Pei Chen

US Patent:

6532134, Mar 11, 2003

Filed:

Jul 26, 1996

Appl. No.:

08/686567

Inventors:

Pei C. Chen - Cupertino CA
Grace Lim Gorman - San Jose CA
Cherngye Hwang - San Jose CA
Vedantham Raman - San Jose CA
Randall George Simmons - San Jose CA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 560

US Classification:

3602352, 3602366, 3602358

Abstract:

A silicon coating on an air bearing surface for magnetic thin film heads. A thick silicon layer is provided to replace metallic layers such as TiW as an overcoat for thin film heads. The silicon layer will provide a durable head-disk interface and act as a reflective surface for fly height measurement. The silicon layer can be planarized with the pole tips to avoid any magnetic spacing loss. The thickness of the silicon coating is preferably between 125 and 6500 angstroms thick. The slider body may be fabricated from silicon such that the silicon coating is substantially identical to the silicon slider body, thereby preventing thermal mismatch therebetween. The silicon coating is preferably applied using a magnetron sputtering technique which provides a high rate of deposition of silicon to form a dense, low stress silicon layer.

US Patent:

7296420, Nov 20, 2007

Filed:

Dec 2, 2004

Appl. No.:

11/001795

Inventors:

Pei Chen - Campbell CA, US
Jorge Goitia - San Jose CA, US
Cherngye Hwang - San Jose CA, US
Bigal Leung - Redwood City CA, US
Diana Perez - San Jose CA, US
Yongjian Sun - San Jose CA, US

Assignee:

Hitachi Global Storage Technologies Amsterdam, B.V. - Amsterdam

International Classification:

F25D 25/00
F25D 17/06
F25D 23/12

US Classification:

62 62, 62 89, 622592, 16510433

Abstract:

Embodiments of the present invention are directed to a pallet assembly which facilitates direct cooling of the wafer carrier. In one embodiment, the pallet assembly comprises a frame which holds at least one carrier of a component. The pallet assembly further comprises a tray which is operable for being mechanically coupled with the frame. The tray comprises at least one discreet region which corresponds with the carrier when the tray is coupled with the frame. In embodiments of the present invention, the discreet region comprises at least one hole extending through the tray for permitting a coolant medium to dissipate heat from the carrier.

US Patent:

7481312, Jan 27, 2009

Filed:

Dec 2, 2004

Appl. No.:

11/001798

Inventors:

Pei Chen - Campbell CA, US
Jorge Goitia - San Jose CA, US
Cherngye Hwang - San Jose CA, US
Bigal Leung - Redwood City CA, US
Diana Perez - San Jose CA, US
Yongjian Sun - San Jose CA, US

Assignee:

Hitachi Global Storage Technologies Netherlands B.V. - Amsterdam

International Classification:

B65D 85/00

US Classification:

206386, 206710, 118724

Abstract:

Embodiments of the present invention are directed to a frame component of a pallet assembly. In one embodiment, the frame comprises a plurality of arms for retaining at least one carrier component. The frame further comprises at least one spring disposed upon one of the plurality of arms. The spring for applying pressure upon the carrier.

US Patent:

7846305, Dec 7, 2010

Filed:

Mar 1, 2005

Appl. No.:

11/070530

Inventors:

Pei Cheh Chen - Campbell CA, US
Omar Eduardo Montero Camacho - Jalisco, MX
Laurence Scott Samuelson - San Jose CA, US
Yongjian Sun - San Jose CA, US

Assignee:

Hitachi Global Storage Technologies, Netherlands, B.V. - Amsterdam

International Classification:

C23C 14/34

US Classification:

20419234, 20419232, 20429832, 20429836

Abstract:

A method for increasing etch depth uniformity in ion milling process in a wafer manufacturing process encompasses loading designated regions of a production pallet with carriers containing wafers to be ion milled. These designated regions have been predetermined to exhibit similar and preferred depths of etching. Non-designated regions of the production pallet are then loaded with dummy carriers and the wafers are ion milled.

US Patent:

60238402, Feb 15, 2000

Filed:

Aug 31, 1998

Appl. No.:

9/144000

Inventors:

Pei C. Chen - Cupertino CA
Grace Lim Gorman - San Jose CA
Cherngye Hwang - San Jose CA
Vedantham Raman - San Jose CA
Randall George Simmons - San Jose CA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 542

US Classification:

2960312

Abstract:

A single layer wear coating is provided for a magnetic head assembly. The single layer is silicon or silicon-based material with a thickness in the range of 30-75. ANG. The single layer may be formed by a single step of deposition employing a DC magnetron. The single layer wear coating improves the wear performance of the magnetic head assembly and protects one or more sensitive elements of a magnetic head without significant reduction of spacing loss.

US Patent:

61328138, Oct 17, 2000

Filed:

Dec 11, 1997

Appl. No.:

8/989051

Inventors:

Pei C. Chen - Cupertino CA
Richard Hsiao - San Jose CA
Son Van Nguyen - Los Gatos CA
Andrew Chiuyan Ting - San Jose CA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B05D 512

US Classification:

427490

Abstract:

A method for modifying a substrate surface, including the step of applying a high density plasma to the substrate surface in the presence of a hydrofluorocarbon gas and a carrier gas to form an antiwetting layer on the substrate surface. Optionally, the method including a cleaning step of contacting the slider surface with a carrier gas for a period of time effective to clean the surface.

US Patent:

61172839, Sep 12, 2000

Filed:

Dec 5, 1996

Appl. No.:

8/759479

Inventors:

Pei C. Chen - Cupertino CA
Grace Lim Gorman - San Jose CA
Cherngye Hwang - San Jose CA
Vedantham Raman - San Jose CA
Randall George Simmons - San Jose CA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C23C 1434
C23C 1600

US Classification:

20419223

Abstract:

A silicon coating on an air bearing surface for magnetic thin film heads. A thick silicon layer is provided to replace metallic layers such as TiW as an overcoat for thin film heads. The silicon layer will provide a durable head-disk interface and act as a reflective surface for fly height measurement. The silicon layer can be planarized with the pole tips to avoid any magnetic spacing loss. The thickness of the silicon coating is preferably between 125 and 6500 Angstroms thick. The slider body may be fabricated from silicon such that the silicon coating is substantially identical to the silicon slider body, thereby preventing thermal mismatch therebetween. The silicon coating is preferably applied using a magnetron sputtering technique which provides a high rate of deposition of silicon to form a dense, low stress silicon layer.

US Patent:

58088326, Sep 15, 1998

Filed:

Feb 27, 1996

Appl. No.:

8/607892

Inventors:

Pei C. Chen - Cupertino CA
Grace Lim Gorman - San Jose CA
Cherngye Hwang - San Jose CA
Vedantham Raman - San Jose CA
Randall George Simmons - San Jose CA

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G11B 560

US Classification:

360103

Abstract:

A single layer wear coating is provided for a magnetic head assembly. The single layer is silicon or silicon-based material with a thickness in the range of 30-75. ANG. The single layer may be formed by a single step of deposition employing a DC magnetron. The single layer wear coating improves the wear performance of the magnetic head assembly and protects one or more sensitive elements of a magnetic head without significant reduction of spacing loss.