William B Walkup

US Patent:

6471535, Oct 29, 2002

Filed:

Dec 12, 2001

Appl. No.:

10/017876

Inventors:

William B. Walkup - Hillsboro OR
Nick Lin - Tu-Chen, TW

Assignee:

Hon Hai Precision Ind. Co., Ltd. - Taipei Hsien

International Classification:

H01R 13625

US Classification:

439342

Abstract:

An electrical socket ( ) for supporting a CPU to electrically connect with a PCB comprises a non-conductive base ( ) defining plural rows of through holes ( ), a plurality of terminals ( ) retained in corresponding through holes, and a slidable cover ( ) mounted on the base. Each terminal has a retaining portion ( ), a soldering portion ( ) and a mating beam ( ) extending from opposite ends of the retaining portion, respectively. The mating beam extends slantedly and upwardly from the retaining portion beyond a top face ( ) of the base for conductively contacting a corresponding pin ( ) of the CPU.

US Patent:

6519155, Feb 11, 2003

Filed:

Sep 24, 2001

Appl. No.:

09/962719

Inventors:

William B. Walkup - Hillsboro OR

Assignee:

Hon Hai Precision Ind. Co., Ltd. - Taipei Hsieh

International Classification:

H05K 720

US Classification:

361704, 165 803, 257719, 257722, 257727, 24458, 248510, 361719

Abstract:

A retainer device ( ) for attaching a heat sink ( ) to a CPU ( ) includes a retention module ( ) and a slider ( ). The retention module has a non-symmetrical opening ( ) in a side wall ( ) thereof, thus defining a slanted surface ( ) on the retention module. The slider defines a first slot ( ) accommodating a flange ( ) of the heat sink and the side wall of the retention module, and a second ramp slot ( ) opposite to the first slot for accommodating the slanted surface of the retention module. A locking spring ( ) is connected to the slider with a rotatable cam. The locking spring has a cantilever beam ( ), and a pressing portion ( ) pressing against the flange of the heat sink.

US Patent:

6758692, Jul 6, 2004

Filed:

Jul 8, 2002

Appl. No.:

10/191650

Inventors:

William B. Walkup - Hillsboro OR
Hung-Chi Yu - Tu-Chen, TW

Assignee:

Hon Hai Precision Ind. Co., Ltd. - Taipei Hsien

International Classification:

H01R 1300

US Classification:

439485, 4399281, 361704

Abstract:

A heat sink assembly includes a CPU mounted on a socket connector ( ) and a retention module ( ). The retention module comprises a pair of metal frames ( ), a pair of retaining claps ( ) and a pair of stop bars ( ) assembled together with the metal frames. Each frame defines a bottom wall ( ), a first side wall ( ) and a pair of second side walls ( ). Each retaining clip has a hook ( ) formed at a top of the retaining clip for hooking a corresponding stop bar, and a clamping portion ( ) formed at a bottom of the retaining clip. The clamping portion and a free end of the hook together clamp a side portion ( ) of a heat sink assembled to the socket connector.

US Patent:

6805561, Oct 19, 2004

Filed:

Jul 22, 2003

Appl. No.:

10/625237

Inventors:

William B. Walkup - Hillsboro OR
Fang-Jwu Liao - Tu-Chen, TW

Assignee:

Hon Hai Precision Ind. Co., Ltd. - Taipei Hsien

International Classification:

H01R 1200

US Classification:

439 66

Abstract:

An electrical socket for interconnecting an LGA chip with a PCB includes an insulative housing ( ) and a multiplicity of terminals ( ). The housing includes a plurality of passageways ( ) extending therethrough for engagingly accommodating corresponding terminals. Each terminal includes a locating plate ( ) arranged in rows, and a mating beam ( ) connected to the locating plate and extending along the corresponding row. The terminals and the mating beams are arranged so that a projection A of each mating beam along the corresponding row is longer than a distance B between each two adjacent locating plates of two adjacent terminals arranged in the same row. Accordingly, when the mating beams are engaged with electrodes of the LGA chip, the mating beams are long enough to provide excellent resilient deflection characteristics, thereby ensuring good mechanical and electrical connection between the mating beams and the electrodes.

US Patent:

6908313, Jun 21, 2005

Filed:

Oct 12, 2004

Appl. No.:

10/964457

Inventors:

William B. Walkup - Hillsboro OR, US
Fang-Jwu Liao - Tu-Chen, TW

Assignee:

Hon Hai Precision Ind. Co., Ltd. - Taipei Hsien

International Classification:

H01R012/00

US Classification:

439 66

Abstract:

An electrical socket for interconnecting an LGA chip with a PCB includes an insulative housing () and a multiplicity of terminals (). The housing includes a plurality of passageways () extending therethrough for engagingly accommodating corresponding terminals. Each terminal includes a locating plate () arranged in rows, and a mating beam () connected to the locating plate and extending along the corresponding row. The terminals and the mating beams are arranged so that a projection A of each mating beam along the corresponding row is longer than a distance B between each two adjacent locating plates of two adjacent terminals arranged in the same row. Accordingly, when the mating beams are engaged with electrodes of the LGA chip, the mating beams are long enough to provide excellent resilient deflection characteristics, thereby ensuring good mechanical and electrical connection between the mating beams and the electrodes.

US Patent:

59890495, Nov 23, 1999

Filed:

Dec 21, 1998

Appl. No.:

9/217683

Inventors:

William B. Walkup - Hillsboro OR
Wen-Chun Pei - Taipei, TW
Yao-Chi Huang - Yung-Ho, TW

Assignee:

Hon Hai Precision Ind. Co., Ltd. - Taipei Hsien

International Classification:

H01R 450

US Classification:

439342

Abstract:

A ZIF PGA socket includes a first housing and at least one second housing slidably received in the first housing. The at least one second housing defines a plurality of passageways for retaining corresponding number of contacts therein. Each contact has a first portion fixed in the passageway, a second portion fixed to a printed circuit board and a third portion deformably connected between the first portion and the second portion. When the at least one second housing is moved with respect to the printed circuit board, the third portion of the contact deforms to absorb stress to the second portion of the contact.

US Patent:

62101994, Apr 3, 2001

Filed:

Nov 24, 1999

Appl. No.:

9/449197

Inventors:

William B. Walkup - Hillsboro OR
Ming Lun Szu - Taipei, TW

Assignee:

Hon Hai Precision Ind. Co., Ltd. - Taipei Hsien

International Classification:

H01R 1122

US Classification:

439342

Abstract:

A locking mechanism is used in a pin grid array socket which comprises a movably housing and a stationary housing. The locking mechanism comprises a cam lever having a handle bar connected to a cam which is pivotally connected to the stationary housing and operative to drive the movable housing to move in opposite directions. An elongated channel is defined along the handle bar. A first reception groove is formed in the movable housing. A latch is movably and rotatably received in the elongated channel. A head of the latch is movably inserted into the first reception groove for locking the cam lever and preventing the movable housing from movement.

US Patent:

48508918, Jul 25, 1989

Filed:

Apr 4, 1988

Appl. No.:

7/176842

Inventors:

William B. Walkup - Barrington RI
Richard J. D'Amico - Cranston RI

Assignee:

Augat Inc. - Attleboro MA

International Classification:

H01R 1362

US Classification:

439326

Abstract:

An electronic memory module socket is provided in which a memory module is easily insertable into and removable from the socket, and once inserted is locked into position for good mechanical retension of the module and proper electrical contact between socket contacts and module contacts. Locking-arms disposed at respective ends of the socket cooperate with openings in the memory module's circuit board to lock the module into the socket body. Detents are provided at respective ends of the socket body to additionally latch the module.

Address:

144 Jones Rd, Shapleigh, ME 04076

VIN:

KMHDC8AE2BU100898

Make:

HYUNDAI

Model:

ELANTRA TOURING

Year:

2011