Qian Wang

US Patent:

20070045756, Mar 1, 2007

Filed:

Jul 18, 2006

Appl. No.:

11/488465

Inventors:

Jean-Christophe Gabriel - Pinole CA, US
Alexander Star - Pittsburgh PA, US
Christian Valcke - Orinda CA, US
Qian Wang - Mountain View CA, US

International Classification:

H01L 29/82

US Classification:

257414000

Abstract:

A nanoelectronic sensing device includes a substrate, a nanostructure element disposed adjacent the substrate, and at least a conductive element electrically connected to the nanostructure element. The device is configured to heat at least a portion of the sensor structure including the nanostructure element. In certain embodiments, the nanostructure element comprises at least one nanotube, the nanotube being electrically connected to at least two conductors so as to permit an electric current on the order of 10 microAmps or greater to be passed through the nanotube, causing the nanotube to heat up relative to the substrate. In alternative embodiments, the sensing device includes a platform or membrane which is at least partially thermally isolated by one or more cavities, the platform supporting at least the nanostructure element adjacent to a microheater element. The heating of the sensor structure may be employed, for example, for thermoregulation, to accelerate and/or increase sensor response, and to improve other sensor characteristics.

US Patent:

20140066469, Mar 6, 2014

Filed:

Aug 21, 2013

Appl. No.:

13/972614

Inventors:

Qian Wang - Palo Alto CA, US
Heidi H. Wong - San Francisco CA, US
Mark C. Genovese - Sunnyvale CA, US

International Classification:

A61K 31/4706
A61K 45/06
A61K 31/40

US Classification:

514275, 514313

Abstract:

Compositions and methods are provided for preventing or treating the pre-clinical early-stages of inflammatory diseases, including autoimmune diseases, degenerative inflammatory diseases, metabolic inflammatory diseases, chronic infection associated with inflammation, cancer associated with inflammation, and other inflammatory diseases by administration to an individual of an effective dose of a synergistic combination of active agents comprising or consisting essentially of an aminoquinoline, e.g. hydroxychloroquine, and a statin, e.g. atorvastatin. Each or both of the active agents can be formulated in various ways, including without limitation a solid oral dosage form.

US Patent:

20230054034, Feb 23, 2023

Filed:

Aug 23, 2021

Appl. No.:

17/408708

Inventors:

- Palo Alto CA, US
Joerg Martini - San Francisco CA, US
Mark Teepe - Palo Alto CA, US
Yu Wang - San Jose CA, US
Qian Wang - Mountain View CA, US

International Classification:

H01S 5/42
H01S 5/024
H01S 5/02326
H01S 5/042
H01S 5/02315
H01S 5/02345
B41J 3/407

Abstract:

A 3D package for semiconductor thermal management can include a 3D submount forming a mechanical block including at least one embedded channel formed within the mechanical block and configured to accept cooling liquid therethrough, a first tubular connection for providing cooling liquid to the at least one embedded channel, and a second tubular connection for removing cooling liquid from the at least one embedded channel. Integrated slots can be provided for accepting and mounting semiconductor components. Mounting holes can be formed in the mechanical block for securing optical elements. At least one semiconductor laser array die can be secured to the mechanical block at the integrated slots, wherein the at least one semiconductor laser array die is kept cool by the cooling liquid flowing through the at least one embedded channel.

US Patent:

20210272935, Sep 2, 2021

Filed:

Mar 2, 2020

Appl. No.:

16/805911

Inventors:

- Palo Alto CA, US
Jengping Lu - Fremont CA, US
Qian Wang - Mountain View CA, US
Sourobh Raychaudhuri - Mountain View CA, US

International Classification:

H01L 25/075
H01L 25/16
H01L 33/00
H01L 21/66

Abstract:

MicroLED chips are transferred from an epitaxy wafer to a first coupon substrate. The first coupon substrate has a first, soft adhesive layer that temporarily holds the microLED chips. Using a first transfer substrate, a subset of the microLED chips are transferred from the first coupon substrate to a second coupon substrate having a second, soft adhesive layer. A pattern of microLED chips are transferred from another substrate to the second coupon substrate via a second transfer substrate to fill vacancies in the subset of microLED chips. The transfer substrates are operable to hold and release pluralities of micro objects.

US Patent:

20210143045, May 13, 2021

Filed:

Nov 12, 2019

Appl. No.:

16/681215

Inventors:

- Palo Alto CA, US
Jengping Lu - Fremont CA, US
Qian Wang - Mountain View CA, US
Norine E. Chang - Menlo Park CA, US

International Classification:

H01L 21/683
H01L 33/32
H01L 33/62
H01L 25/075

Abstract:

Transfer elements include an adhesion element having a higher Young's modulus at a lower temperature and a lower Young's modulus at a higher temperature. Heating elements are operable to change an operating temperature of each adhesion element in response to an input. A controller is coupled to provide the inputs to the heating elements to cause a change in temperature at least between the higher and lower temperature. The change in temperature causes the transfer elements to selectably hold objects to and release the objects in response to changes between the higher and lower Young's moduli of transfer elements

US Patent:

20190317769, Oct 17, 2019

Filed:

Apr 11, 2018

Appl. No.:

15/950434

Inventors:

- Plano TX, US
Wei Yu Chen - Fremont CA, US
Michael Chow - Saratoga CA, US
Qian Wang - Santa Clara CA, US
Yongbin Zhou - Beijing, CN
Lixia Yang - Beijing, CN
Ning Yang - Beijing, CN

Assignee:

Futurewei Technologies, Inc. - Plano TX

International Classification:

G06F 9/38

Abstract:

Branch prediction techniques are described that can improve the performance of pipelined microprocessors. A microprocessor with a hierarchical branch prediction structure is presented. The hierarchy of branch predictors includes: a multi-cycle predictor that provides very accurate branch predictions, but with a latency of multiple cycles; a small and simple branch predictor that can provide branch predictions for a sub-set of instructions with zero-cycle latency; and a fast, intermediate level branch predictor that provides relatively accurate branch prediction, while still having a low, but non-zero instruction prediction latency of only one cycle, for example. To improve operation, the higher accuracy, higher latency branch direction predictor and the fast, lower latency branch direction predictor can share a common target predictor.

US Patent:

20190311872, Oct 10, 2019

Filed:

Jun 6, 2019

Appl. No.:

16/433603

Inventors:

- Palo Alto CA, US
Scott J. Limb - Palo Alto CA, US
Christopher L. Chua - San Jose CA, US
Sean Garner - Burlingame CA, US
Sylvia J. Smullin - Menlo Park CA, US
Qian Wang - Mountain View CA, US
Rene A. Lujan - Sunnyvale CA, US

International Classification:

H01H 85/00
H03K 19/177
H01L 23/00

Abstract:

A transient electronic device includes electronic elements (e.g., an SOI- or chip-based IC) and a trigger mechanism disposed on a frangible glass substrate. The trigger mechanism includes a switch that initiates a large trigger current through a self-limiting resistive element in response to a received trigger signal. The self-limiting resistive element includes a resistor portion that generates heat in response to the trigger current, thereby rapidly increasing the temperature of a localized (small) region of the frangible glass substrate, and a current limiting portion (e.g., a fuse) that self-limits (terminates) the trigger current after a predetermined amount of time, causing the localized region to rapidly cool down. The frangible glass substrate is engineered such that a stress profile produced by the rapid heating/cooling of the localized region generates an initial fracture force that subsequently propagates throughout the glass substrate, whereby sufficient potential energy is released to powderize the electronic elements.

US Patent:

20190172800, Jun 6, 2019

Filed:

Jan 25, 2019

Appl. No.:

16/257304

Inventors:

- Palo Alto CA, US
JengPing Lu - Fremont CA, US
Gregory Whiting - Menlo Park CA, US
Scott J. Limb - Palo Alto CA, US
Rene A. Lujan - Sunnyvale CA, US
Qian Wang - Mountain View CA, US

International Classification:

H01L 23/00
H01L 31/20
H01L 23/34
H01L 23/64
H03K 19/177
H01L 23/525
H01L 23/15

Abstract:

A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.