Celestix Networks
Chief Executive Officer
Celestix Networks Aug 2004 - Jul 2012
Chief Operations Officer
Celestix Networks Aug 2004 - Jul 2012
Director
Celestix Networks Aug 2004 - Jul 2012
Chairman
Celestix Networks Jan 2001 - Aug 2004
Founder
Education:
University of Oregon - Charles H. Lundquist College of Business 1985 - 1988
Bachelors, Bachelor of Science, Finance
National Junior College 1980 - 1982
University of Oregon
Skills:
Business Development Go To Market Strategy Start Ups Solution Selling Strategic Partnerships Enterprise Software Saas Channel Partners Channel New Business Development Network Security Professional Services Sales Management Strategic Planning Marketing Strategy Business Alliances Managed Services Software As A Service
Yong S Lin MD 217 Grand St STE 301, New York, NY 10013 2122269717 (phone), 2122269723 (fax)
Education:
Medical School Southeast Univ Med Coll, Nanjing, Jiangsu, China Graduated: 1984
Procedures:
Electrocardiogram (EKG or ECG) Nutrition Therapy Pulmonary Function Tests Vaccine Administration
Conditions:
Acne Acute Upper Respiratory Tract Infections Atopic Dermatitis Benign Prostatic Hypertrophy Calculus of the Urinary System
Languages:
Chinese English
Description:
Dr. Lin graduated from the Southeast Univ Med Coll, Nanjing, Jiangsu, China in 1984. He works in New York, NY and specializes in Internal Medicine. Dr. Lin is affiliated with New York Presbyterian Lower Manhattan Hospital.
Cedars-Sinai Medical Center Pain Center 444 S San Vicente Blvd STE 1101, Los Angeles, CA 90048 3104239600 (phone), 3104239610 (fax)
Education:
Medical School Sun Yat Sen Univ of Med Sci, Guangzhou, China (242 21 Pr 1/71) Graduated: 1982
Languages:
English
Description:
Dr. Lin graduated from the Sun Yat Sen Univ of Med Sci, Guangzhou, China (242 21 Pr 1/71) in 1982. He works in Los Angeles, CA and specializes in Anesthesiology. Dr. Lin is affiliated with Cedars-Sinai Medical Center.
- Campbell CA, US Yimin CHEN - Campbell CA, US David NGUYEN - Campbell CA, US Juyoung YOON - Campbell CA, US Tao LI - Campbell CA, US Guang FENG - Campbell CA, US Kai-Wen CHIN - Campbell CA, US Yong Xiong LIN - Campbell CA, US Jianming YAO - Campbell CA, US
A flyback converter is provided that detects a load-transient-produced increase in the output current to more quickly detect and respond to the load transient.
A device comprises a substrate) of a first material with a surface, which is modified by depositing a bi-layer nanoparticle film. The film includes a nanoparticle layer of a second material on top of and in contact with surface, and a nanoparticle layer of a third material on top of and in contact with the nanoparticle layer of the second material. The nanoparticles of the third material adhere to the nanoparticles of the second material. The substrate region adjoining surface comprises an admixture of the second material in the first material. A fourth material contacts and chemically/mechanically bonds to the nanoparticle layer of the third material.
Packaged Device With Additive Substrate Surface Modification
- Dallas TX, US Juan Alejandro Herbsommer - Allen TX, US Yong Lin - Plano TX, US Rongwei Zhang - Plano TX, US Abram Castro - Carrollton TX, US Matthew David Romig - Wylie TX, US
International Classification:
H01L 23/495 H01L 25/00 H01L 21/48 H01L 25/065
Abstract:
A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.
Packaged Device With Additive Substrate Surface Modification
- Dallas TX, US JUAN ALEJANDRO HERBSOMMER - ALLEN TX, US YONG LIN - PLANO TX, US RONGWEI ZHANG - DALLAS TX, US ABRAM CASTRO - FORT WORTH TX, US MATTHEW DAVID ROMIG - WYLIE TX, US
A method of lead frame surface modification includes providing at least one pre-fabricated metal lead frame or package substrate (substrate) unit including a base metal having a die pad and a plurality of contact regions surrounding the die pad. An ink including a material that is a solid or a precursor for a solid that forms a solid upon a curing step or a sintering step that removes a liquid carrier is additively deposited including onto at least one of (i) a region of the die pad and (ii) at one region of at least a first of the contact regions (first contact region). The ink is sintered or cured to remove the liquid carrier so that a substantially solid ink residue remains.
Method An Apparatus For Stopping Resin Bleed And Mold Flash On Integrated Circit Lead Finishes
A method and apparatus of minimizing resin bleed and mold flash on integrated lead finishes by providing groves on the external leads that can control the length of resin bleed.
handran, other investigators include: Christine Ambrosone, Gary Zirpoli, Gregory Ciupak, Susan E. McCann, and Zhihong Gong, Roswell Park Cancer Institute; Karen Pawlish, New Jersey State Cancer Registry; and Yong Lin and Kitaw Demissie, The Cancer Institute of New Jersey and UMDNJ-School of Public Health.