William C Ulland

US Patent:

20020192569, Dec 19, 2002

Filed:

May 15, 2001

Appl. No.:

09/858272

Inventors:

William Ulland - Duluth MN, US
Alexander Gybin - Duluth MN, US
Toshifumi Komatsu - Duluth MN, US
Claude Piguet - Cotton MN, US

Assignee:

The Chromaline Corporation

International Classification:

G03F009/00
G02F001/01
G02B026/00

US Classification:

430/005000, 430/007000, 359/238000

Abstract:

The present invention is directed to devices and methods for exposing photoreactive compositions. Specifically, the invention is directed to devices and methods for exposing photoreactive compositions with light from light emitting diodes (LEDs). In certain embodiments the device includes an apparatus for retaining a photosensitive substrate containing a photoreactive composition, a light emitting diode array containing a plurality of light emitting diodes, and a control mechanism for regulating the intensity and distribution of light emitted from the light emitting diode array. In such implementations the light emitting diodes are configured and arranged for controlled exposure of the photoreactive composition.

US Patent:

20030148217, Aug 7, 2003

Filed:

Jan 30, 2002

Appl. No.:

10/060753

Inventors:

Toshifumi Komatsu - Duluth MN, US
Kyle Johnson - Duluth MN, US
William Ulland - Duluth MN, US

International Classification:

G03F007/038
G03F007/12

US Classification:

430/273100, 430/306000, 430/308000

Abstract:

The present invention is directed to an ink receptive film and methods of using the ink receptive film. The ink receptive film is generally suitable for etching patterns into substrates, and typically includes a photosensitive laminate structure containing at least an ink receptive, radiation transmissive layer; and at least one photosensitive resist layer.

US Patent:

20040200805, Oct 14, 2004

Filed:

Dec 5, 2003

Appl. No.:

10/729620

Inventors:

William Ulland - Duluth MN, US
Alexander Gybin - Duluth MN, US
Jeremy Peterson - Superior WI, US
David Sarvela - Duluth MN, US

International Classification:

B44C001/22

US Classification:

216/089000

Abstract:

The present invention is directed to metal articles and methods of making the metal articles. The metal articles comprise a compression-formed particulate metal object, wherein a portion of the compression-formed particulate metal object has been selectively removed by an etching process from at least one surface of the object. The etching process is frequently performed using abrasive etching.