Young Boo Kwon

US Patent:

8004156, Aug 23, 2011

Filed:

Jan 23, 2008

Appl. No.:

12/018762

Inventors:

Orest G. Symko - Salt Lake City UT, US
Young S. Kwon - Salt Lake City UT, US

Assignee:

University of Utah Research Foundation - Salt Lake City UT

International Classification:

H02N 2/18

US Classification:

310339, 310328, 310334, 322 2 R

Abstract:

A thermoacoustic array energy converter consists of heat driven thermoacoustic prime movers in parallel coupled by means of an acoustic cavity to a piezoelectric electrical generator whose output is rectified and fed to an energy storage element. The prime movers convert heat to sound in a resonator. The sound form a phase-locked array is converted to electricity by means of the piezoelectric element. The generated electric energy is converted to DC by means of a rectifier set and it is then stored in a battery or supercapacitor. The generated electric energy can also be converted to power line frequency.

US Patent:

8143767, Mar 27, 2012

Filed:

Jul 15, 2011

Appl. No.:

13/183927

Inventors:

Orest G. Symko - Salt Lake City UT, US
Young S. Kwon - Salt Lake City UT, US

Assignee:

University of Utah Research Foundation - Salt Lake City UT

International Classification:

H02N 2/18

US Classification:

310339, 310334

Abstract:

A thermoacoustic array energy converter consists of heat driven thermoacoustic prime movers in parallel coupled by means of an acoustic cavity to a piezoelectric electrical generator whose output is rectified and fed to an energy storage element. The prime movers convert heat to sound in a resonator. The sound form a phase-locked array is converted to electricity by means of the piezoelectric element. The generated electric energy is converted to DC by means of a rectifier set and it is then stored in a battery or supercapacitor. The generated electric energy can also be converted to power line frequency.

US Patent:

20120051470, Mar 1, 2012

Filed:

Aug 27, 2010

Appl. No.:

12/870338

Inventors:

Christian Schlegel - Park City UT, US
Yajun Kou - San Diego CA, US
Tao Wu - Carlsbad CA, US
Young Hoon Kwon - San Diego CA, US

Assignee:

FutureWei Technologies, Inc. - Plano TX

International Classification:

H04B 1/10

US Classification:

375341

Abstract:

A system and method for iteration scheduling in joint equalization and turbo decoding are provided. A method for processing received information includes cancelling interference in a received signal bearing received information, decoding the interference cancelled received signal to produce information, and processing the received information. The cancelling comprises an iterative processing of the received signal based on soft information produced by a decoding the received signal.

US Patent:

20120147942, Jun 14, 2012

Filed:

Dec 10, 2010

Appl. No.:

12/965568

Inventors:

Christian Schlegel - Park City UT, US
Tao Wu - Carlsbad CA, US
Yajun Kou - San Diego CA, US
Young Hoon Kwon - San Diego CA, US

Assignee:

FutureWei Technologies, Inc. - Plano TX

International Classification:

H04L 27/06
H04L 27/01

US Classification:

375229, 375340, 375341

Abstract:

A system and method for signaling and detecting in wireless communications systems are provided. A method for processing information includes operating in a first phase, and operating in a second phase in response to determining that a first user is transmitting at a substantially higher power level than a second user, and processing the detected information. The first phase includes iteratively inverting a first filtering operation on received signals, and the second phase includes iteratively inverting a second filtering operation on received signals with consideration given to a first estimation error of symbols of the first user and a second estimation error of symbols of the second user. The operating remains in the first phase in response to determining that the first user is not transmitting at a substantially higher power level than the second user.

US Patent:

53654099, Nov 15, 1994

Filed:

Jun 4, 1993

Appl. No.:

8/071921

Inventors:

Young I. Kwon - San Jose CA
Louis H. Liang - Los Altos CA

Assignee:

VLSI Technology, Inc. - San Jose CA

International Classification:

H05K 502

US Classification:

361813

Abstract:

A package design configuration for an integrated-circuit die includes a leadframe having its bonding fingers connected to the periphery of an electrically-insulated, heat-conductive substrate, formed, for example, of a ceramic material. A number of electrically conductive traces, or bonding islands, serve as intermediate bonding locations for shorter bonding wires connecting bonding pads on the integrated-circuit die to the bonding fingers of the leadframe. The conductive traces serving as bonding islands are formed by deposition of thin-film material using semiconductor fabrication techniques or by deposition of thick-film material using printing techniques. Various shapes and configurations of the conductive traces are available, such as elongated rectangular patterns, or zigzag patterns. Alternatively, the electrically-insulated, heat-conductive ceramic substrate is attached to the die-attach pad of a conventional leadframe.

US Patent:

51463105, Sep 8, 1992

Filed:

Jul 18, 1991

Appl. No.:

7/731970

Inventors:

Jaime A. Bayan - Palo Alto CA
Jeffrey C. Demmin - Palo Alto CA
Mark L. DiOrio - Cupertino CA
Young I. Kwon - Santa Clara CA

Assignee:

National Semiconductor Corp. - Santa Clara CA

International Classification:

H01L 2334
H01L 2336
H01L 2312

US Classification:

357 70

Abstract:

A thermally enhanced leadframe having heat conductive paths which thermally couple a die attach pad to thermal connection points spread out as far as possible from each other on the perimeter of the package. The area of the heat conductive path is maximized to occupy substantially all area in the package not occupied by the electrically conductive paths between the wire bond locations and the external connection points such as pins. This configuration maximizes the area of the printed circuit board which is heated thereby increasing thermal cooling efficiency. Further, the leadframe configuration maximizes the area of contact between the integrated circuit package and the heat conductive path thereby increasing the thermal conductivity between the device junctions on the integrated circuit die and the ambient through the material of the package itself.

US Patent:

47228270, Feb 2, 1988

Filed:

Sep 26, 1985

Appl. No.:

6/780343

Inventors:

Young J. Kwon - Fruit Heights UT

Assignee:

Westinghouse Electric Corp. - Pittsburgh PA

International Classification:

C22C 1600

US Classification:

420422

Abstract:

This is a high quality zirconium or hafnium sponge, a fuel element cladding liner having material of the quality of this sponge and a process utilizing this quality sponge to fabricate liner material for lined fuel element cladding. The sponge contains 250-about 350 ppm of oxygen impurity, 50-300 ppm of iron impurity, and a total of 500-1,000 ppm of impurity. This material is much purer than conventional sponge and approaches the quality of crystal bar.

US Patent:

60930292, Jul 25, 2000

Filed:

Sep 8, 1998

Appl. No.:

9/149549

Inventors:

Young Kwon - San Jose CA
Jon Ewanich - Los Altos CA
Bill Gervasi - Los Gatos CA
Paul Franklin - Santa Cruz CA

Assignee:

S3 Incorporated - Santa Clara CA

International Classification:

H01R 1200

US Classification:

439 69

Abstract:

An arrangement for coupling a first packaged integrated circuit to a second packaged integrated circuit comprises a first packaged integrated circuit that includes a first set of electrical interconnection elements arranged on a first surface and a second set of electrical interconnection elements arranged on a second surface which is opposite to the first side. A thermally conductive material is disposed on the second surface and the second set of electrical interconnection elements are arranged around at least a portion of the periphery of the second surface. A second packaged integrated circuit includes a third set of electrical interconnection elements arranged on a first surface of the second packaged integrated circuit. The third set of electrical interconnection elements are shaped to mechanically and electrically couple and decouple to or from the second set of electrical interconnection elements non-destructively by application of manual force.

Address:

2665 E Parleys Way APT 310, Salt Lake City, UT 84109

Phone:

8012960612

VIN:

WBAPT73598CX00175

Make:

BMW

Model:

5 SERIES

Year:

2008