- Fremont CA, US Praveen NALLA - Fremont CA, US Xiaomin BIN - San Jose CA, US Nanhai LI - Pleasanton CA, US Yaxin WANG - Fremont CA, US Patrick LITTLE - Brentwood CA, US Marina POLYANSKAYA - Morgan Hill CA, US
International Classification:
H01L 21/288 C23C 18/16 C23C 18/50 C23C 18/34
Abstract:
A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.
Electroless Plating With At Least Two Borane Reducing Agents
- Fremont CA, US Praveen NALLA - Fremont CA, US Xiaomin BIN - San Jose CA, US Nanhai LI - Pleasanton CA, US Yaxin WANG - Fremont CA, US Patrick LITTLE - Brentwood CA, US Marina POLYANSKAYA - Morgan Hill CA, US
International Classification:
C23C 18/34 H01L 21/288 C23C 18/16
Abstract:
A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.