Alan D Buchanan

US Patent:

6987492, Jan 17, 2006

Filed:

Jul 14, 2004

Appl. No.:

10/891900

Inventors:

Alan McLean Buchanan - Sandy UT, US
Pamela Sue Silcox - Toelle UT, US

Assignee:

L-3 Communications Corporation - New York NY

International Classification:

H01Q 3/02

US Classification:

343882, 343766

Abstract:

In accordance with an embodiment of the invention, an antenna assembly is disclosed. The assembly comprises an antenna; and a positioner capable of assuming a tetrahedral shape connected to the antenna and mounted to an antenna mount pedestal. The positioner comprises a substantially flat base portion; and a triangular shaped antenna face bracket rotatably coupled to the base portion. The positioner further comprises an extendable, linear stiffening member connected between the base portion and the triangular shaped antenna face bracket; and an actuator to rotate the triangular shaped face bracket of the antenna assembly and form the positioner in combination with the linear stiffening member, triangular shaped antenna face bracket and base portion.

US Patent:

7564421, Jul 21, 2009

Filed:

Mar 10, 2008

Appl. No.:

12/045574

Inventors:

Richard Gerald Edwards - Salt Lake City UT, US
Rory Kim Sorensen - Salt Lake City UT, US
Alan McLean Buchanan - Salt Lake City UT, US

International Classification:

H01Q 13/00

US Classification:

343776, 343778, 333137

Abstract:

A compact waveguide antenna array feed system provides antenna element ports spaced along an array face by less than one free-space wavelength in at least one dimension, while retaining a thickness in a direction perpendicular to the array face of less than one and one-half free-space wavelength.

US Patent:

49634259, Oct 16, 1990

Filed:

Mar 5, 1985

Appl. No.:

6/708588

Inventors:

Alan M. Buchanan - Midvale UT
Jay S. Abramowitz - Salt Lake City UT

Assignee:

Unisys Corporation - Blue Bell PA

International Classification:

H05K 103
B32B 702

US Classification:

428212

Abstract:

A laminated printed wiring board having surfaces thereof fabricated from conventional fiber reinforced laminates which are secured together by means of an adhesive fabricated of a reinforced thermosetting resin having a coefficient of thermal expansion (CTE) which is substantially smaller than the CTE of the surface laminate whereby the apparent CTE of the overall printed wiring board assembly is substantially controlled.