Andrew C. McNeil - Chandler AZ, US Yizhen Lin - Gilbert AZ, US Todd F. Miller - Scottsdale AZ, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
G01P 15/125
US Classification:
7351432
Abstract:
A differential capacitive sensor () includes a movable element () pivotable about a rotational axis (). The movable element () includes first and second sections (). The first section () has an extended portion () distal from the rotational axis (). A static layer () is spaced away from a first surface () of the moveable element (), and includes a first actuation electrode (), a first sensing electrode (), and a third sensing electrode (). A static layer () is spaced away from a second surface () of the moveable element () and includes a second actuation electrode (), a second sensing electrode (), and a fourth sensing electrode (). The first and second electrodes () oppose the first section (), the third and fourth electrodes () oppose the second section (), and the first and second electrodes () oppose the extended portion ().
Transducer With Decoupled Sensing In Mutually Orthogonal Directions
Yizhen Lin - Gilbert AZ, US Andrew C. McNeil - Chandler AZ, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
G01P 15/125
US Classification:
7351432
Abstract:
A microelectromechanical systems (MEMS) transducer () is adapted to sense acceleration in mutually orthogonal directions (). The MEMS transducer () includes a proof mass () suspended above a substrate () by an anchor system (). The anchor system () pivotally couples the proof mass () to the substrate () at a rotational axis () to enable the proof mass () to rotate about the rotational axis () in response to acceleration in a direction (). The proof mass () has an opening () extending through it. Another proof mass () resides in the opening (), and another anchor system () suspends the proof mass () above the surface () of the substrate (). The anchor system () enables the proof mass () to move substantially parallel to the surface () of the substrate () in response to acceleration in at least another direction ().
Capacitive Sensor With Stress Relief That Compensates For Package Stress
Yizhen Lin - Gilbert AZ, US Andrew C. McNeil - Chandler AZ, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
G01P 15/125
US Classification:
7351432, 295921
Abstract:
A microelectromechanical systems (MEMS) capacitive sensor () includes a movable element () pivotable about a rotational axis () offset between ends () thereof. A static conductive layer () is spaced away from the movable element () and includes electrode elements (). The movable element () includes a section () between the rotational axis () and one end () that exhibits a length (). The movable element () further includes a section () between the rotational axis () and the other end () that exhibits a length () that is less than the length () of the section (). The section () includes slots () extending through movable element () from the end () toward the rotational axis (). The slots () provide stress relief in section () that compensates for package stress to improve sensor performance.
Aaron A. Geisberger - Phoenix AZ, US Yizhen Lin - Gilbert AZ, US Andrew C. McNeil - Chandler AZ, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
G01P 15/125
US Classification:
7351432, 7351438
Abstract:
An accelerometer () includes a substrate () and a proof mass () spaced apart from a surface () of the substrate (). Compliant members () are coupled to the proof mass () and enable the proof mass () to move parallel to the surface () of the substrate () in a sense direction (). Proof mass anchors () interconnect the compliant members () with the surface (). The accelerometer () includes an over-travel stop structure () having stop anchors () coupled to the substrate (). The stop anchors () are coupled to the substrate () at positions () on the surface () residing at least partially within an anchor attach area () bounded in the sense direction () by locations () of the proof mass anchors () on the surface ().
Yizhen Lin - Gilbert AZ, US Todd F. Miller - Scottsdale AZ, US Woo Tae Park - Chandler AZ, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
G01P 15/125 G01P 3/04 G01P 1/02
US Classification:
7351432, 73510, 73493
Abstract:
A transducer () includes sensors () that are bonded to form a vertically integrated configuration. The sensor () includes a proof mass () movably coupled to and spaced apart from a surface () of a substrate (). The sensor () includes a proof mass () movably coupled to and spaced apart from a surface () of a substrate (). The substrates () are coupled with the surface () of substrate () facing the surface () of substrate (). Thus, the proof mass () faces the proof mass (). The sensors () are fabricated separately and can be formed utilizing differing micromachining techniques. The sensors () are subsequently coupled () utilizing a wafer bonding technique to form the transducer (). Embodiments of the transducer () may include sensing along one, two, or three orthogonal axes and may be adapted to detect movement at different acceleration sensing ranges.
Method Of Producing A Microelectromechanical (Mems) Sensor Device
Yizhen Lin - Gilbert AZ, US Woo Tae Park - Singapore, SG Mark E. Schlarmann - Chandler AZ, US Hemant D. Desai - Gilbert AZ, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
H01L 21/44 H01L 21/48 H01L 21/50
US Classification:
438113, 438114, 257E29001
Abstract:
A device () includes sensors () that sense different physical stimuli. A pressure sensor () includes a reference element () and a sense element (), and an inertial sensor () includes a movable element (). Fabrication () entails forming () a first substrate structure () having a cavity (), forming a second substrate structure () to include the sensors (), and coupling () the substrate structures so that the first sensor () is aligned with the cavity () and the second sensor () is laterally spaced apart from the first sensor (). Forming the second structure () includes forming () the sense element () from a material layer () of the second structure () and following coupling () of the substrate structures, concurrently forming () the reference element () and the movable element () in a wafer substrate () of the second structure ().
Vertically Integrated Mems Sensor Device With Multi-Stimulus Sensing
Todd F. Miller - Scottsdale AZ, US Yizhen Lin - Gilbert AZ, US David J. Monk - Mesa AZ, US Woo Tae Park - Chandler AZ, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
G01P 15/125 G01P 3/04 G01P 1/02
US Classification:
7351432, 73510, 73493
Abstract:
A microelectromechanical systems (MEMS) sensor device () includes a sensor portion () and a sensor portion () that are coupled together to form a vertically integrated configuration having a hermetically sealed chamber (). The sensor portions () can be formed utilizing different micromachining techniques, and are subsequently coupled utilizing a wafer bonding technique to form the sensor device (). The sensor portion () includes one or more sensors (), and the sensor portion () includes one or more sensors (). The sensors () are located inside the chamber () facing the sensors () also located inside the chamber (). The sensors () are configured to sense different physical stimuli, such as motion, pressure, and magnetic field.
Mark E. Schlarmann - Chandler AZ, US Yizhen Lin - Gilbert AZ, US
Assignee:
Freescale Semiconductor, Inc. - Austin TX
International Classification:
H01L 29/96
US Classification:
438 52, 438 51, 257415, 257E29324, 7351416
Abstract:
A MEMS device assembly () includes a MEMS die () and an integrated circuit (IC) die (). The MEMS die () includes a MEMS device () formed on a substrate () and a cap layer (). A packaging process () entails forming the MEMS device () on the substrate () and removing a material portion of the substrate () surrounding the device () to form a cantilevered substrate platform () at which the MEMS device () resides. The cap layer () is coupled to the substrate () overlying the MEMS device (). The MEMS die () is electrically interconnected with the IC die (). Molding compound () is applied to substantially encapsulate the MEMS die (), the IC die (), and interconnects () that electrically interconnect the MEMS device () with the IC die (). The cap layer () prevents the molding compound () from contacting the MEMS device ().