Deepak K Arora

US Patent:

20140353019, Dec 4, 2014

Filed:

May 30, 2013

Appl. No.:

13/906229

Inventors:

Deepak Arora - Chandler AZ, US
Daniel N. Sobieski - Phoenix AZ, US
Dilan Seneviratne - Chandler AZ, US
Ebrahim Andideh - Tempe AZ, US
James C. Meyer - Tualatin OR, US

International Classification:

C23C 14/22
H05K 1/11
H01L 21/02
H05K 1/03
C23C 14/34
C23C 14/14

US Classification:

174258, 156247, 427124, 2041921, 174262

Abstract:

Embodiments of the present disclosure are directed towards techniques and configurations for formation of a dielectric with a smooth surface. In one embodiment, a method includes providing a dielectric with first and second surfaces, a conductive feature formed on the first surface, and a laminate applied to the second surface, curing the second surface while the laminate remains applied, and removing the laminate. Other embodiments may be described and/or claimed.

US Patent:

20140090879, Apr 3, 2014

Filed:

Sep 29, 2012

Appl. No.:

13/631959

Inventors:

Dilan SENEVIRATNE - Chandler AZ, US
Ching-Ping J. SHEN - Gilbert AZ, US
Liwen JIN - Chandler AZ, US
Deepak ARORA - Chandler AZ, US
Vinodhkumar RAGHUNATHAN - Chandler AZ, US

International Classification:

H05K 1/11
H05K 3/00

US Classification:

174257, 156293, 156247, 156280

Abstract:

Electronic assemblies and methods for their manufacture are described, including those related to the formation of an assembly including a carrier and a resin coated copper layer positioned on the carrier. The resin coated copper layer includes a first layer comprising a resin and a second layer comprising copper, with the first layer bonded to the second layer. The first layer of the resin coated copper is positioned between the carrier and the second layer of the resin coated copper. An opening is formed in the second layer of the resin coated copper. A die is positioned in the opening. A plurality of dielectric layers and metal pathways are positioned on the second layer and on the die. Other embodiments are described and claimed.