Wei Li

US Patent:

7420001, Sep 2, 2008

Filed:

Dec 1, 2004

Appl. No.:

11/001589

Inventors:

Jeremy Ian Levin - New City NY, US
Frank Lovering - Acton MA, US
Yonghan Hu - Burlington MA, US
Jianchang Li - Carlisle MA, US
Wei Li - Acton MA, US
Jun Jun Wu - Arlington MA, US
Rajeev Hotchandani - Somerville MA, US
Jason Shaoyun Xiang - Winchester MA, US
Xuemei Du - Valley Cottage NY, US
Derek Cecil Cole - New City NY, US
Steve Yikkai Tam - Wellesley MA, US

Assignee:

Wyeth - Madison NJ

International Classification:

A61K 31/343
C07D 307/81

US Classification:

514469, 514470, 549466, 549467

Abstract:

The present invention relates to biaryl sulfonamides and their use as, for example, metalloproteinase inhibitors.

US Patent:

7571301, Aug 4, 2009

Filed:

Mar 31, 2006

Appl. No.:

11/395841

Inventors:

Arun Kejariwal - Irvine CA, US
Hideki Saito - Sunnyvale CA, US
Xinmin Tian - Union City CA, US
Milind Girkar - Sunnyvale CA, US
Sanjiv Shah - Champaign IL, US
Wei Li - Redwood City CA, US
Utpal Banerjee - Fremont CA, US

Assignee:

Intel Corporation - Santa Clara CA

International Classification:

G06F 9/45
G06F 9/52

US Classification:

712215, 717150

Abstract:

A method for improving parallel processing of computer programs. DOACROSS loops and similar code are identified and parallelized using a post-wait control structure. The post-wait control structure may be implemented to include any one of a single counter to enforce an order of execution, an array to track code completion that is indexed by a modulus of a positive integer number, and/or a set of arrays to track a last code completed by a thread and a current code being executed by a thread.

US Patent:

7629797, Dec 8, 2009

Filed:

Apr 5, 2007

Appl. No.:

11/697060

Inventors:

Yu-Chong Tai - Pasadena CA, US
Chi-yuan Shih - Pasadena CA, US
Wei Li - Monterey Park CA, US
Siyang Zheng - Pasadena CA, US

Assignee:

California Institute of Technology - Pasadena CA

International Classification:

G01R 27/26

US Classification:

324684, 324686, 324663, 324664

Abstract:

Methods and systems for improving the sensitivity of a variety of conductivity sensing devices, in particular capacitively-coupled contactless conductivity detectors. A parallel inductor is added to the conductivity sensor. The sensor with the parallel inductor is operated at a resonant frequency of the equivalent circuit model. At the resonant frequency, parasitic capacitances that are either in series or in parallel with the conductance (and possibly a series resistance) is substantially removed from the equivalent circuit, leaving a purely resistive impedance. An appreciably higher sensor sensitivity results. Experimental verification shows that sensitivity improvements of the order of 10,000-fold are possible. Examples of detecting particulates with high precision by application of the apparatus and methods of operation are described.

US Patent:

8022037, Sep 20, 2011

Filed:

Jan 8, 2008

Appl. No.:

12/522446

Inventors:

Wei Li - Altadena CA, US
Mei Chen - Altadena CA, US
David T. Woodley - Altadena CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

A61K 38/00
A61K 45/00

US Classification:

514 165, 424 852

Abstract:

A wound healing composition comprising an amount of heat shock protein effective to promote wound healing and a method thereof to apply the composition. A preferred heat shock protein is either full-length hsp90α or the middle domain plus the charged sequence of hsp90α. The composition is topically applied to skin wounds, covering the outer surface of the wound. The heat shock protein acts by promoting migration of both human epidermal keratinocyte and dermal fibroblasts to the wound in order to close, heal, and remodel the wound.

US Patent:

8410055, Apr 2, 2013

Filed:

Aug 15, 2011

Appl. No.:

13/210200

Inventors:

Wei Li - Altadena CA, US
Mei Chen - Altadena CA, US
David T. Woodley - Altadena CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

A61K 38/00
A61K 45/00
A61P 43/00

US Classification:

514 186, 514 165, 424 852

Abstract:

A wound healing composition comprising an amount of heat shock protein effective to promote wound healing and a method thereof to apply the composition. A preferred heat shock protein is either full-length hsp90α or the middle domain plus the charged sequence of hsp90α. The composition is topically applied to skin wounds, covering the outer surface of the wound. The heat shock protein acts by promoting migration of both human epidermal keratinocyte and dermal fibroblasts to the wound in order to close, heal, and remodel the wound.

US Patent:

8455443, Jun 4, 2013

Filed:

May 30, 2012

Appl. No.:

13/484162

Inventors:

Wei Li - Altadena CA, US
Mei Chen - Altadena CA, US
David T. Woodley - Altadena CA, US
Chieh-Fang Cheng - Alhambra CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

A61K 38/00
A61K 45/00

US Classification:

514 165, 424 852

Abstract:

A wound healing composition comprising a class of polypeptide compounds having a polypeptide chain with 5 to 120 amino acid units per chain. The composition includes a pharmaceutical medium to carry the polypeptide compound, such as an aqueous solution, suspension, dispersion, salve, ointment, gel, cream, lotion, spray or paste. Additionally, a method of applying a wound healing composition comprising a class of polypeptide compounds having a polypeptide chain with 5 to 120 amino acid units per chain in a concentration of from about 1 μg/ml to about 100 μg/ml for a time sufficient to heal the wound is disclosed.

US Patent:

8207118, Jun 26, 2012

Filed:

Jul 17, 2009

Appl. No.:

12/505361

Inventors:

Wei Li - Altadena CA, US
Mei Chen - Altadena CA, US
David T. Woodley - Altadena CA, US
Chieh-Fang Cheng - Alhambra CA, US

Assignee:

University of Southern California - Los Angeles CA

International Classification:

A61K 38/00
A61K 45/00

US Classification:

514 165, 424 852

Abstract:

A wound healing composition comprising a class of polypeptide compounds having a polypeptide chain with 5 to 120 amino acid units per chain. The composition includes a pharmaceutical medium to carry the polypeptide compound, such as an aqueous solution, suspension, dispersion, salve, ointment, gel, cream, lotion, spray or paste. Additionally, a method of applying a wound healing composition comprising a class of polypeptide compounds having a polypeptide chain with 5 to 120 amino acid units per chain in a concentration of from about 1 μg/ml to about 100 μg/ml for a time sufficient to heal the wound is disclosed.

US Patent:

20030151604, Aug 14, 2003

Filed:

Nov 21, 2002

Appl. No.:

10/301399

Inventors:

Arie Kaufman - Plainview NY, US
Wei Li - Stony Brook NY, US

Assignee:

RESEARCH FOUNDATION OF STATE UNIVERSITY OF NEW YORK

International Classification:

G06T015/00

US Classification:

345/419000

Abstract:

A system and method for texture-based volume rendering accelerated by contouring texture hulls is provided. Bounding geometries, such as rectangles, cuboids, or the like surrounding the non-empty regions as well as the contouring borders of the non-empty regions are found. The bounding shapes are treated as the hulls of the non-empty sub-textures. The nonempty sub-textures are stored and rendered. Texels outside the hulls are skipped.