Wing H Ho

US Patent:

20120089793, Apr 12, 2012

Filed:

Oct 11, 2010

Appl. No.:

12/901872

Inventors:

Shadab Nazar - Sunnyvale CA, US
Mainak Sen - Fremont CA, US
Wing L. Ho - Fremont CA, US
Ananda Shah - San Francisco CA, US

Assignee:

CISCO TECHNOLOGY, INC. - San Jose CA

International Classification:

G06F 12/00

US Classification:

711155, 711E12001

Abstract:

A memory device and related techniques are provided to modify data stored in the memory device without the need to send the data to an external device. A command is received at the memory device to modify data stored at a memory location in a memory array of the memory device. The command includes a value to be used for modifying the data. The memory device reads data from the memory location. The data read from the memory location is modified with modify circuit in the memory device based on the value obtained form the command to produce results data. The results data produced by the modify circuit is written back to the memory location. Since the memory device does not need to send the data read from the memory array off-chip to another device, referred to herein as a host device, to update the data, the input/output bandwidth of the bandwidth is substantially reduced, allowing for lower power memory device operation and reduced latency.

US Patent:

60114746, Jan 4, 2000

Filed:

Apr 28, 1998

Appl. No.:

9/067333

Inventors:

Kevin R. Coffey - Fremont CA
Wing K. Ho - Boynton Beach FL
Richard L. Copeland - Boca Raton FL

Assignee:

Sensormatic Electronics Corporation - Boca Raton FL

International Classification:

G08B 1314

US Classification:

3405723

Abstract:

A single deactivation device is used to deactivate both harmonic type EAS markers and magnetomechanical type EAS markers. The deactivation device includes a housing, and a permanent magnet and a coil disposed within the housing. The coil is circular and is arranged concentrically with, and outside of, the permanent magnet. The permanent magnet forms a DC magnetic field for deactivating the harmonic type marker by magnetizing control elements thereof. The coil is driven to generate an AC magnetic field that deactivates the magnetomechanical type marker by degaussing a control element thereof. The maximum amplitude of the AC magnetic field is lower than the level of the DC magnetic field, and is substantially below the coercivity of the control elements of the harmonic type marker. The coercivity of the control element of the magnetomechanical type marker is low enough to be degaussed by the AC magnetic field.

US Patent:

20180154544, Jun 7, 2018

Filed:

Jan 9, 2018

Appl. No.:

15/866411

Inventors:

- Santa Clara CA, US
Wing K. Ho - Cupertino CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B26F 3/12
G06F 1/16
B29L 31/34

Abstract:

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.

US Patent:

20160279862, Sep 29, 2016

Filed:

Mar 27, 2015

Appl. No.:

14/671760

Inventors:

- Santa Clara CA, US
Wing K. Ho - Cupertino CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

B29C 65/48
B29C 65/02

Abstract:

Methods and apparatus relating to provision and/or utilization of a hidden feature for accessing and/or repairing mobile devices are described. An embodiment includes a wire physically adjacent to an adhesive. The adhesive bonds a first portion of a computing device and a second portion of the computing device. The wire is capable of being heated in response to application of electrical voltage or current. In turn, the heated wire causes cutting of the adhesive to allow for physical separation of the first portion of the computing device and the second portion of the computing device. Another embodiment utilizes a hidden end of an opening in a computing device to hide a fastener. Other embodiments are also disclosed and claimed.