Lee Ching Chua

US Patent:

8288288, Oct 16, 2012

Filed:

Jun 16, 2008

Appl. No.:

12/140196

Inventors:

Christopher Gage - Campbell CA, US
Lee Peng Chua - Beaverton OR, US

Assignee:

Novellus Systems, Inc. - San Jose CA

International Classification:

H01L 21/00

US Classification:

438715, 34408, 414217

Abstract:

Methods that increase the overall rate of heat transfer between a substrate and a heat sink or source, e. g. , in a loadlock are provided. According to various embodiments, the methods involve varying the heat transfer coefficient of a heat transfer gas in the loadlock or other chamber. The heat transfer coefficient is varied to reduce the time-dependent variation of the rate of heat transfer. As a result, the overall rate of heat transfer is improved. In certain embodiments, the methods involve varying the gas pressure of a chamber in order to affect the rate of heat transfer to a wafer within a system. By manipulating the gas pressure accordingly, the rate of heat transfer is controlled throughout the heating or cooling cycle.