Kevin P Becker

US Patent:

8546485, Oct 1, 2013

Filed:

Mar 5, 2013

Appl. No.:

13/785488

Inventors:

Pauline Chiang - Irvine CA, US
Kevin Harris Becker - Cerritos CA, US

Assignee:

Henkel Corporation - Rocky Hill CT

International Classification:

C09J 175/06
C09J 183/04
C09J 133/08

US Classification:

525 28, 525 72

Abstract:

A pressure sensitive adhesive comprising (A) pressure sensitive adhesive polymers having pendant carbon-carbon unsaturation and (B) hydrophobic polymers terminated with carbon-carbon unsaturation. In one embodiment the hydrophobic polymers are vinyl terminated polydimethoxyl siloxane polymers and/or vinyl terminated fluoropolymers reduces the interaction of the pressure sensitive adhesive with adherends and provides excellent release of the pressure sensitive adhesive after cure.

US Patent:

20030129438, Jul 10, 2003

Filed:

Dec 14, 2001

Appl. No.:

10/016844

Inventors:

Kevin Becker - Cerritos CA, US
Harry Kuder - Fullerton CA, US

International Classification:

B32B031/26

US Classification:

428/620000, 156/307100, 525/010000

Abstract:

Curable compositions that comprise two separately curable chemistry sets or compositions with curing temperatures sufficiently separated so that one chemistry composition can be fully cured during a B-staging process, and the second can be left uncured until a final cure is desired, such as at the final attach of a semiconductor chip to a substrate.

US Patent:

20050238881, Oct 27, 2005

Filed:

Jun 27, 2005

Appl. No.:

11/168037

Inventors:

Kevin Becker - Cerritos CA, US
Harry Kuder - Fullerton CA, US

International Classification:

B32B027/38
H01L021/48

US Classification:

428413000, 438106000

Abstract:

A semiconductor assembly comprising a semiconductor chip on a substrate is adhered to the substrate using a dual cure B-stageable adhesive comprising two chemical compositions, (i) a first composition comprising a curable monomeric or polymeric compound or resin and a curing initiator or curing agent for that compound or resin, and (ii) a second composition comprising a monomeric or polymeric compound or resin and a curing initiator or curing agent for that compound or resin, in which the curing temperatures or curing temperature ranges are sufficiently separated to allow the composition with the lower curing temperature, the first composition, to cure without curing the composition with the higher curing temperature, the second composition.

US Patent:

20140290843, Oct 2, 2014

Filed:

Jun 12, 2014

Appl. No.:

14/303008

Inventors:

- Duesseldorf, DE
Jeffrey Grey - Orange CA, US
Kevin Becker - Cerritos CA, US

International Classification:

H01L 21/673

US Classification:

156249

Abstract:

A method for removing the trimmed scrap of conductive die attach adhesive film from a carrier support tape is provided. An adhesive film is disposed between a support carrier and a release liner; the release liner and adhesive film are cut into a shape conforming to the shape of a semiconductor wafer. After scrap release liner is removed, a temporary adhesive sheet is mounted over and adhered to the exposed conductive die attach film surrounding the cut shape, and mounted over and adhered to the scrap release liner on the cut shape; the temporary adhesive sheet is removed, and due to its adhesion properties to the adhesive film and release liner, the scrap adhesive film and scrap release liner are removed along with the temporary adhesive sheet.