Angela Renee Torres

US Patent:

53232941, Jun 21, 1994

Filed:

Mar 31, 1993

Appl. No.:

8/040732

Inventors:

Wilbur T. Layton - San Diego CA
Blanquita O. Morange - San Diego CA
Angela M. Torres - Vista CA

Assignee:

Unisys Corporation - Blue Bell PA

International Classification:

H05K 720

US Classification:

361699

Abstract:

An integrated circuit package has an integrated circuit chip, a substrate which holds the chip, and a novel heat conduction mechanism which is coupled to the chip and which provides a path for conducting heat from the chip to a fluid medium. This heat conduction mechanism is characterized as including a) a compliant body, having microscopic voids throughout, which is disposed in and fills a gap in the heat conducting path, and b) a liquid metal alloy that is absorbed by and partially fills the microscopic voids of the compliant body. Due to the presence of the liquid metal alloy, the thermal conductivity through the body is high. Also, due to the voids in the body being only partially filled with the liquid metal alloy, the body can be compressed by dimensional variations within the integrated circuit package without squeezing out any of the liquid metal alloy that is held therein.

US Patent:

56588313, Aug 19, 1997

Filed:

Jun 6, 1995

Appl. No.:

8/471470

Inventors:

Wilber Terry Layton - San Diego CA
Blanquita Ortega Morange - San Diego CA
Angela Marie Torres - Vista CA
James Andrew Roecker - Escondido CA

Assignee:

Unisys Corporation - Blue Bell PA

International Classification:

H01L 2160

US Classification:

29832

Abstract:

An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200. ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100. degree. C. -300. degree. C. for 0. 5 hours-3. 0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.

US Patent:

54593522, Oct 17, 1995

Filed:

May 10, 1994

Appl. No.:

8/240543

Inventors:

Wilber T. Layton - San Diego CA
Blanquita O. Morange - San Diego CA
Angela M. Torres - Vista CA
James A. Roecker - Escondido CA

Assignee:

Unisys Corporation - Blue Bell PA

International Classification:

H01L 3902
H01L 2302

US Classification:

257724

Abstract:

An integrated circuit package includes an integrated circuit chip, a substrate which holds the chip, and a heat conduction mechanism which provides a path for conducting heat from the chip to a fluid medium; wherein the heat conduction mechanism is characterized as having a pressed joint which is comprised of: 1) a member that is made primarily of aluminum or copper, having a solid polysiloxane coating of less than 200. ANG. thickness, and 2) a liquid metal alloy in contact with the coating. This solid coating, on the aluminum or copper member, is fabricated without any expensive equipment by the steps of: 1) forming a liquid coating of a polysiloxane solution on the aluminum or copper member; and 2) baking that member with its liquid coating at temperatures of 100. degree. C. -300. degree. C. for 0. 5 hours-3. 0 hours. Thereafter the integrated circuit package is completed by placing the member with its solid coat in the heat conducting path such that a liquid metal alloy is in contact with the solid coat.