Xiaochun Li

US Patent:

6944360, Sep 13, 2005

Filed:

Jan 29, 2004

Appl. No.:

10/768270

Inventors:

Xiaochun Li - Stanford CA, US
Friedrich Prinz - Woodside CA, US
Anastasios Golnas - San Francisco CA, US

Assignee:

The Board of Trustees of the Leland Stanford Junior University - Stanford CA

International Classification:

G02B006/00
G02B006/44
G01J005/08
G01K011/32

US Classification:

385 12, 385107, 385128, 25022713, 25022718, 374161

Abstract:

A sensor embedded in a high temperature metal is incorporated into a sensing system for measuring temperature, strain, or other properties of a metal structure. An optical system transmits light to and receives output signals from the sensor for analysis. With rotating structures, an optical fiber lead transmits light between the sensor and external surface of the structure along its rotational axis, allowing the lead to remain fixed with respect to the optical system as the structure rotates at high speeds.

US Patent:

7316748, Jan 8, 2008

Filed:

May 7, 2004

Appl. No.:

10/841227

Inventors:

Xiaochun Li - Madison WI, US
Yong Yang - Madison WI, US
Hongseok Choi - Madison WI, US

Assignee:

Wisconsin Alumni Research Foundation - Madison WI

International Classification:

B05C 19/00
B05B 3/14

US Classification:

118308, 118612, 118303, 2391022, 239659, 222200

Abstract:

An apparatus and method of dispensing small-scale powders for a variety of applications, including, for example, fabricating a three-dimensional heterogeneous small-scale device, includes using a feed mechanism that causes motion of the powder particles and the steps of depositing fine heterogeneous materials (such as dry powders and biological materials) towards a substrate. The depositing step preferably includes providing a feed mechanism having an input to receive the material, an output, and a source of ultrasonic vibration to impart a torsional force on the material so as to precisely discharge the material from the output. To improve particle flowability, a cooling system is provided to cool the source, generally above a threshold input voltage.

US Patent:

7509993, Mar 31, 2009

Filed:

Aug 13, 2005

Appl. No.:

11/202851

Inventors:

Lih-Sheng Turng - Madison WI, US
Michael P. DeCicco - Madison WI, US
Xiaochun Li - Madison WI, US

Assignee:

Wisconsin Alumni Research Foundation - Madison WI

International Classification:

B22D 19/14
B22D 17/00
B22D 27/04
B22D 27/08

US Classification:

164 97, 164 711, 164113, 164900

Abstract:

A metal matrix nanocomposite is formed by heating a metal above its liquidus temperature, adding nanoparticles, and then agitating the mixture with high-frequency (and preferably ultrasonic) vibration. The mixture can then be cooled below the liquidus of the metal to a semisolid state, and placed in a mold to form it into some desired shape. The formed mixture can then be quenched or otherwise allowed to cool to provide an article in finished (or nearly so) form.

US Patent:

7572665, Aug 11, 2009

Filed:

Oct 21, 2005

Appl. No.:

11/255892

Inventors:

Arindom Datta - Madison WI, US
Xiaochun Li - Madison WI, US
Hongseok Choi - Madison WI, US

Assignee:

Wisconsin Alumni Research Foundation - Madison WI

International Classification:

H01L 21/00

US Classification:

438 64, 438 57, 438106, 438125, 257433, 257E21502, 257E21511

Abstract:

Fabricating a microelectronics grade metal substrate comprises forming the metal substrate on a sacrificial substrate. An adhesion layer can be deposited on or over the surface of the sacrificial substrate. A seed layer of the metal can be deposited on or over the adhesion layer. The metal material can be deposited on the seed layer by electroplating or other low-temperature, low-stress process to form a microelectronics-grade metal substrate. Thin film sensors and/or other microelectronic devices, followed by appropriate insulating layer(s), may be fabricated on or over the sacrificial substrate before forming the metal substrate. The sacrificial silicon substrate can then be etched away, leaving the microelectronics-grade metal substrate, and possibly the microelectronics device. Another insulating layer(s), followed by another adhesion layer, another seed layer and additional amounts of the material forming the metal substrate can then be deposited over the now-exposed microelectronics device to encapsulate it within a metal shell.

US Patent:

7840101, Nov 23, 2010

Filed:

Jan 3, 2007

Appl. No.:

12/160043

Inventors:

Chee Wei Wong - New York NY, US
Rohit Chatterjee - Chennai, IN
Xiaochun Li - Madison WI, US
Xugang Zhang - Milwaukee WI, US

Assignee:

The Trustees of Columbia University in the City of New York - New York NY

International Classification:

G02B 6/00
G01N 21/00

US Classification:

385 12, 385 13, 3562438, 398 33, 398 82

Abstract:

Systems and methods for sensing properties of a workpiece and embedding a photonic sensor in metal are disclosed herein. In some embodiments, systems for sensing properties of a workpiece include an optical input, a photonic device, an optical detector, and a digital processing device. The optical input provides an optical signal at an output of the optical input. The photonic device is coupled to the workpiece and to the output of the optical input. The photonic device generates an output signal in response to the optical signal, wherein at least one of an intensity of the output signal and a wavelength of the output signal depends on at least one of thermal characteristics and mechanical characteristics of the workpiece. The optical detector receives the output signal from the photonic device and is configured to generate a corresponding electronic signal. The digital processing device is coupled to the optical detector and determines at least one of the thermal characteristics and mechanical the characteristics of the workpiece based on the electronic signal.

US Patent:

8103086, Jan 24, 2012

Filed:

Aug 30, 2010

Appl. No.:

12/871821

Inventors:

Ruifang Shi - Cupertino CA, US
Xiaochun Li - San Jose CA, US

Assignee:

KLA-Tencor Corporation - Milpitas CA

International Classification:

G06K 9/62

US Classification:

382144

Abstract:

Provided are novel inspection methods and systems for inspecting photomasks to identify various defects using a model-based approach and information obtained from modeled images. Modeled or simulation images are generated directly from test or reference images. Some examples include aerial images that represent expected patterns projected by a lithography system on a substrate as well as photoresist images that represent expected resist patterns. Test images are first represented as a band limited mask pattern, which may include only linear terms for faster image processing. This pattern is then used to construct a modeled image, which in turn is used to construct a model-based feature map. This map serves as a base for inspecting the original test images to identify photomask defects and may include information that allows differentiating between various feature types based on their lithographic significance and other characteristics.

US Patent:

8351742, Jan 8, 2013

Filed:

Oct 15, 2010

Appl. No.:

12/905974

Inventors:

Chee Wei Wong - New York NY, US
Rohit Chatterjee - Chennai, IN
Xiaochun Li - Madison WI, US
Xugang Zhang - Madison WI, US

Assignee:

The Trustees of Columbia University in the City of New York - New York NY

International Classification:

G02B 6/00
B05D 3/10

US Classification:

385 12, 385 13, 216 2, 216 24

Abstract:

Systems and methods for sensing properties of a workpiece and embedding a photonic sensor in metal are disclosed herein. In some embodiments, systems for sensing properties of a workpiece include an optical input, a photonic device, an optical detector, and a digital processing device. The optical input provides an optical signal at an output of the optical input. The photonic device is coupled to the workpiece and to the output of the optical input. The photonic device generates an output signal in response to the optical signal, wherein at least one of an intensity of the output signal and a wavelength of the output signal depends on at least one of thermal characteristics and mechanical characteristics of the workpiece. The optical detector receives the output signal from the photonic device and is configured to generate a corresponding electronic signal. The digital processing device is coupled to the optical detector and determines at least one of the thermal characteristics and mechanical the characteristics of the workpiece based on the electronic signal.

US Patent:

8454817, Jun 4, 2013

Filed:

Jul 14, 2009

Appl. No.:

12/502540

Inventors:

Huifang Xu - Madison WI, US
Kuang-Sheng Hong - Madison WI, US
Xiaochun Li - Madison WI, US

Assignee:

Wisconsin Alumni Research Foundation - Madison WI

International Classification:

C25B 1/04

US Classification:

205637, 205628

Abstract:

A mechanism of initiating a redox reaction, such as hydrogen gas production by direct-water-splitting, is provided in which a piezoelectric material is mechanically stressed by actively applying a mechanical stress to the material. The mechanical stress applied to the piezoelectric material causes an electrical potential build up on the surface of the material due to the piezoelectric properties of the material. When the piezoelectric material stressed in this manner is placed in direct contact with the redox reaction reactant(s), the potential on the polarized surface can be used as chemical driving energy to initiate the reaction, such as to split water and generate hydrogen gas. In this manner the mechanical energy applied to the piezoelectric material, such as vibration energy from natural or man-made sources, can be converted directly into chemical energy to initiate the reaction.