Jeong Sinn Kim

US Patent:

7154749, Dec 26, 2006

Filed:

Jun 8, 2004

Appl. No.:

10/863103

Inventors:

Zoran Stefanoski - Menlo Park CA, US
Jeong H. Kim - Hayward CA, US

Assignee:

NVIDIA Corporation - Santa Clara CA

International Classification:

H05K 7/20
F28D 15/00

US Classification:

361695, 165 803, 16510433, 361700

Abstract:

One embodiment of a system for efficiently cooling a processor includes a mounting plate configured to be thermally coupled to the processor, a passive heat transport device thermally coupled to the mounting plate and a heat exchanger coupled to the passive heat transport device.

US Patent:

7359197, Apr 15, 2008

Filed:

Apr 12, 2004

Appl. No.:

10/822958

Inventors:

Zoran Stefanoski - Menlo Park CA, US
Jeong H. Kim - Hayward CA, US

Assignee:

NVIDIA Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361699, 361689, 361695, 361697, 174 151, 174 161, 174 163, 165 803, 165 804, 16510433

Abstract:

One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.

US Patent:

7542292, Jun 2, 2009

Filed:

Apr 14, 2008

Appl. No.:

12/102828

Inventors:

Zoran Stefanoski - Menlo Park CA, US
Jeong H. Kim - Hayward CA, US

Assignee:

NVIDIA Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361699, 361689, 361695, 361697, 174 151, 174 161, 174 163, 165 803, 165 804, 16510433

Abstract:

One embodiment of a system for efficiently cooling a processor includes an active hybrid heat transport module adapted to be integrated with a fansink. The hybrid heat transport module comprises both a fluid channel and an air channel adapted for transporting heat. The hybrid heat transport module and the fansink may be used alone or in combination to dissipate heat from the processor.

US Patent:

7619889, Nov 17, 2009

Filed:

Aug 20, 2007

Appl. No.:

11/841547

Inventors:

Zhihai Zack Yu - Petaluma CA, US
Jeong H. Kim - Sunnyvale CA, US
Tommy C. Lee - Danville CA, US

Assignee:

NVIDIA Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361699, 361689, 361690, 361695, 361696, 361697, 361700, 361701, 174 151, 174 152, 174 161, 174 163, 165 803, 165 804

Abstract:

A system and method are provided for controlling a transfer of heat between circuit board components. Included is a circuit board with components mounted thereon. Also provided is a controllable heat transfer medium for controlling a transfer of heat between the components.

US Patent:

7885063, Feb 8, 2011

Filed:

Aug 20, 2007

Appl. No.:

11/841584

Inventors:

Zhihai Zack Yu - Petaluma CA, US
Jeong H. Kim - Sunnyvale CA, US
Tommy C. Lee - Danville CA, US

Assignee:

NVIDIA Corporation - Santa Clara CA

International Classification:

G06F 1/26
H05K 7/20

US Classification:

36167954, 36167946, 36167947, 36167952, 361697, 361700, 361702, 361704, 361709, 361719, 165 802, 165 803, 165 804, 165185, 700300

Abstract:

A heat exchanger carrier system, method, and computer program product are provided. Included is a circuit board with components mounted thereon. Further included is a carrier coupled to the circuit board. Also included is a plurality of heat exchangers coupled to the carrier for transferring heat from the components.

US Patent:

7969733, Jun 28, 2011

Filed:

Dec 17, 2008

Appl. No.:

12/336851

Inventors:

Samuel Abbay - San Francisco CA, US
Jeong Hun Kim - Sunnyvale CA, US
Don Le - Santa Clara CA, US

Assignee:

NVIDIA Corporation - Santa Clara CA

International Classification:

H05K 7/20

US Classification:

361695, 361699, 361719, 361721, 174 151, 174 161, 165 803, 165 804, 16510433

Abstract:

A heat transfer system, method, and computer program product are provided for use with multiple circuit board environments. In use, a heat transfer component configured to be situated between a first circuit board and a second circuit board is provided. Such heat transfer component is in thermal communication with a first processor of the first circuit board and a second processor of the second circuit board. Furthermore, the heat transfer component is situated between the first circuit board and the second circuit board.

US Patent:

20030134597, Jul 17, 2003

Filed:

Jan 17, 2002

Appl. No.:

10/053398

Inventors:

Subramanya Rao - Santa Clara CA, US
Jeremy Lin - Sunnyvale CA, US
Jeong Kim - Sunnyvale CA, US

International Classification:

H04B001/10

US Classification:

455/063000

Abstract:

Techniques for segmented CDMA searching are disclosed. In one aspect, a searcher comprises a plurality of storage elements selectable for performing a plurality of segmentable search tasks, each storage element operable for storage of and access to state information for one of the plurality of search tasks. In another aspect, a first search task is interrupted in progress, the state information for the first task is stored, a second search task is performed, and the first search task is continued using the stored state information. In yet another aspect, a search task is segmented into smaller search segments, sized to fit within contiguous available time in the searcher. Various other aspects of the invention are also presented. These aspects have the benefit of circuit area and search-time efficiency which translate into reduced costs, increased standby time, increased acquisition speed, higher quality signal transmission, increased data throughput, decreased power, and improved overall system capacity.

US Patent:

20130307843, Nov 21, 2013

Filed:

Dec 3, 2012

Appl. No.:

13/692814

Inventors:

Vishal Sikka - Los Altos CA, US
Samuel J. Yen - Los Altos CA, US
Sanjay Rajagopalan - Palo Alto CA, US
Jeong H. Kim - San Jose CA, US

Assignee:

SAP AG - Walldorf

International Classification:

G06T 15/00

US Classification:

345419

Abstract:

A business management system for visualizing transactional data objects in real time is provided. An example system accesses a stream of transactional data objects and generates a in a three-dimensional graphical paradigm. A viewer may manipulate the presentation of the transactional data objects by engaging gestures and visual controls that may be provided on a display screen.

Address:

185 Estancia Dr, San Jose, CA 95134

VIN:

5NPET46CX9H422556

Make:

HYUNDAI

Model:

SONATA

Year:

2009