Amrit Amrit Panda

US Patent:

7920042, Apr 5, 2011

Filed:

Sep 10, 2007

Appl. No.:

11/852688

Inventors:

Ashraf W. Lotfi - Bridgewater NJ, US
Trifon M. Liakopoulos - Bridgewater NJ, US
Robert W. Filas - Basking Ridge NJ, US
Amrit Panda - San Jose CA, US

Assignee:

Enpirion, Inc. - Hampton NJ

International Classification:

H01F 5/00

US Classification:

336200

Abstract:

A micromagnetic device includes a first insulating layer formed above a substrate, a first seed layer formed above the first insulating layer, a first conductive winding layer selectively formed above the first seed layer, and a second insulating layer formed above the first conductive winding layer. The micromagnetic device also includes a first magnetic core layer formed above the second insulating layer, a third insulating layer formed above the first magnetic core layer, and a second magnetic core layer formed above the third insulating layer. The micromagnetic device still further includes a fourth insulating layer formed above the second magnetic core layer, a second seed layer formed above the fourth insulating layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device.

US Patent:

7955868, Jun 7, 2011

Filed:

Sep 10, 2007

Appl. No.:

11/852689

Inventors:

Ashraf W. Lotfi - Bridgewater NJ, US
Trifon M. Liakopoulos - Bridgewater NJ, US
Robert W. Filas - Basking Ridge NJ, US
Amrit Panda - San Jose CA, US

Assignee:

Enpirion, Inc. - Hampton NJ

International Classification:

H01L 21/00

US Classification:

438 3, 438238, 438763, 257528, 257E43006, 336200

Abstract:

A method of forming a micromagnetic device on a substrate including forming a first insulating layer above the substrate, a first seed layer above the first insulating layer, a first conductive winding layer above the first seed layer, and a second insulating layer above the first conductive winding layer. The method also includes forming a first magnetic core layer above the second insulating layer, a third insulating layer above the first magnetic core layer, and a second magnetic core layer above the third insulating layer. The method still further includes forming a fourth insulating layer above the second magnetic core layer, a second seed layer above the fourth insulating layer, and a second conductive winding layer above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device.

US Patent:

8339232, Dec 25, 2012

Filed:

Mar 30, 2011

Appl. No.:

13/076034

Inventors:

Ashraf W. Lotfi - Bridgewater NJ, US
Trifon M. Liakopoulos - Bridgewater NJ, US
Robert W. Filas - Basking Ridge NJ, US
Amrit Panda - San Jose CA, US

Assignee:

Enpirion, Inc. - Hampton NJ

International Classification:

H01F 5/00

US Classification:

336200

Abstract:

A micromagnetic device includes a first insulating layer formed above a substrate, a first seed layer formed above the first insulating layer, a first conductive winding layer selectively formed above the first seed layer, and a second insulating layer formed above the first conductive winding layer. The micromagnetic device also includes a first magnetic core layer formed above the second insulating layer, a third insulating layer formed above the first magnetic core layer, and a second magnetic core layer formed above the third insulating layer. The micromagnetic device still further includes a fourth insulating layer formed above the second magnetic core layer, a second seed layer formed above the fourth insulating layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device.

US Patent:

8618900, Dec 31, 2013

Filed:

Dec 20, 2012

Appl. No.:

13/722797

Inventors:

Trifon M. Liakopoulos - Bridgewater NJ, US
Robert W. Filas - RD2 Basking Ridge NJ, US
Amrit Panda - San Jose CA, US

Assignee:

Enpirion, Inc. - Hampton NJ

International Classification:

H01F 5/00

US Classification:

336200

Abstract:

A micromagnetic device includes a first insulating layer formed above a substrate, a first seed layer formed above the first insulating layer, a first conductive winding layer selectively formed above the first seed layer, and a second insulating layer formed above the first conductive winding layer. The micromagnetic device also includes a first magnetic core layer formed above the second insulating layer, a third insulating layer formed above the first magnetic core layer, and a second magnetic core layer formed above the third insulating layer. The micromagnetic device still further includes a fourth insulating layer formed above the second magnetic core layer, a second seed layer formed above the fourth insulating layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device.

US Patent:

20090065363, Mar 12, 2009

Filed:

Sep 10, 2007

Appl. No.:

11/852707

Inventors:

Trifon M. Liakopoulos - Bridgewater NJ, US
Robert W. Filas - Basking Ridge NJ, US
Amrit Panda - San Jose CA, US

International Classification:

C25D 5/00
C25D 17/00
C25D 21/10

US Classification:

205 89, 204273

Abstract:

An electroplating cell employable with an electroplating tool and method of operating the same. In one embodiment, the electroplating cell includes a cover configured to substantially seal the electroplating cell to an outside atmosphere during an electroplating process, and a porous tube couplable to an inert gas source configured to bubble an inert gas through an electrolyte containable therein. The electroplating cell also includes an anode, encased in an envelope of a semipermeable membrane, formed with an alloy of electroplating material, and a magnet configured to orient an axis of magnetization of the electroplating material for application to a wafer couplable thereto during an electroplating process.

US Patent:

20090066300, Mar 12, 2009

Filed:

Sep 10, 2007

Appl. No.:

11/852692

Inventors:

Ashraf W. Lotfi - Bridgewater NJ, US
Trifon M. Liakopoulos - Bridgewater NJ, US
Robert W. Filas - Basking Ridge NJ, US
Amrit Panda - San Jose CA, US

International Classification:

G05F 1/12
G05F 1/10

US Classification:

323247, 323282, 336200

Abstract:

A power converter including a power train, a controller and a driver. In one embodiment, the power train includes a switch that conducts for a duty cycle and provides a regulated output characteristic for the power converter, and a micromagnetic device. The micromagnetic device includes a first conductive winding layer selectively formed above a first seed layer, and first and second magnetic core layers formed thereabove. The micromagnetic device also includes a second seed layer formed above the second magnetic core layer, and a second conductive winding layer formed above the second seed layer and in vias to the first conductive winding layer. The first and second conductive winding layers form a winding for the micromagnetic device. The controller provides a signal to control the duty cycle of the switch, and the driver provides a drive signal to the switch as a function of the signal from the controller.

US Patent:

20210144861, May 13, 2021

Filed:

Jan 20, 2021

Appl. No.:

17/152804

Inventors:

- Lisle IL, US
Victor ZADEREJ - Wheaton IL, US
Amrit PANDA - Naperville IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H05K 3/18
H05K 3/20
H05K 1/03
H05K 1/09
H05K 1/18
H05K 3/10

Abstract:

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel () manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.

US Patent:

20200352032, Nov 5, 2020

Filed:

May 22, 2020

Appl. No.:

16/881017

Inventors:

- Lisle IL, US
Victor ZADEREJ - Wheaton IL, US
Amrit PANDA - Naperville IL, US

Assignee:

Molex, LLC - Lisle IL

International Classification:

H05K 3/18
H05K 3/20
H05K 1/03
H05K 1/09
H05K 1/18
H05K 3/10

Abstract:

Depicted embodiments are directed to an Application Specific Electronics Packaging (“ASEP”) system, which enables the manufacture of additional products using reel to reel (68, 68) manufacturing processes as opposed to the “batch” processes used to currently manufacture electronic products and MIDs. Through certain ASEP embodiments, it is possible to integrate connectors, sensors, LEDs, thermal management, antennas, RFID devices, microprocessors, memory, impedance control, and multi-layer functionality directly into a product.