner conductor and the conductive element and in electrically-conductive pressure contact with both the inner conductor and the conductive element.