Andrew H Holman

US Patent:

7477194, Jan 13, 2009

Filed:

Dec 5, 2005

Appl. No.:

11/294039

Inventors:

James P. Coleman - Maryland Heights MO, US
Scott Wayne Ferguson - Arcadia CA, US
Jaime C. Grunlan - Pasadena CA, US
Ian J. Forster - Chelmsford, GB
Andrew W. Holman - West Hills CA, US
Peikang Liu - Claremont CA, US

Assignee:

Avery Dennison Corporation - Pasadena CA

International Classification:

H01Q 1/38

US Classification:

343700MS, 343895

Abstract:

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

US Patent:

20040200061, Oct 14, 2004

Filed:

Apr 11, 2003

Appl. No.:

10/412794

Inventors:

James Coleman - Maryland Heights MO, US
Ian Forster - Chelmsford, GB
Scott Ferguson - Arcadia CA, US
Jaime Grunlan - Pasadena CA, US
Andrew Holman - West Hills CA, US
Peikang Liu - Claremont CA, US

International Classification:

H01R043/00

US Classification:

029/825000, 029/601000, 340/572100

Abstract:

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.

US Patent:

20060283005, Dec 21, 2006

Filed:

Aug 25, 2006

Appl. No.:

11/509862

Inventors:

James Coleman - Maryland Heights MO, US
Scott Ferguson - Arcadia CA, US
Jaime Grunlan - Pasadena CA, US
Ian Forster - Chelmsford, GB
Andrew Holman - West Hills CA, US
Peikang Liu - Claremont CA, US

International Classification:

B05D 5/12
B32B 37/00
H01P 11/00

US Classification:

029600000, 427079000, 029825000, 029846000, 156277000, 156256000, 343868000, 343895000

Abstract:

A method of forming an electrically-conductive pattern includes selectively electroplating the top portions of a substrate that corresponds to the pattern, and separating the conductive pattern from the substrate. The electroplating may also include electrically connecting the conductive pattern to an electrical component. Conductive ink, such as ink including carbon particles, may be selectively placed on the conductive substrate to facilitate plating of the desired pattern and/or to facilitate separation of the pattern from the substrate. An example of a conductive pattern is an antenna for a radio-frequency identification (RFID) device such as a label or a tag. One example of an electrical component that may be electrically connected to the antenna, is an RFID strap or chip.