William Dean Beair

US Patent:

20130186946, Jul 25, 2013

Filed:

Jan 19, 2012

Appl. No.:

13/354080

Inventors:

William D. Beair - Carrollton TX, US
Michael R. Williams - Allen TX, US
Eric Gilley - Quinlan TX, US

Assignee:

RAYTHEON COMPANY - Waltham MA

International Classification:

B23K 1/20

US Classification:

228256

Abstract:

A solder paste transfer process is provided and includes defining an arrangement of solder pad locations on a surface, applying solder paste onto a transfer tool in a pre-defined configuration reflective of the arrangement, disposing the transfer tool in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the transfer tool to the solder pad locations.

US Patent:

20130240610, Sep 19, 2013

Filed:

Mar 14, 2012

Appl. No.:

13/420355

Inventors:

William D. Beair - Carrollton TX, US
Michael R. Williams - Allen TX, US
Eric Gilley - Quinlan TX, US

Assignee:

RAYTHEON COMPANY - Waltham MA

International Classification:

B23K 31/02
B23K 3/06
B23K 1/20

US Classification:

22818021, 228256, 228 33

Abstract:

A solder paste transfer process is provided and includes defining multiple arrangements of solder pad locations on a surface, applying solder paste onto multiple transfer tools coupled to a fixture in a pre-defined configuration reflective of the multiple arrangements, disposing the fixture such that the multiple transfer tools are disposed in an inverted orientation proximate to the surface and reflowing the solder paste to flow from the multiple transfer tools to the solder pad locations.

US Patent:

20180141144, May 24, 2018

Filed:

Jan 22, 2018

Appl. No.:

15/876527

Inventors:

- Waltham MA, US
William D. Beair - Carrollton TX, US

International Classification:

B23K 1/20
H05K 3/28
H05K 1/02
H05K 3/26
B23K 1/00
H05K 3/34

Abstract:

A method and apparatus for cleaning an electronic circuit board is disclosed. The electronic circuit board is provided with a substrate layer and a copper layer. A solder mask is applied to the electronic circuit board and a channel is formed in the solder mask. The channel includes an inlet and an outlet. A component is affixed to the electronic circuit board over the channel and cleaning fluid is passed through the channel to remove residual solder flux from between the component and the electronic circuit board.

US Patent:

20160029490, Jan 28, 2016

Filed:

Jul 25, 2014

Appl. No.:

14/340984

Inventors:

- Waltham MA, US
William D. Beair - Carrollton TX, US

International Classification:

H05K 1/18
B23K 1/00
B23K 1/20
B08B 3/04

Abstract:

A method and apparatus for cleaning an electronic circuit board is disclosed. The electronic circuit board is provided with a substrate layer and a copper layer. A solder mask is applied to the electronic circuit board and a channel is formed in the solder mask. The channel includes an inlet and an outlet. A component is affixed to the electronic circuit board over the channel and cleaning fluid is passed through the channel to remove residual solder flux from between the component and the electronic circuit board.