William Lee Avery

US Patent:

59598409, Sep 28, 1999

Filed:

Jun 25, 1997

Appl. No.:

8/882677

Inventors:

Tom W. Collins - Saratoga CA
William J. Avery - San Jose CA
John S. Suy - San Jose CA
David M. Tichane - San Jose CA

Assignee:

Tandem Computers Incorporated - Cupertino CA

International Classification:

H05K 720

US Classification:

361713

Abstract:

An electrical component, mounted for example to a printed circuit board, is enclosed in a sealed chamber with an inert gas that permits the electrical leads of the electrical component to be formed from a material having high heat and electrical conductivity, such as silver, that is protected from corrosion and/or oxidation by the inert gas. The housing is fabricated from a heat conductive material, and heat is thereby drawn from the electrical leads for dissipation by the outer surface of the housing.

US Patent:

58814531, Mar 16, 1999

Filed:

Apr 24, 1997

Appl. No.:

8/845856

Inventors:

William J. Avery - San Jose CA
John S. Suy - San Jose CA
David M. Tichane - San Jose CA

Assignee:

Tandem Computers, Incorporated - Cupertino CA

International Classification:

H05K 1304
H05K 332

US Classification:

29834

Abstract:

Disclosed is method for aligning and mounting electrical components, such as packaged integrated circuits, to a printed circuit board. During an alignment phase, a sample component is attached to a stand-in circuit board at a component site. A base plate, having alignment elements, is then fitted to the board proximate the attached sample component. Next, a chuck is mounted to the sample component, and an alignment plate positioned to engage the alignment elements of the base plate, and affixed to the chuck, forming a chuck assembly that is aligned to the base plate and registered to the component site of the circuit board. During a production phase, the base plate is placed on a printed circuit board at a location substantially identical to that on the stand-in printed circuit board. A chuck assembly, configured substantially identical to that formed during the alignment phase, and carrying a component to be mounted, is attached to the base plate so that the alignment plate engages the alignment elements. The chuck, carrying the electrical component is registered to the base plate through the alignment plate to accurately locate the component leads over the circuit pads on the circuit board.

US Patent:

56150865, Mar 25, 1997

Filed:

May 17, 1994

Appl. No.:

8/245296

Inventors:

Tom W. Collins - Saratoga CA
William J. Avery - San Jose CA
John S. Suy - San Jose CA
David M. Tichane - San Jose CA

Assignee:

Tandem Computers Incorporated - Cupertino CA

International Classification:

H05K 720

US Classification:

361704

Abstract:

Apparatus for cooling a plurality of electrical components mounted to a circuit board includes a base plate mounted in proximate relation to component sites on the circuit board at which electrical components are mounted. The base plate includes alignment elements that engage a alignment plate. The electrical components are carried by the alignment plate so that when the alignment plate is installed on the base plate, engaging the alignment elements, the electrical components are registered to and installed at corresponding component sites in a manner that aligns electrical leads of the components to printed circuit pads at the component sites. The base plate and alignment plate are sealed, and a coolant circulated therethrough.

US Patent:

55049885, Apr 9, 1996

Filed:

May 17, 1994

Appl. No.:

8/245497

Inventors:

William J. Avery - San Jose CA
John S. Suy - San Jose CA
David M. Tichane - San Jose CA

Assignee:

Tandem Computers Incorporated - Cupertino CA

International Classification:

B23P 1900

US Classification:

29741

Abstract:

Disclosed is apparatus for aligning and mounting electrical components, such as packaged integrated circuits, to a printed circuit board. During an alignment phase, a sample component is attached to a stand-in circuit board at a component site. A base plate, having alignment elements, is then fitted to the board proximate the attached sample component. Next, a chuck is mounted to the sample component, and an alignment plate positioned to engage the alignment elements of the base plate, and affixed to the chuck, forming a chuck assembly that is aligned to the base plate and registered to the component site of the circuit board. During the production phase the base plate is placed on a printed circuit board at a location substantially identical to that on the stand-in printed circuit board. A chuck assembly, configured substantially identical to that formed during the alignment phase, and carrying a component to be mounted, is attached to the base plate so that the alignment plate engages the alignment elements. The chuck, carrying the electrical component is registered to the base plate through the alignment plate to accurately locate the component leads over the circuit pads on the circuit board.