Anand Janaswamy

US Patent:

20110240337, Oct 6, 2011

Filed:

Apr 5, 2010

Appl. No.:

12/754588

Inventors:

John Montello - El Cajon CA, US
Mark Farrelly - Carlsbad CA, US
Anand Janaswamy - Cardiff CA, US
Mike Curtis - Temecula CA, US

International Classification:

H01B 5/00
H01L 31/048

US Classification:

1741261, 136251

Abstract:

Various embodiments of the invention provide an interconnect designed to be placed between layers of a photovoltaic laminate, and that has built-in in-plane stress relief features. In accordance with various embodiments, the interconnect, once implemented into a photovoltaic laminate, can withstand at least 200 temperature cycles, as is required by certain certifying bodies, without suffering failure. According to one embodiment of the present invention, an interconnect is provided for connecting a first photovoltaic cell to the bus array or a second photovoltaic cell within a photovoltaic laminate, the interconnect comprising: a single conductive wire having a cross-section sufficient for placement between layers of a photovoltaic laminate; wherein the single conductive wire comprises a stress-relief feature, and the stress-relief feature enables the interconnect to maintain a connection between the first photovoltaic cell and the bus array or the second photovoltaic cell while absorbing stress induced by a change in position of the first photovoltaic cell relative to a position of the bus array or the second photovoltaic cell.

US Patent:

20120080078, Apr 5, 2012

Filed:

Oct 2, 2010

Appl. No.:

12/896843

Inventors:

Mark Farrelly - Carlsbad CA, US
Anand Janaswamy - Cardiff CA, US
Shewit Agaskar - San Diego CA, US
John Montello - San Diego CA, US

Assignee:

APPLIED SOLAR, LLC - San Diego CA

International Classification:

H01L 31/048
H01L 31/02

US Classification:

136251, 438 66, 257E31113

Abstract:

Photovoltaic (PV) crystalline silicon modules and methods of manufacturing wherein the modules contain a non-glass front sheet, upper and lower encapsulate layers, a PV cell layer, an insulating sheet, and a structural back plane comprising an aluminum composite. The front sheet can be comprised of ETFE, the encapsulate layers comprise EVA, and the back plane preferably comprises APA. This particular configuration results in a lightweight PV module that still retains a high power density, and can be readily installed onto rooftops without traditional heavy racking. The PV module may be adhered to the roof using a double sided pressure sensitive adhesive or heat welded.