2011 to 2000 Senior Analyst Schedule PlanningFEDERAL AVIATION ADMINSTRATION (FAA) Washington, DC 2006 to 2011 Operation Research AnalystNATIONAL CENTER OF EXCELLENCE FOR AVIATION OPERATIONS RESEARCH (NEXTOR) Berkeley, CA 2005 to 2006 Graduate Research Assistant
Education:
NEW YORK UNIVERSITY New York, NY Jan 2015 Master of Business Administration in SpecializationsUNIVERSITY OF CALIFORNIA, BERKELEY Berkeley, CA Jun 2014UC Berkeley 2001
Hwan J. Jeong - Los Altos CA, US Xing Chen - San Jose CA, US
Assignee:
Gazillion Bits, Inc. - San Jose CA
International Classification:
G20B006/42
US Classification:
385 39, 385 24, 359497, 398 82
Abstract:
An optical interleaver is described, comprising a splitting element for splitting an incident beam into a first optical signal directed along a first path and a second optical signal directed along a second path, a first resonant element positioned along the first path, a second resonant element positioned along the second path, and a combining element positioned to receive and to interferometrically combine the outputs of the first and second resonant to produce the output signal. The optical interleaver may be implemented using a free-space configuration using a beamsplitter and a plurality of resonant cavities such as asymmetric Fabry-Perot resonators or Michelson-Gires-Tournois resonators. In an alternative preferred embodiment, the optical interleaver may be implemented in a Mach-Zender-style configuration using couplers and fiber ring resonators.
A valve for an inflatable includes both inflation/deflation and pressure release functions. The valve has a housing which receives a core, a spring, and a nut. The nut is threadably received by the core and slidably received by the housing, and holds the core and spring in place within the housing. The inflation function includes a one way valve, and the release pressure of the pressure release function may both be adjusted and disabled.
Disclosed is a multi-modular maze device comprising a plurality of maze modules interconnected using a plurality of adaptors to configure a plurality of interconnected pathways. The maze modules and the adaptors are removably engaged to each other using hook and loop fastening arrangements. The maze device is capable of being removably installed on a supporting surface (for example, floor), either outdoor or indoor.
Inflatable Enclosure And Inflatable Enclosure System
An inflatable enclosure comprises a plurality of modular inflatable wall structures connected to one other, the inflatable wall structures comprising inflatable walls and supporting structures. An inflatable enclosure system comprises a plurality of modular inflatable wall structures, at least one entrance module, and fans connected to the inflatable wall structure of the inflatable enclosure.
Shu Jin - Sunnyvale CA Xiao Chun Mu - Saratoga CA Xing Chen - Cambridge MA Lawrence Bourget - Reading MA
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05H 130
US Classification:
427575
Abstract:
A method for forming a material in an opening on a substrate, such as a wafer, using an electron cyclotron resonance-assisted high density plasma physical vapor deposition system. The method comprises the steps of: maintaining a pressure in the range of approximately 1 mTorr to approximately 6 mTorr; generating a plasma by providing a microwave power in the range of approximately 3 kilowatts (kW) to approximately 5 kW; applying a direct current (DC) voltage to a target source of the material in the range of approximately (negative) -600 volts to approximately -1000 volts; providing a current of a predetermined amount to a first electromagnet; and providing a current to a second electromagnet that is less than said predetermined amount, wherein said second electromagnet is disposed below said first electromagnet; and forming a layer of the material in the opening.
Shing Lee - Fremont CA Mehrdad Nikoonahad - Menlo Park CA Xing Chen - San Jose CA
Assignee:
Kla-Tencor Corporation - San Jose CA
International Classification:
G01J 400 G01N 2100
US Classification:
356369
Abstract:
The surface of a doped semiconductor wafer is heated locally by means of a pump beam whose intensity is modulated at a first frequency. The heated area is sampled by a probe beam whose intensity is modulated at a second frequency. After the probe beam has been modulated (reflected or transmitted) at the first frequency by the wafer, the modulated probe beam is detected at a frequency equal to the difference between the harmonics of the first and second frequencies to determine dose of the dopants in the wafer. Such or similar type of instrument for measuring dose may be combined with an ellipsometer, reflectometer or polarimeter for measuring dose as well as thickness(es) and/or indices of refraction in a combined instrument for measuring the same sample.
Use Of Pulsed-Dc Wafer Bias For Filling Vias/Trenches With Metal In Hdp Physical Vapor Deposition
Zheng Xu - Foster City CA Kenny King-tai Ngan - Fremont CA Xing Chen - Cambridge MA John Urbahn - Hampstead NH Lawrence P. Bourget - Reading MA
Assignee:
Applied Materials, Inc. - Santa Clara CA
International Classification:
C23C 1434
US Classification:
2041923
Abstract:
The present invention provides a method and apparatus for preferential PVD conductor fill in an integrated circuit structure. The present invention utilizes a high density plasma for sputter deposition of a conductive layer on a patterned substrate, and a pulsed DC power source capacitively coupled to the substrate to generate an ion current at the surface of the substrate. The ion current prevents sticking of the deposited material to the field areas of the patterned substrate, or etches deposited material from the field areas to eliminate crowning or cusping problems associated with deposition of a conductive material in a trench, hole or via formed on the substrate.
- Santa Clara CA, US Xing CHEN - Dublin CA, US Keith A. MILLER - Mountain View CA, US Jothilingam RAMALINGAM - Milpitas CA, US Jianxin LEI - Fremont CA, US
International Classification:
C23C 14/34 H01J 37/32
Abstract:
Methods and apparatus for passivating a target are provided herein. For example, a method includes a) supplying an oxidizing gas into an inner volume of the process chamber; b) igniting the oxidizing gas to form a plasma and oxidize at least one of a target or target material deposited on a process kit disposed in the inner volume of the process chamber; and c) performing a cycle purge comprising: c1) providing air into the process chamber to react with the at least one of the target or target material deposited on the process kit; c2) maintaining a predetermined pressure for a predetermined time within the process chamber to generate a toxic by-product caused by the air reacting with the at least one of the target or target material deposited on the process kit; and c3) exhausting the process chamber to remove the toxic by-product.