Xin Zhang

US Patent:

20210279386, Sep 9, 2021

Filed:

Mar 5, 2020

Appl. No.:

16/810687

Inventors:

- Armonk NY, US
Xin Zhang - Chappaqua NY, US
Mo Yu - White Plains NY, US

International Classification:

G06F 30/27
G06F 30/28

Abstract:

A method of using multiple artificial intelligence models for generating a high fidelity simulation includes generating, by a computing device, multiple artificial intelligence models. Each artificial intelligence model simulating an industry design process. The computing device further fusing the multiple artificial intelligence models to generate a best-fit proposed industry design process. The computing device utilizes a physics constraint model to determine whether the best-fit proposed industry design process is feasible. The best-fit proposed industry design process is displayed in response to determining that the best-fit proposed industry design process is feasible.

US Patent:

20210111192, Apr 15, 2021

Filed:

Oct 14, 2019

Appl. No.:

16/600604

Inventors:

- Armonk NY, US
Xin Zhang - Chappaqua NY, US
Todd Edward Takken - Brewster NY, US

International Classification:

H01L 27/12
H01L 21/84
H01L 21/762

Abstract:

The semiconductor structure includes a semiconductor-on-insulator (SOI) substrate. A group III nitride transistor is formed in a trench in the SOI substrate. The activation of the group III nitride transistor is controlled by a silicon-based transistor. The silicon-based transistor that includes a portion of a silicon layer of the SOI substrate. A group III nitride transistor device is adjacent to the silicon-based transistor.

US Patent:

20200167402, May 28, 2020

Filed:

Nov 23, 2018

Appl. No.:

16/198945

Inventors:

- Armonk NY, US
Paul SOLOMON - Westchester NY, US
Xiaodong CUI - Chappaqua NY, US
Jin Ping HAN - Yorktown Heights NY, US
Xin ZHANG - Yorktown Heights NY, US

Assignee:

INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY

International Classification:

G06F 17/10
G06F 9/30
G06F 9/38
G06K 9/62
G06N 3/08

Abstract:

Embodiments for implementing a softmax function in an analog circuit. The analog circuit may comprise a plurality of input nodes to accept voltage inputs; a plurality of diodes connected to each of the plurality of input nodes to perform a current adding function; a log amplifier coupled to the plurality of diodes; a plurality of analog adders coupled to the voltage inputs and an output of the log amplifier; and a plurality of exponential amplifiers, each of the plurality of exponential amplifiers coupled to one of the plurality of analog adders.