Xiaoming Yin - Hopewell Junction NY Tim Wiltshire - Fishkill NY Alfred Wong - Beacon NY Don Wheeler - Beacon NY
Assignee:
Infineon Technologies AG - Munich International Business Machines Corporation - Armonk NY
International Classification:
G01B 1100
US Classification:
356400, 356369
Abstract:
An optical alignment system used in the manufacture of semiconductor integrated circuits determines and adjusts the alignment between features which have been formed on a semiconductor wafer and features on a mask which is being projected onto the semiconductor wafer. Light which illuminates the semiconductor wafer is scattered and diffracted into a dark-field detector system. This results in the generation of electrical signals which are used to position the mask relative to the semiconductor wafer. The use of polarized light in the present system results in an increase in the magnitude of the desired signals and a decrease in the magnitude of the spurious signals. To improve the quality of the signals, the angle of polarization of the light is adjusted to a specific relationship with respect to the geometry of the alignment marks on the semiconductor wafer.
A method of forming a reflecting surface on an optical component is disclosed. The method includes forming a first mask so as to protect a ridge region of a light transmitting medium. The ridge region is a region where a ridge of a waveguide will be formed. The method also includes performing a first etch of the light transmitting medium so as to form a side of the ridge. The first mask defines a profile of the side of the ridge during the first etch. The method further includes performing a second etch of the light transmitting medium so as to form the reflecting surface. The first mask defines a profile of the reflecting surface during the second etch.
Efficient Coupling Of Optical Fiber To Optical Component
A method of preparing an optical component for coupling with an optical fiber is disclosed. The method includes determining a thickness of a buffer layer formed on the optical component. The method also includes forming an anti reflective coating adjacent to the buffer layer. The anti reflective coating is formed to a thickness selected in response to the determined buffer layer thickness.
Enhanced Overlay Measurement Marks For Overlay Alignment And Exposure Tool Condition Control
Xiaoming Yin - Hopewell Junction NY Christopher Gould - Glen Allen VA Gerhard Kunkel - Fishkill NY
Assignee:
Infineon Technologies AG - Munich
International Classification:
G01B 1100
US Classification:
356400, 430 22
Abstract:
In an overlay measurement mark comprising an inner box and an outer box located at a predetermined area on a mask through which patterns are formed on a semiconductor device, the improvement of an overlay mark that extends the overlay measurement range comprising: in-focused marks means printed at an optimal or ideal focal plane level from an illumination source, and de-focused marks means located at a different focus level from the optimal focal plane to provide image placement shift of the de-focused marks larger than that of the in-focused marks means to enable measurement of the shift of de-focused marks that are not attributable to a mechanical alignment error to be determined with greater accuracy.
An add/drop node is disclosed. The add/drop node includes a first filter configured to receive a light beam having a plurality of channels. The first filter is also configured to direct channels having wavelengths falling within a plurality of first wavelength bands to a transition waveguide. The add/drop node also includes a second filter configured to receive the channels directed to the transition waveguide. The second filter is configured to direct channels having wavelengths falling within a plurality of second wavelength bands to a drop waveguide. The first filter and/or the second filter can be tunable.
Shih-Hsiang Hsu - Pasadena CA, US Dazeng Feng - Arcadia CA, US Cheng-Chih Kung - Alhambra CA, US Xiaoming Yin - Pasadena CA, US Trenton Gary Coroy - Rancho Cucamunga CA, US
Assignee:
Kotusa, Inc. - Monterey Park CA
International Classification:
G02B006/26
US Classification:
385 48, 385 88
Abstract:
An optical component is disclosed. The optical component includes a tap waveguide and a primary waveguide positioned on a base. The tap waveguide is configured to receive a portion of a light signal traveling along the primary waveguide. The portion of the light signal received by the tap waveguide is the tapped portion of the light signal. A direction changing region is configured to receive the tapped portion of the light signal from the tap waveguide and to direct the tapped portion of the light signal travels away from the base. A light sensor is configured to receive the tapped portion of the light signal from the direction changing region.
Optical Component Having Waveguides Extending From A Common Region
Wei Qian - Torrance CA, US Dazeng Feng - Arcadia CA, US Dawei Zheng - Los Angeles CA, US Joan Yiqiong Fong - San Marino CA, US Zhian Shao - Torrance CA, US Xiaoming Yin - Pasadena CA, US
Assignee:
Kotura, Inc. - Monterey Park CA
International Classification:
B29D011/00
US Classification:
216 24
Abstract:
A method of forming an optical component includes forming a first mask on an optical component precursor. The first mask is formed with a plurality of waveguide portions extending from a common portion. Each waveguide portion is positioned so as to protect a waveguide region of the optical component precursor where a waveguide is to be formed. The method also includes forming a second mask between waveguide portions of the first mask. The resistance of the second mask to etching varies along at least one dimension of the second mask.
Liwei Wang - Arcadia CA, US Dazeng Feng - Arcadia CA, US Xiaoming Yin - Pasadena CA, US Trenton Gary Coroy - Rancho Cucamonga CA, US
Assignee:
Kotura, Inc. - Monterey Park CA
International Classification:
G02B006/26
US Classification:
385 15, 372 50, 359629
Abstract:
An optical device having one or more optical components is disclosed. A waveguide extends from an optical component to a testing port configured to receive a light signal from a position over the optical device and to insert the light signal into the waveguide. In some instances, the testing port is configured to receive a light signal from the waveguide and to direct the light signal to a location over the optical device. The optical device can be positioned on a wafer before being separated from the wafer. The waveguide can extend from an optical component over the perimeter of the optical device such that the testing ports are located outside the perimeter of the optical device.