Song O Hong

US Patent:

8325642, Dec 4, 2012

Filed:

May 14, 2009

Appl. No.:

12/466056

Inventors:

James F. McHenry - Pt. Pleasant PA, US
Song Ki Hong - San Francisco CA, US

Assignee:

Cellco Partnership - Basking Ridge NJ

International Classification:

H04B 7/00

US Classification:

370312, 370310, 370328, 370343, 370349, 370465

Abstract:

An application service utilizes a single short code for messaging service through a mobile network, even though the one service is actually supported by multiple servers or the like, typically operated by different service providers. In the examples, a third party application service type platform is associated with the common short code of the application service. The third party platform performs intelligent routing/address changes to re-direct mobile station originated messages among the equipment of the service providers. The platform may also provide short code translations of source addresses, during processing of messages directed to mobile stations from the various application servers.

US Patent:

20130090139, Apr 11, 2013

Filed:

Dec 3, 2012

Appl. No.:

13/692746

Inventors:

Song Ki HONG - San Francisco CA, US

Assignee:

CELLCO PARTNERSHIP D/B/A VERIZON WIRELESS - Basking Ridge NJ

International Classification:

H04W 4/12
H04W 4/14

US Classification:

455466

Abstract:

An application service utilizes a single short code for messaging service through a mobile network, even though the one service is actually supported by multiple servers or the like, typically operated by different service providers. In the examples, a third party application service type platform is associated with the common short code of the application service. The third party platform performs intelligent routing/address changes to re-direct mobile station originated messages among the equipment of the service providers. The platform may also provide short code translations of source addresses, during processing of messages directed to mobile stations from the various application servers.

US Patent:

20130189845, Jul 25, 2013

Filed:

Jan 19, 2012

Appl. No.:

13/354129

Inventors:

Sungjin Kim - Palo Alto CA, US
Deenesh Padhi - Sunnyvale CA, US
Song Hyun Hong - Fremont CA, US
Bok Hoen Kim - San Jose CA, US
Derek R. Witty - Fremont CA, US

Assignee:

APPLIED MATERIALS, INC. - Santa Clara CA

International Classification:

H01L 21/311

US Classification:

438696, 257E21256

Abstract:

A method of forming a nitrogen-doped amorphous carbon layer on a substrate in a processing chamber is provided. The method generally includes depositing a predetermined thickness of a sacrificial dielectric layer over a substrate, forming patterned features on the substrate by removing portions of the sacrificial dielectric layer to expose an upper surface of the substrate, depositing conformally a predetermined thickness of a nitrogen-doped amorphous carbon layer on the patterned features and the exposed upper surface of the substrate, selectively removing the nitrogen-doped amorphous carbon layer from an upper surface of the patterned features and the upper surface of the substrate using an anisotropic etching process to provide the patterned features filled within sidewall spacers formed from the nitrogen-doped amorphous carbon layer, and removing the patterned features from the substrate.