Yin Lin

US Patent:

6436820, Aug 20, 2002

Filed:

Feb 3, 2000

Appl. No.:

09/497787

Inventors:

Jianhua Hu - Sunnyvale CA
Yin Lin - Mountain View CA
Fufa Chen - Cupertino CA
Yehuda Demayo - San Jose CA
Ming Xi - Sunnyvale CA

Assignee:

Applied Materials, Inc - Santa Clara CA

International Classification:

H01L 21324

US Classification:

438656, 438663, 438680, 438685, 427255391

Abstract:

The present disclosure pertains to the discovery that TiN films having a thickness of greater than about 400 and, particularly greater than 1000 , and a resistivity of less than about 175 cm, can be produced by a CVD technique in which a series of TiN layers are deposited to form a desired TiN film thickness. Each layer is deposited employing a CVD deposition/treatment step. During a treatment step, residual halogen (typically chlorine) was removed from the CVD deposited film. Specifically, a TiN film having a thickness of greater than about 400 was prepared by a multi deposition/treatment step process where individual TiN layers having a thickness of less than 400 were produced in series to provide a finished TiN layer having a combined desired thickness. Each individual TiN layer was CVD deposited and then treated by exposing the TiN surface to ammonia in an annealing step carried out in an ammonia ambient. The TiN film formed in this manner not only had a resistivity of less than about 175 cm, but was substantially free of micro cracks as well, including films having a thickness greater than 1,000.

US Patent:

20030003696, Jan 2, 2003

Filed:

Jun 29, 2001

Appl. No.:

09/896124

Inventors:

Avgerinos Gelatos - Redwood City CA, US
Joel Huston - San Jose CA, US
Lawrence Lei - Milipitas CA, US
Vicky Nguyen - San Jose CA, US
Yin Lin - Palo Alto CA, US
Fong Chang - Los Gatos CA, US

International Classification:

H01L021/36
H01L021/20
C30B001/00

US Classification:

438/485000, 438/507000, 438/935000

Abstract:

Generally, a substrate processing apparatus is provided. In one aspect of the invention, a substrate processing apparatus is provided. In one embodiment, the substrate processing apparatus includes one or more chamber bodies coupled to a gas distribution system. The chamber bodies define at least a first processing region and a second processing region within the chamber bodies. The gas distribution system includes a first, a second and a third gas supply circuit. The first gas supply circuit is teed between the first and second processing regions and is adapted to supply a first processing gas thereto. The second gas supply circuit is coupled to the first processing region and adapted to supply a second process gas thereto. The third gas supply circuit is coupled to the second processing region and is adapted to supply a third process gas thereto. Alternatively, the processing regions may be disposed in a single chamber body.

US Patent:

62211749, Apr 24, 2001

Filed:

Feb 11, 1999

Appl. No.:

9/248869

Inventors:

Fufa Chen - Cupertino CA
Yin Lin - Mountain View CA
Jianhua Hu - Sunnyvale CA
Frederick Wu - Cupertino CA
Ming Xi - Milpitas CA
Li Wu - Fremont CA

Assignee:

Applied Materials, Inc. - Santa Clara CA

International Classification:

C23C 824

US Classification:

148237

Abstract:

The present invention is a method of wafer processing which improves the reliability of an integrated titanium (Ti)/titanium nitride (TiN) CVD film formed from a reaction of titanium tetrachloride (TiCi. sub. 4) and ammonia (NH. sub. 3). A Ti film is subject to a treatment of NH. sub. 3 gas to render the Ti film unreactive towards attack by chlorine and hydrogen chloride. A thin seed layer of TiN film is deposited upon the treated Ti film using a thermal TiCl. sub. 4 /NH. sub. 3 reaction. Subsequent TiN film deposition upon the seed layer results in a successful integration of a Ti/TiN film stack for a Ti film thickness up to about 300. ANG.

US Patent:

20200177670, Jun 4, 2020

Filed:

Feb 9, 2020

Appl. No.:

16/785620

Inventors:

- Palo Alto CA, US
Sairam Venugopal - San Mateo CA, US
Yin Lin - Mountain View CA, US
Anand Kumar - Sunnyvale CA, US
Nithin Bangalore Raju - Sunnyvale CA, US
Mukesh Hira - Palo Alto CA, US
Ganesan Chandrashekhar - Campbell CA, US
Vivek Agarwal - Campbell CA, US

International Classification:

H04L 29/08
H04L 12/931
H04W 12/00
H04L 29/06
H04L 12/24

Abstract:

A physical host machine of a public cloud system includes a set of processing units for executing instructions stored in non-transitory machine readable media. The physical host machine also includes a physical network interface cars (PNIC) and a non-transitory machine readable medium that stores a data compute node (DCN). The DCN includes first and second applications, first and second logical interfaces, a network stack, and a managed forwarding element (MFE). The first application is connected to the pNIC through the network stack, the first logical interface, and the MFE. The second application is connected to the PNIC through the network stack, the second logical interface, and the MFE.

US Patent:

20190068493, Feb 28, 2019

Filed:

Aug 24, 2017

Appl. No.:

15/686098

Inventors:

- Palo Alto CA, US
Sairam Venugopal - San Mateo CA, US
Yin Lin - Mountain View CA, US
Anand Kumar - Sunnyvale CA, US
Nithin Bangalore Raju - Santa Clara CA, US
Mukesh Hira - Los Altos CA, US
Ganesan Chandrashekhar - Campbell CA, US
Vivek Agarwal - Campbell CA, US

International Classification:

H04L 12/713
H04L 12/707
H04L 12/46
G06F 9/50

Abstract:

A data compute node executes (i) a set of tenant applications connected to a third party overlay network, (ii) a set of network manager applications, and (iii) a managed forwarding element that includes a pair of overlay and underlay network virtual adapters. A packet that is received from a network manager application and addressed to an underlay network destination is sent to the underlay network destination address through a physical NIC of the host without network address translation or encapsulation. A packet that is received from a tenant application and addressed to an underlay network destination is subject to SNAT and is sent to the underlay network destination address. A packet that is received from a tenant application and is addressed an overlay destination address is encapsulated with the header of the overlay network and is sent to the overlay network destination address through the underlay virtual adapter.

US Patent:

20190068689, Feb 28, 2019

Filed:

Aug 24, 2017

Appl. No.:

15/686093

Inventors:

- Palo Alto CA, US
Sairam Venugopal - San Mateo CA, US
Yin Lin - Mountain View CA, US
Anand Kumar - Sunnyvale CA, US
Nithin Bangalore Raju - Santa Clara CA, US
Mukesh Hira - Los Altos CA, US
Ganesan Chandrashekhar - Campbell CA, US
Vivek Agarwal - Campbell CA, US

International Classification:

H04L 29/08
H04L 12/931

Abstract:

A physical host machine of a public cloud system includes a set of processing units for executing instructions stored in non-transitory machine readable media. The physical host machine also includes a physical network interface cars (PNIC) and a non-transitory machine readable medium that stores a data compute node (DCN). The DCN includes first and second applications, first and second logical interfaces, a network stack, and a managed forwarding element (MFE). The first application is connected to the pNIC through the network stack, the first logical interface, and the MFE. The second application is connected to the PNIC through the network stack, the second logical interface, and the MFE.