Russell Duane Swanson

US Patent:

56919077, Nov 25, 1997

Filed:

Apr 18, 1995

Appl. No.:

8/425017

Inventors:

Edwin W. Resler - San Jose CA
Vincent L. Tong - Fremont CA
Russell C. Swanson - San Martin CA
W. Scott Bogden - San Martin CA

Assignee:

Xilinx Inc. - San Jose CA

International Classification:

G06F 1900

US Classification:

36446828

Abstract:

A method in accordance with the present invention includes programming a plurality of semiconductor devices simultaneously, thereby dramatically increasing the number of devices programmed within a predetermined time. In one embodiment, this method includes arranging a first plurality of semiconductor devices into an array configuration. The first array is then programmed while a second plurality of semiconductor devices is arranged into the array configuration. The second array is then programmed, while the first array is unloaded and a third plurality of semiconductor devices is arranged into the array configuration. The present invention further includes the step of moving the first plurality of semiconductor devices in the array configuration to a programming position and the step of transferring the first plurality of semiconductor devices to an unloading position. The steps of moving or transferring includes providing a vacuum, mechanical pick-up, or magnetic pick-up for moving the semiconductor devices. In one embodiment, the step of loading is performed by a first arm capable of three dimensional movement, and the step of unloading is performed by a second arm capable of three dimensional movement independent of the first arm.

US Patent:

54661170, Nov 14, 1995

Filed:

Jun 10, 1993

Appl. No.:

8/074190

Inventors:

Edwin W. Resler - San Jose CA
Vincent L. Tong - Fremont CA
Russell C. Swanson - San Martin CA
W. Scott Bogden - San Martin CA

Assignee:

Xilinx, Inc. - San Jose CA

International Classification:

B65G 118

US Classification:

414799

Abstract:

A method in accordance with the present invention includes programming a plurality of semiconductor devices simultaneously, thereby dramatically increasing the number of devices programmed within a predetermined time. In one embodiment, this method includes arranging a first plurality of semiconductor devices into an array configuration. The first array is then programmed while a second plurality of semiconductor devices is arranged into the array configuration. The second array is then programmed, while the first array is unloaded and a third plurality of semiconductor devices is arranged into the array configuration. The present invention further includes the step of moving the first plurality of semiconductor devices in the array configuration to a programming position and the step of transferring the first plurality of semiconductor devices to an unloading position. The steps of moving or transferring includes providing a vacuum, mechanical pick-up, or magnetic pick-up for moving the semiconductor devices. In one embodiment, the step of loading is performed by a first arm capable of three dimensional movement, and the step of unloading is performed by a second arm capable of three dimensional movement independent of the first arm.