Paul N Merola

US Patent:

7288720, Oct 30, 2007

Filed:

Sep 19, 2006

Appl. No.:

11/523108

Inventors:

Kevin Moyher - Clinton CT, US
Raymond Allard - Wallingford CT, US
Paul Merola - Wallingford CT, US
Tao Duan - Beijing, CN
Jun Zhang - Beijing, CN
Xin Fu - Beijing, CN
Wei Wang - Beijing, CN
Tai Qui - Beijing, CN
Jason Zhu - Shanghai, CN
Yunchuan Zhu - Shanghai, CN

Assignee:

Times Microwave Systems, Inc. - Wallingford CT

International Classification:

H02G 15/08

US Classification:

174 78, 174 88 C

Abstract:

A device for electrically grounding bundled cables includes a first half component having an outer surface portion and an abutting surface portion, and a second half component having an outer surface portion and an abutting surface portion. The outer surface portion of the first half component and the outer surface portion of the second half component each define at least one groove longitudinally extending therealong for accommodating one of a plurality of cables held closely together in a bundled configuration. The abutting surface portion of the first half component and the abutting surface portion of the second half component are configured for engaging and cooperating with one another to form a grounding structure.