Herbert G Bothner

US Patent:

42055482, Jun 3, 1980

Filed:

Jul 3, 1978

Appl. No.:

5/921450

Inventors:

Herbert Bothner - Warwick NY
John M. Frusco - Scotch Plains NJ
Dieter Spieth - New City NY

Assignee:

Plessey, Inc. - New York NY

International Classification:

B21D 2806

US Classification:

72404

Abstract:

Tools for stamping very delicate lead frames for semiconductor packages, including scored and bent-up tabs that retain groups of inner lead tips in position through subsequent operations, after which they are broken off. Sequential punch and die sets are used to (1) define the tabs, (2) bend down the leads, (3) score the tabs and coin the lead tips, and (4) bend the tabs up. At stations (3) and (4) means are provided to lift scored tabs out of the die and to allow the frame strip to move over the tab-bending die without interference.