Consulting Human Resources Vendors Detail Oriented Consideration New York System Communication Brooklyn Healthcare Finance Deadline Driven Environments Public Finance Managed Care Mpp Municipalities Management Professional Manner Public Administration Precision Engineering Hospitals
Sriram P. Anjur - Aurora IL William C. Downing - Aurora IL
Assignee:
Cabot Corporation - Boston MA
International Classification:
B24D 1100
US Classification:
451526
Abstract:
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pad includes a bottom surface that is mechanically buffed to improve the adhesion of an adhesive to the pad bottom surface.