Jeffrey Regina Thompson

US Patent:

7250101, Jul 31, 2007

Filed:

May 7, 2003

Appl. No.:

10/434493

Inventors:

Jeffrey A. Thompson - Burbank CA, US
Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Dennis R. Smalley - Newhall CA, US

Assignee:

Microfabrica Inc. - Van Nuys CA

International Classification:

C25D 1/00
C25D 5/02
C25D 5/48
C25D 5/52

US Classification:

205 67, 205118, 205220, 205221, 205222, 205223

Abstract:

Multilayer structures are electrochemically fabricated on a temporary (e. g. conductive) substrate and are thereafter bonded to a permanent (e. g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e. g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

US Patent:

7430731, Sep 30, 2008

Filed:

Jan 3, 2005

Appl. No.:

11/028943

Inventors:

Adam L. Cohen - Los Angeles CA, US
Jeffrey A. Thompson - Los Angeles CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

G06F 17/50
G06F 19/00
G03F 1/00
G21K 5/00
H01L 21/44
H01L 21/31

US Classification:

716 21, 700 98, 700119, 700121, 430 5, 378 35, 438607, 438669, 438761

Abstract:

Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

US Patent:

7623935, Nov 24, 2009

Filed:

Jan 3, 2005

Appl. No.:

11/029173

Inventors:

Adam L. Cohen - Los Angeles CA, US
Jeffrey A. Thompson - Los Angeles CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

G06F 17/50
G06F 19/00

US Classification:

700 95, 700119, 700121, 430 5, 378 35, 438607, 438669, 438761

Abstract:

Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

US Patent:

20050067292, Mar 31, 2005

Filed:

May 7, 2004

Appl. No.:

10/841006

Inventors:

Jeffrey Thompson - Los Angeles CA, US
Adam Cohen - Los Angeles CA, US
Michael Lockard - Lake Elizabeth CA, US
Dennis Smalley - Newhall CA, US

International Classification:

C25D005/02

US Classification:

205118000, 205170000

Abstract:

Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

US Patent:

20050205430, Sep 22, 2005

Filed:

Nov 24, 2004

Appl. No.:

10/997709

Inventors:

Jeffrey Thompson - Los Angeles CA, US

International Classification:

C25D005/10

US Classification:

205170000

Abstract:

Embodiments include treatment of substrates, formation of structures, and formation of multilayer structures using contact masks where a controlled mating of the contact masks and substrates is used. Some embodiments involve controlled mating at speeds equal to or less than 10 microns/second, more preferably equal to or less than 5 microns/second, and even more preferably equal to or less than 1 micron/second. Some embodiments involve controlled mating that uses a higher speed of approach when further away followed by a slower speed of approach to cause mating. Some embodiments involve controlled mating that uses a higher speed of approach when making preliminary contact, then backing away a desired distance, and then making a mating approach that causes mating while using a slower mating speed.

US Patent:

20090038948, Feb 12, 2009

Filed:

Aug 13, 2008

Appl. No.:

12/191258

Inventors:

Jeffrey A. Thompson - Los Angeles CA, US
Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Dennis R. Smalley - Newhall CA, US

International Classification:

C25D 5/02

US Classification:

205118

Abstract:

Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

US Patent:

20090145767, Jun 11, 2009

Filed:

Sep 30, 2008

Appl. No.:

12/242713

Inventors:

Adam L. Cohen - Los Angeles CA, US
Jeffrey A. Thompson - Los Angeles CA, US

International Classification:

C25D 5/02

US Classification:

205135, 205118

Abstract:

Some embodiments of the invention are directed to techniques for electrochemically fabricating multi-layer three-dimensional structures where selective patterning of at least one or more layers occurs via a mask which is formed using data representing cross-sections of the three-dimensional structure which has been modified to place it in a polygonal form which defines only regions of positive area. The regions of positive area are regions where structural material is to be located or regions where structural material is not to be located depending on whether the mask will be used, for example, in selectively depositing a structural material or a sacrificial material. The modified data may take the form of adjacent or slightly overlapped relative narrow rectangular structures where the width of the structures is related to a desired formation resolution. The spacing between centers of adjacent rectangles may be uniform or may be a variable. The data modification may also include the formation of duplicate copies of an original structure, scaled copies, mirrored copies, rotated copies, complementary copies, and the like.

US Patent:

20110180410, Jul 28, 2011

Filed:

Jan 20, 2011

Appl. No.:

13/010324

Inventors:

Jeffrey A. Thompson - Los Angeles CA, US
Adam L. Cohen - Los Angeles CA, US
Michael S. Lockard - Lake Elizabeth CA, US
Dennis R. Smalley - Newhall CA, US

International Classification:

C25D 1/00

US Classification:

205 70, 205 67

Abstract:

Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are formed from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurring during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.