Sriram P. Anjur - Aurora IL William C. Downing - Aurora IL
Assignee:
Cabot Corporation - Boston MA
International Classification:
B24D 1100
US Classification:
451526
Abstract:
A polishing pad for polishing a semiconductor wafer which includes an open-celled, porous substrate having sintered particles of synthetic resin. The porous substrate is a uniform, continuous and tortuous interconnected network of capillary passage. The pad includes a bottom surface that is mechanically buffed to improve the adhesion of an adhesive to the pad bottom surface.