Xiaomin Bin

age ~49

from San Jose, CA

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Xiaomin Bin Phones & Addresses

  • San Jose, CA
  • Fremont, CA

Work

  • Company:
    Lam research
  • Position:
    Scientist

Resumes

Xiaomin Bin Photo 1

Scientist

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Location:
Fremont, CA
Work:
Lam Research
Scientist

Us Patents

  • Electroless Plating Solution With At Least Two Borane Containing Reducing Agents

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  • US Patent:
    20170092499, Mar 30, 2017
  • Filed:
    Dec 8, 2016
  • Appl. No.:
    15/372785
  • Inventors:
    - Fremont CA, US
    Praveen NALLA - Fremont CA, US
    Xiaomin BIN - San Jose CA, US
    Nanhai LI - Pleasanton CA, US
    Yaxin WANG - Fremont CA, US
    Patrick LITTLE - Brentwood CA, US
    Marina POLYANSKAYA - Morgan Hill CA, US
  • International Classification:
    H01L 21/288
    C23C 18/16
    C23C 18/50
    C23C 18/34
  • Abstract:
    A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.

  • Electroless Plating With At Least Two Borane Reducing Agents

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  • US Patent:
    20150354064, Dec 10, 2015
  • Filed:
    Jun 5, 2014
  • Appl. No.:
    14/297352
  • Inventors:
    - Fremont CA, US
    Praveen NALLA - Fremont CA, US
    Xiaomin BIN - San Jose CA, US
    Nanhai LI - Pleasanton CA, US
    Yaxin WANG - Fremont CA, US
    Patrick LITTLE - Brentwood CA, US
    Marina POLYANSKAYA - Morgan Hill CA, US
  • International Classification:
    C23C 18/34
    H01L 21/288
    C23C 18/16
  • Abstract:
    A solution for providing electroless deposition of a metal layer on a substrate is provided. A solvent is provided. A metal precursor is provided to the solvent. A first borane containing reducing agent is provided to the solvent. A second borane containing reducing agent is provided to the solvent, wherein the first borane containing reducing agent has a deposition rate of at least five times a deposition rate of the second borane containing reducing agent, and wherein the solution is free of nonborane reducing agents.
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