Yoon Lee

US Patent:

20230103690, Apr 6, 2023

Filed:

Nov 30, 2022

Appl. No.:

18/072035

Inventors:

- Evanston IL, US
- Urbana IL, US
Jianing ZHAO - Urbana IL, US
Enming SONG - Urbana IL, US
Yoon Kyeung LEE - Urbana IL, US

International Classification:

A61B 5/283
H01L 21/02
A61N 1/05
A61B 5/03
A61B 5/361

Abstract:

Provided are methods of making a liquid and liquid vapor-proof material, and relates long-term implantable electronic devices. The method comprisies providing a first substrate having a first-side encapsulating layer supported by at least a portion of the first substrate; providing a material onto the first-side encapsulating layer; providing a second substrate having a second-side encapsulating layer supported by at least a portion of the second substrate; covering an exposed surface of the material provided onto the first-side encapsulation layer with the second-side encapsulating layer; wherein said encapsulating layers are substantially defect free so that liquid or liquid vapor is prevented from passing through each of the encapsulating layers; thereby making the liquid or liquid vapor-proof material.

US Patent:

20200022601, Jan 23, 2020

Filed:

Oct 17, 2018

Appl. No.:

16/162613

Inventors:

- Evanston IL, US
- Urbana IL, US
Jianing ZHAO - Urbana IL, US
Enming SONG - Urbana IL, US
Yoon Kyeung LEE - Urbana IL, US

International Classification:

A61B 5/042
H01L 21/02
A61B 5/046
A61N 1/05
A61B 5/03

Abstract:

Provided are methods of making a long-term implantable electronic device, and related implantable devices, including by providing a substrate having a first encapsulation layer that covers at least a portion of the substrate, the first encapsulation layer having a receiving surface; providing one or more electronic devices on the first encapsulation layer receiving surface; and removing at least a portion of the substrate from the first encapsulation layer; thereby making the long-term implantable electronic device. Further desirable properties, including device lifetime increases during use in environments that are challenging for sensitive electronic device components, are achieved through the use of additional layers such as longevity-extending layers and/or ion-barrier layers in combination with an encapsulation layer.