Young Moon Kwon

US Patent:

53654099, Nov 15, 1994

Filed:

Jun 4, 1993

Appl. No.:

8/071921

Inventors:

Young I. Kwon - San Jose CA
Louis H. Liang - Los Altos CA

Assignee:

VLSI Technology, Inc. - San Jose CA

International Classification:

H05K 502

US Classification:

361813

Abstract:

A package design configuration for an integrated-circuit die includes a leadframe having its bonding fingers connected to the periphery of an electrically-insulated, heat-conductive substrate, formed, for example, of a ceramic material. A number of electrically conductive traces, or bonding islands, serve as intermediate bonding locations for shorter bonding wires connecting bonding pads on the integrated-circuit die to the bonding fingers of the leadframe. The conductive traces serving as bonding islands are formed by deposition of thin-film material using semiconductor fabrication techniques or by deposition of thick-film material using printing techniques. Various shapes and configurations of the conductive traces are available, such as elongated rectangular patterns, or zigzag patterns. Alternatively, the electrically-insulated, heat-conductive ceramic substrate is attached to the die-attach pad of a conventional leadframe.

US Patent:

51463105, Sep 8, 1992

Filed:

Jul 18, 1991

Appl. No.:

7/731970

Inventors:

Jaime A. Bayan - Palo Alto CA
Jeffrey C. Demmin - Palo Alto CA
Mark L. DiOrio - Cupertino CA
Young I. Kwon - Santa Clara CA

Assignee:

National Semiconductor Corp. - Santa Clara CA

International Classification:

H01L 2334
H01L 2336
H01L 2312

US Classification:

357 70

Abstract:

A thermally enhanced leadframe having heat conductive paths which thermally couple a die attach pad to thermal connection points spread out as far as possible from each other on the perimeter of the package. The area of the heat conductive path is maximized to occupy substantially all area in the package not occupied by the electrically conductive paths between the wire bond locations and the external connection points such as pins. This configuration maximizes the area of the printed circuit board which is heated thereby increasing thermal cooling efficiency. Further, the leadframe configuration maximizes the area of contact between the integrated circuit package and the heat conductive path thereby increasing the thermal conductivity between the device junctions on the integrated circuit die and the ambient through the material of the package itself.

US Patent:

60930292, Jul 25, 2000

Filed:

Sep 8, 1998

Appl. No.:

9/149549

Inventors:

Young Kwon - San Jose CA
Jon Ewanich - Los Altos CA
Bill Gervasi - Los Gatos CA
Paul Franklin - Santa Cruz CA

Assignee:

S3 Incorporated - Santa Clara CA

International Classification:

H01R 1200

US Classification:

439 69

Abstract:

An arrangement for coupling a first packaged integrated circuit to a second packaged integrated circuit comprises a first packaged integrated circuit that includes a first set of electrical interconnection elements arranged on a first surface and a second set of electrical interconnection elements arranged on a second surface which is opposite to the first side. A thermally conductive material is disposed on the second surface and the second set of electrical interconnection elements are arranged around at least a portion of the periphery of the second surface. A second packaged integrated circuit includes a third set of electrical interconnection elements arranged on a first surface of the second packaged integrated circuit. The third set of electrical interconnection elements are shaped to mechanically and electrically couple and decouple to or from the second set of electrical interconnection elements non-destructively by application of manual force.

US Patent:

53767560, Dec 27, 1994

Filed:

Dec 20, 1991

Appl. No.:

7/811551

Inventors:

Young I. Kwon - San Jose CA

Assignee:

VLSI Technology, Inc. - San Jose CA

International Classification:

H01L 2302

US Classification:

174 524

Abstract:

Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for receiving an adhesive material, if necessary, for securing the bonding wires in position to prevent wire-wash and electrically shorting of the bonding wires when a plastic molding compound is formed around the die and leadframe. Alternatively the bonding wires are contained within notches formed in the distal end of the support ring. A lid placed over the support ring provides an enclosure for the integrated-circuit die. Stacking of support rings on each other and concentric support rings provide various optional arrangements for supporting bonding wires.

US Patent:

53328647, Jul 26, 1994

Filed:

Dec 27, 1991

Appl. No.:

7/815097

Inventors:

Louis Liang - Los Altos CA
Sang S. Lee - Sunnyvale CA
Young I. Kwon - San Jose CA

Assignee:

VLSI Technology, Inc. - San Jose CA

International Classification:

H01L 2302
H01L 2328

US Classification:

174 524

Abstract:

An integrated circuit package characterized by an interposer including a thin, flexible, planar insulator having a plurality of substantially radial traces provided on one side thereof. The other side of the insulator is attached to the die attach pad of a lead frame, and an integrated circuit die is attached within a die attach area of the assembly. A first set of wires couples bonding pads of the die to the traces, and a second set of wires couples the traces to bonding fingers of the lead frame. The bonding fingers, interposer, die, and both sets of wires are then encapsulated in plastic. The interposer can be advantageously manufactured in a tape automated bonding (TAB) process to provide a low cost, high performance, and versatile lead frame assembly.

US Patent:

41715039, Oct 16, 1979

Filed:

Jan 16, 1978

Appl. No.:

5/869660

Inventors:

Young D. Kwon - Cupertino CA

International Classification:

H05B 4116
H05B 4124

US Classification:

315248

Abstract:

An electrodeless fluorescent light source that includes a non-conducting light transmissive hermetically sealed envelope containing an ionizable gas which is electromagnetically coupled to an ionizing radio frequency (r. f. ) energy source is described. The r. f. energy source is an induction coil wound in the form of a toroidal helix to minimize microwave radiation leakage, and is placed within the envelope and in direct contact with the gas in order to maximize energy coupling to the gas.

US Patent:

54975476, Mar 12, 1996

Filed:

Apr 6, 1994

Appl. No.:

8/223745

Inventors:

Young I. Kwon - San Jose CA

Assignee:

VLSI Technology, Inc. - San Jose CA

International Classification:

B23P 1526

US Classification:

2989003

Abstract:

Method and apparatus for improving the cooling of a molded package assembly for one or more integrated-circuit dies, each of which is attached to a die-attach paddle portion of a lead frame. The improved package includes a molded-plastic package body which is formed around the lead frame and the attached integrated-circuit die. The package body has one or more through-holes formed through it for passage of air, where the air currents are drawn by convection or forced through the through-hole for cooling the integrated-circuit die attached the die-attach paddle. The die-attach paddle has a corresponding hole formed in it and the through-hole formed in the package body is located adjacent to the hole in the die-attach paddle to form a through-channel through the lead frame and the molded plastic body for convection cooling. The die-attach paddle is covered with molded plastic material so that the die-attach paddle is not exposed in the through-channel. The through-hole formed in the molded-plastic body has inwardly projecting portions which form cooling fins.

US Patent:

54302501, Jul 4, 1995

Filed:

Apr 8, 1994

Appl. No.:

8/224808

Inventors:

Young I. Kwon - San Jose CA

Assignee:

VLSI Technology, Inc. - San Jose CA

International Classification:

H01L 2302

US Classification:

174 524

Abstract:

Single, continuous bonding wires for an integrated-circuit die are supported in mid-span by a support ring which is snap-fit or adhesively bonded to a die-attach paddle of a leadframe. The support member includes a groove formed in its distal end for receiving an adhesive material, if necessary, for securing the bonding wires in position to prevent wire-wash and electrically shorting of the bonding wires when a plastic molding compound is formed around the die and leadframe. Alternatively the bonding wires are contained within notches formed in the distal end of the support ring. A lid placed over the support ring provides an enclosure for the integrated-circuit die. Stacking of support rings on each other and concentric support rings provide various optional arrangements for supporting bonding wires.