William L Jamison

US Patent:

54750407, Dec 12, 1995

Filed:

Jun 14, 1994

Appl. No.:

8/259340

Inventors:

William L. Jamison - Fishers IN
William H. Jenson - Indianapolis IN
George E. Sears - Indianapolis IN

Assignee:

Thermoset Plastics, Inc. - Indianapolis IN

International Classification:

C08K 300
C08L 6700

US Classification:

523513

Abstract:

Filled, thermoplastic-modified thermosetting polyester resin formulations are provided as encapsulants for microelectronics devices. The polyester encapsulant formulations include either a low profile thermoplastic resin additive or a combination of polyethylene and a low shrink thermoplastic additive. In preferred embodiments the polyester encapsulant formulations are of low viscosity and can be utilized in various pressure molding protocols. The encapsulant matrix is characterized by a low coefficient of thermal expansion, very low shrinkage, low modulus, and good thermal conductivity. Microelectronics devices encapsulated with the polyester resin formulation exhibit good resistance to moisture related and stress-induced failure.

US Patent:

51678519, Dec 1, 1992

Filed:

Apr 22, 1991

Appl. No.:

7/689147

Inventors:

William L. Jamison - Fishers IN
Gary J. Larsen - Carmel IN
George E. Sears - Indianapolis IN

Assignee:

Thermoset Plastics, Inc. - Indianapolis IN

International Classification:

C09K 500
H02B 100

US Classification:

252 74

Abstract:

A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic liquid polymer carrier, an antioxidant, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.

US Patent:

47905344, Dec 13, 1988

Filed:

Feb 13, 1986

Appl. No.:

6/829083

Inventors:

William L. Jamison - Noblesville IN

International Classification:

A63F 720
A63B 6936

US Classification:

273 872

Abstract:

A table-top golf game provides a game board, clubs, and balls, yielding a three-dimensional nature of play simulating that of conventional golf. The board has multi-textured surfaces as playing holes for golf, which include simulated greens, fairways, rough, water hazards and sand traps, and a plurality of tee areas located at varying distances from the greens in order to provide a variety of par three, four and five holes. The clubs have faces of varying angles to achieve shots of varying distances and heights; and, with the exception of the putter, the clubs are spring actuated and may be manipulated to cause various types of shots and trajectories of the game ball. The putter is manually actuated to provide maximum feel to the putting stroke. The ultra light balls have a density of only about 1. 3 to 1. 7 pounds per cubic foot, and an exterior surface of frictional character such that the combination gives the balls the ability to take advantageous backspin when properly struck, providing air-flight trajectory to all shots and causing the balls to stop or jump backwards, when alighting on the greens.

US Patent:

54750482, Dec 12, 1995

Filed:

Dec 7, 1993

Appl. No.:

8/163398

Inventors:

William L. Jamison - Fishers IN
Andrzej Moscicki - Lodz, PL

Assignee:

Thermoset Plastics, Inc. - Indianapolis IN

International Classification:

C08K 308
H01B 102

US Classification:

524439

Abstract:

Conductor-filled thermosetting resins having a free radical based cure chemistry are prepared for use as solder paste replacements for electrical conducting attachments of surface mount electronics components to printed circuit boards and as a die attach adhesive. The thermosetting resins exhibit rheological properties that allow them to be substituted for state-of-the-art solder paste and die attach adhesives. The conductor filled resins can be thermally cured in in-line processing operations to provide a low stress, substrate adherent, electrically conductive resin matrix.

US Patent:

52502090, Oct 5, 1993

Filed:

Apr 15, 1992

Appl. No.:

7/869530

Inventors:

William L. Jamison - Fishers IN
Gary J. Larsen - Carmel IN
George E. Sears - Indianapolis IN

Assignee:

Thermoset Plastics, Inc. - Indianapolis IN

International Classification:

C09K 500
H02B 100

US Classification:

252 74

Abstract:

A water washable thermally conductive grease useful for thermal coupling of electronic chips and heat sinks in electronic modules comprises a hydrophilic alkylene oxide modified silicone carrier, and up to 90 weight percent of a microparticulate thermally conductive filler. In a preferred embodiment, the thixotropic dielectric composition further comprises an antioxidant and an ionic surfactant to promote wetting/dispersion of the microparticulate filler. The thermally conductive grease is non-corrosive, resistant to shear induced phase destabilization and capable of being washed from module surfaces with aqueous solutions. Substitution of the present hydrophilic based greases for art-recognized solvent washable greases eliminates use of non-aqueous solvents in electronic module processing/reprocessing operations.