William T Doherty

US Patent:

20020121683, Sep 5, 2002

Filed:

Feb 26, 2002

Appl. No.:

10/085164

Inventors:

Stephen Kelly - Melrose MA, US
Kenneth Philpot - Nashua NH, US
Henricus Giesen - Didam, NL
William Doherty - Bedford MA, US

International Classification:

H01L023/495
H01L023/36

US Classification:

257/675000, 257/712000, 257/713000, 257/787000, 438/123000, 438/124000, 438/122000, 257/100000

Abstract:

An semiconductor device package () with improved thermal properties that limits unwanted parasitics and provides a more consistent distribution of parasitics from one device to another. The package of the present invention () is extremely compact and uses, in one embodiment, a minimal length of bond wires (and ) between the terminals (and ) and the attached device (). The path length of the package () is reduced so as to represent only some fraction of a wavelength relative to the terminals (and ) of the package (). By reducing the length of the bond wires (and ) and selecting the appropriate dielectric constant of the encapsulant (), the invention provides a package () with a unique hexagonal structure that limits the effects of parasitics and provides good thermal dissipation. In a second and third embodiment of the present invention, the semiconductor device package () is useful in optoelectronic devices such light emitting diodes with an anode () and a cathode (). The use of the novel design in this implementation also improves thermal properties and limits unwanted parasitics.