Yun W Zhang

US Patent:

6342148, Jan 29, 2002

Filed:

Apr 22, 1999

Appl. No.:

09/296574

Inventors:

See Hong Chiu - Brooklyn NY
Yun Zhang - Warren NJ

Assignee:

Lucent Technologies Inc. - Murray Hill NJ

International Classification:

C25D 332

US Classification:

205302, 205254

Abstract:

An electrolyte bath for plating tin or tin alloy onto metal substrates using a high speed plating process is described. The electrolyte bath contains a stannous alkyl sulfonate and an alkyl sulfonic acid. The bath also contains an organic compound that is the reaction product of polyalkylene glycol and phenolphthalein or derivatives of phenolphthalein.

US Patent:

6982030, Jan 3, 2006

Filed:

Nov 27, 2002

Appl. No.:

10/305547

Inventors:

Yun Zhang - Warren NJ, US
Kilnam Hwang - Melville NY, US

Assignee:

Technic, Inc. - Plainview NY

International Classification:

C25D 3/56
C23C 18/00
C23C 30/00
B05D 1/18
B32B 15/01

US Classification:

205238, 205239, 205244, 205252, 205258, 428646, 428655

Abstract:

Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.

US Patent:

20020185716, Dec 12, 2002

Filed:

May 11, 2001

Appl. No.:

09/853800

Inventors:

Joseph Abys - Warren NJ, US
Chonglun Fan - Bridgewater NJ, US
Chen Xu - New Providence NJ, US
Yun Zhang - Warren NJ, US

International Classification:

H01L023/48
H01L023/52

US Classification:

257/677000, 257/761000, 257/762000

Abstract:

In accordance with the invention, a metal substrate is coated with a multilayer finish comprising a layer of tin or tin alloy and one or more outer metal layers. An optional metal underlayer may be disposed between the substrate and the tin. In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.

US Patent:

20020192492, Dec 19, 2002

Filed:

May 11, 2001

Appl. No.:

09/853799

Inventors:

Joseph Abys - Warren NJ, US
Chonglun Fan - Bridgewater NJ, US
Chen Xu - New Providence NJ, US
Yun Zhang - Warren NJ, US

International Classification:

B32B015/01

US Classification:

428/647000, 428/646000, 428/698000

Abstract:

In accordance with the invention, a metal substrate is coated with a layer of tin or tin alloy that is surface doped to inhibit the growth of tin whiskers. An optional metal underlayer may be disposed between the substrate and the tin. In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer and a layer of surface doped with gold or palladium tin. The doping inhibits whisker growth, and the resulting structure is particularly useful as an electrical connector or lead frame.

US Patent:

20030025182, Feb 6, 2003

Filed:

Jun 22, 2001

Appl. No.:

09/887827

Inventors:

Joseph Abys - Warren NJ, US
Chonglun Fan - Bridgewater NJ, US
Chen Xu - New Providence NJ, US
Yun Zhang - Warren NJ, US

International Classification:

H01L023/495

US Classification:

257/666000, 257/677000

Abstract:

In accordance with a first aspect of the invention, a metal substrate is provided with a layer of tin or tin alloy that is coated under tensile stress to inhibit the growth of tin whiskers. The tensile stressed tin and tin alloy is preferably coated with a grain size larger than 1 micrometer. Advantageously the tin or tin alloy is coated on an underlayer chosen to maintain or generate the tensile stress state in the tin coating. The tensile stress inhibits whisker growth, and the resulting structure is particularly useful as a part of an electrical connector or lead frame. In a second aspect of the invention, the tensile stress of tin coatings is monitored to provide coatings of reduced tendency toward whisker growth.

US Patent:

20050249968, Nov 10, 2005

Filed:

May 4, 2004

Appl. No.:

10/838571

Inventors:

Chen Xu - New Providence NJ, US
Yun Zhang - Warren NJ, US
Chonglun Fan - Bridgewater NJ, US
Oscar Khaselev - Monmouth Junction NJ, US
Joseph Abys - Warren NJ, US

International Classification:

B32B015/01
C25D005/12

US Classification:

428647000, 428648000, 427123000, 205181000, 205170000

Abstract:

A method for reducing whisker formation in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 μm and about 4.0 μm in thickness.

US Patent:

20050249969, Nov 10, 2005

Filed:

Oct 19, 2004

Appl. No.:

10/968500

Inventors:

Chen Xu - New Providence NJ, US
Yun Zhang - Warren NJ, US
Chonglun Fan - Bridgewater NJ, US
Oscar Khaselev - Monmouth Junction NJ, US
Joseph Abys - Warren NJ, US
Eric Walch - Solingen, DE
Marlies Kleinfeld - Wuppertal, DE
Hans Eckert - Solingen, DE

International Classification:

B32B015/01
C25D005/10

US Classification:

428647000, 428648000, 428929000, 427123000, 205170000, 205181000

Abstract:

A method for reducing whisker formation and preserving solderability in tin coatings over metal features of electronic components. The tin coating has internal tensile stress and is between about 0.5 μm and about 4.0 μm in thickness. There is a nickel-phosphorus layer under the tin coating.

US Patent:

20060016692, Jan 26, 2006

Filed:

Sep 23, 2005

Appl. No.:

11/233622

Inventors:

Yun Zhang - Warren NJ, US
Robert Schetty - Ft. Salonga NY, US
Kilnam Hwang - Melville NY, US

International Classification:

C25D 3/00
C23C 18/44

US Classification:

205261000, 205271000, 205269000, 205291000, 205300000, 205305000, 106001050

Abstract:

Methods of providing improved metal coatings or metal deposits on a substrate, improvements in plating solutions that are used to provide such metal deposits and articles of the metal-coated substrates. The solderability of the metal coating is enhanced by incorporating trace amounts of phosphorus in the metal coating to reduce surface oxide formation during subsequent heating and thus enhance long term solderability of the metal coating. The phosphorus is advantageously provided in the metal coating by incorporating a source of phosphorus in a solution that is used to provide the metal coating on the substrate, and the metal coating is then provided on the substrate from the solution.